Patents by Inventor Jun-Yen Huang

Jun-Yen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8847836
    Abstract: An antenna structure comprises a substrate, a first antenna unit and a second antenna unit. The substrate comprises a first surface and a second surface opposing the first surface. The first antenna unit is disposed on the first surface, and comprises at least a first slot with a wider inside and narrower outside at the edge of the first antenna unit. The second antenna unit is disposed on the second surface, and is connected to the first antenna unit through a hole in the substrate. The radius of the at least one first slot is one-fourth the wavelength of the central frequency of the antenna structure.
    Type: Grant
    Filed: May 11, 2011
    Date of Patent: September 30, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Ya Chung Yu, Chin Chung Nien, Jenn Hwan Tarng, Jun Yen Huang, Chen Ming Li, Li Yuan Chang
  • Publication number: 20120139805
    Abstract: An antenna structure comprises a substrate, a first antenna unit and a second antenna unit. The substrate comprises a first surface and a second surface opposing the first surface. The first antenna unit is disposed on the first surface, and comprises at least a first slot with a wider inside and narrower outside at the edge of the first antenna unit. The second antenna unit is disposed on the second surface, and is connected to the first antenna unit through a hole in the substrate. The radius of the at least one first slot is one-fourth the wavelength of the central frequency of the antenna structure.
    Type: Application
    Filed: May 11, 2011
    Publication date: June 7, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ya Chung YU, Chin Chung Nien, Jenn Hwan Tarng, Jun Yen Huang, Chen Ming Li, Li Yuan Chang
  • Patent number: 8102296
    Abstract: An exemplary example of the present disclosure proposes an electromagnetic conductor reflecting plate including a perfect electronic conductor and at least two artificial magnetic conductors, wherein the each of the artificial magnetic conductor is disposed on arbitrary one side of the perfect electronic conductor, and a boundary between the perfect electronic conductor and each of the artificial magnetic conductor forms a virtual radiation unit. In addition, an exemplary example of the present disclosure further proposes an antenna array including an antenna and the electromagnetic conductor reflecting plate, wherein the antenna is disposed on the electromagnetic conductor reflecting plate.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: January 24, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Jenn-Hwan Tarng, Li-Yuan Chang, Chin-Chung Nien, Ya-Chung Yu, Jun-Yen Huang
  • Publication number: 20110122018
    Abstract: An exemplary example of the present disclosure proposes an electromagnetic conductor reflecting plate including a perfect electronic conductor and at least two artificial magnetic conductors, wherein the each of the artificial magnetic conductor is disposed on arbitrary one side of the perfect electronic conductor, and a boundary between the perfect electronic conductor and each of the artificial magnetic conductor forms a virtual radiation unit. In addition, an exemplary example of the present disclosure further proposes an antenna array including an antenna and the electromagnetic conductor reflecting plate, wherein the antenna is disposed on the electromagnetic conductor reflecting plate.
    Type: Application
    Filed: March 3, 2010
    Publication date: May 26, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jenn-Hwan Tarng, Li-Yuan Chang, Chin-Chung Nien, Ya-Chung Yu, Jun-Yen Huang
  • Patent number: 6069074
    Abstract: A method preventing the arcing effect during contact implantation by employing a conductive shielding film within the contact opening in the fabrication of an integrated circuit is described. A dielectric layer is provided overlying a semiconductor substrate of a wafer. The dielectric layer is etched into to provide a contact opening through the dielectric layer to the semiconductor substrate. A conducting layer is deposited overlying the dielectric layer and within the contact opening. A photoresist mask is formed over the conducting layer having an opening above the contact opening. The wafer is placed in an ion implantation chamber wherein the wafer is held by means of an electrostatic chuck. Ions are implanted into the semiconductor substrate through the conducting layer not covered by the photoresist mask wherein some of the ions are trapped on photoresist mask and wherein the conducting layer conducts the trapped ions throughout the wafer thereby preventing charge damage to the dielectric layer.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: May 30, 2000
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chiang Fu, Jun-Yen Huang, Ming Chu King, Chien-Chen Chen