Patents by Inventor JunYeong Lee

JunYeong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069563
    Abstract: Provided is a robot device and a method of controlling same. The robot device includes: at least one memory storing at least one instruction; a sensor configured to detect an environment of the robot device and output detection data; and at least one processor configured to execute the at least one instruction to: acquire a map of a space where the robot device is positioned based on the detection data received from the sensor, and a reliability value of each of a plurality of areas of the map, store the map and the reliability value of each of the plurality of areas in the at least one memory, identify at least one area having a reliability value greater than or equal to a critical value, based on the reliability value of each of the plurality of areas, and identify a movement path of the robot device in the space, based on the at least one area.
    Type: Application
    Filed: August 28, 2023
    Publication date: February 29, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soonbeom KWON, Jaeha LEE, Mideum CHOI, Junyeong CHOI
  • Patent number: 11646203
    Abstract: A thin film formation apparatus includes a chamber, a platen disposed within the chamber, a heater configured to heat the platen within the chamber, a gas inlet communicating with an interior of the chamber and configured to supply a reducing gas and inert gas to the interior of the chamber, a target disposed within the chamber and spatially separated from the platen, and a microwave plasma source disposed adjacent to the target. The reducing gas includes at least one of hydrogen (H2) and deuterium (D2).
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: May 9, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Junyeong Lee, Minkyu Park, Insun Yi, Beomseok Kim, Youngseok Kim, Kuntack Lee
  • Publication number: 20210210342
    Abstract: A thin film formation apparatus includes a chamber, a platen disposed within the chamber, a heater configured to heat the platen within the chamber, a gas inlet communicating with an interior of the chamber and configured to supply a reducing gas and inert gas to the interior of the chamber, a target disposed within the chamber and spatially separated from the platen, and a microwave plasma source disposed adjacent to the target.
    Type: Application
    Filed: July 10, 2020
    Publication date: July 8, 2021
    Inventors: JUNYEONG LEE, MINKYU PARK, INSUN YI, BEOMSEOK KIM, YOUNGSEOK KIM, KUNTACK LEE
  • Patent number: 10607832
    Abstract: Disclosed are method and apparatus for forming a thin layer. The method for forming the thin layer comprises providing a substrate including patterns, forming a bonding layer on the substrate covering an inner surface of a gap between the patterns, forming a preliminary layer on the bonding layer filling the gap; and thermally treating the preliminary layer to form the thin layer. The bonding layer is a self-assembled monomer layer formed using an organosilane monomer. The preliminary layer is formed from a flowable composition comprising polysilane.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Junyeong Lee, Soonwook Jung, Bongjin Kuh, Pyung Moon, Sukjin Chung
  • Publication number: 20190221424
    Abstract: Disclosed are method and apparatus for forming a thin layer. The method for forming the thin layer comprises providing a substrate including patterns, forming a bonding layer on the substrate covering an inner surface of a gap between the patterns, forming a preliminary layer on the bonding layer filling the gap; and thermally treating the preliminary layer to form the thin layer. The bonding layer is a self-assembled monomer layer formed using an organosilane monomer. The preliminary layer is formed from a flowable composition comprising polysilane.
    Type: Application
    Filed: October 19, 2018
    Publication date: July 18, 2019
    Inventors: Junyeong Lee, SOONWOOK JUNG, BONGJIN KUH, PYUNG MOON, SUKJIN CHUNG
  • Patent number: 8615149
    Abstract: Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: December 24, 2013
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Do Won Kim, Gyungock Kim, JunYeong Lee
  • Publication number: 20120121218
    Abstract: Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.
    Type: Application
    Filed: July 25, 2011
    Publication date: May 17, 2012
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Do Won Kim, Gyungock Kim, JunYeong Lee