Abstract: An electronic device may include a stereoscopic display that is configured to display three-dimensional content for a viewer. The stereoscopic display may include a lenticular lens film with lenticular lenses that extend across the length of the display and may be referred to as a lenticular display. The lenticular display may have convex curvature. The lenticular display may include a color filter layer with color filters and an opaque masking layer. The color filter layer may be interposed between the lenticular lens film and an array of display pixels for the display. The color filter layer may mitigate ghost image artifacts and reflections of ambient light. Microlenses may be included between the lenticular lens film and the array of display pixels to improve the efficiency of the display. The display may include a Fresnel lens layer. The lenticular lens film may include lenticular lenses having different shapes.

Abstract: An antenna structure comprises a substrate, a first antenna unit and a second antenna unit. The substrate comprises a first surface and a second surface opposing the first surface. The first antenna unit is disposed on the first surface, and comprises at least a first slot with a wider inside and narrower outside at the edge of the first antenna unit. The second antenna unit is disposed on the second surface, and is connected to the first antenna unit through a hole in the substrate. The radius of the at least one first slot is one-fourth the wavelength of the central frequency of the antenna structure.

Abstract: An antenna structure comprises a substrate, a first antenna unit and a second antenna unit. The substrate comprises a first surface and a second surface opposing the first surface. The first antenna unit is disposed on the first surface, and comprises at least a first slot with a wider inside and narrower outside at the edge of the first antenna unit. The second antenna unit is disposed on the second surface, and is connected to the first antenna unit through a hole in the substrate. The radius of the at least one first slot is one-fourth the wavelength of the central frequency of the antenna structure.

Abstract: An exemplary example of the present disclosure proposes an electromagnetic conductor reflecting plate including a perfect electronic conductor and at least two artificial magnetic conductors, wherein the each of the artificial magnetic conductor is disposed on arbitrary one side of the perfect electronic conductor, and a boundary between the perfect electronic conductor and each of the artificial magnetic conductor forms a virtual radiation unit. In addition, an exemplary example of the present disclosure further proposes an antenna array including an antenna and the electromagnetic conductor reflecting plate, wherein the antenna is disposed on the electromagnetic conductor reflecting plate.

Abstract: An exemplary example of the present disclosure proposes an electromagnetic conductor reflecting plate including a perfect electronic conductor and at least two artificial magnetic conductors, wherein the each of the artificial magnetic conductor is disposed on arbitrary one side of the perfect electronic conductor, and a boundary between the perfect electronic conductor and each of the artificial magnetic conductor forms a virtual radiation unit. In addition, an exemplary example of the present disclosure further proposes an antenna array including an antenna and the electromagnetic conductor reflecting plate, wherein the antenna is disposed on the electromagnetic conductor reflecting plate.

Abstract: A method preventing the arcing effect during contact implantation by employing a conductive shielding film within the contact opening in the fabrication of an integrated circuit is described. A dielectric layer is provided overlying a semiconductor substrate of a wafer. The dielectric layer is etched into to provide a contact opening through the dielectric layer to the semiconductor substrate. A conducting layer is deposited overlying the dielectric layer and within the contact opening. A photoresist mask is formed over the conducting layer having an opening above the contact opening. The wafer is placed in an ion implantation chamber wherein the wafer is held by means of an electrostatic chuck. Ions are implanted into the semiconductor substrate through the conducting layer not covered by the photoresist mask wherein some of the ions are trapped on photoresist mask and wherein the conducting layer conducts the trapped ions throughout the wafer thereby preventing charge damage to the dielectric layer.