Patents by Inventor JUN XIAN YONG

JUN XIAN YONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal shell configuration for an electrical connector
    Patent number: 8435075
    Abstract: An electrical connector comprises a dielectric body, a plurality of terminals, and a metal shell. The dielectric body includes a base and a tongue. The tongue extends forward from the base and supports the plurality of terminals. The metal shell is integrally formed around the dielectric body, and can be formed by bending a metal plate, and includes a top wall, a bottom wall opposite to the top wall, a first side wall, and a second side wall, the four walls defining a rectangular opening. The first side wall includes a lower wall portion and an upper wall portion, both of which are joined at a seam on the first side wall. The lower wall portion has a lower solder leg and the upper wall portion has an upper solder leg and the lower and upper solder legs can be soldered to the circuit board.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: May 7, 2013
    Assignee: Molex Incorporated
    Inventors: Kian Heng Lim, Jun Xian Yong
  • ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR ASSEMBLY
    Publication number: 20110130019
    Abstract: An electrical connector comprises a dielectric body, a plurality of terminals, and a metal shell. The dielectric body includes a base and a tongue. The tongue extends forward from the base and supports the plurality of terminals. The metal shell is integrally formed around the dielectric body, and can be formed by bending a metal plate, and includes a top wall, a bottom wall opposite to the top wall, a first side wall, and a second side wall, the four walls defining a rectangular opening. The first side wall includes a lower wall portion and an upper wall portion, both of which are joined at a seam on the first side wall. The lower wall portion has a lower solder leg and the upper wall portion has an upper solder leg and the lower and upper solder legs can be soldered to the circuit board.
    Type: Application
    Filed: November 30, 2010
    Publication date: June 2, 2011
    Applicant: MOLEX INCORPORATED
    Inventors: KIAN HENG LIM, JUN XIAN YONG