Abstract: A structure of a packaging module includes a top substrate, a bottom substrate, a first component, at least one interposer, and a first molding compound. The top substrate has a first side. The bottom substrate has a second side facing the first side of the top substrate. The first component is disposed on the first side of the top substrate or the second side of the bottom substrate. At least one interposer connects to the first side of the top substrate and the second side of the bottom substrate and surrounds the first component to form a first cavity between the top substrate and the bottom substrate. The first molding compound is injected into the first cavity to cover the first and other components.

Abstract: A package assembly for divided electromagnetic shielding includes a substrate, pad groups, chips, a first colloid, an electromagnetic shielding layer, and a second colloid. The pad groups on the substrate are separate and electrically connected to the substrate. Chips are soldered on the pad groups, and each chip corresponds to one pad group. The first colloid covers the chips as a seal, the electromagnetic shielding layer being electroplated onto the outer layer of the first colloid. The second colloid is injected on an outer layer of the electromagnetic shielding layer to cover the electromagnetic shielding layer and form a package assembly. The package assembly can be cut into separate products. A method of manufacturing the package assembly is also provided.

Abstract: A method of manufacturing anti-EMI shielding package includes manufacturing a substrate having a grounding terminal and a first through hole with a conductive film coated on electricity connected to a grounding terminal, mounting a component on the substrate and defining a second through hole coated with a conductive film electricity connected to the first through hole, encapsulating the component with a glue-injection layer, defining a notch in the glue-injection in communication with the second through hole, forming a shielding metal layer on an outer surface of the glue-injection layer, and the shielding metal layer fills up the notch and is electricity connected to the second through hole. A method of manufacturing anti-EMI shielding package provides a simple and reliable shielding package formed with less material and low cost.

Abstract: A wave filter package and a method for manufacturing wave filter packages are presented. The wave filter package includes a chip, a substrate, and a sealed wall, the sealed wall being set up between the chip and the substrate so as to form a sealed chamber. The distance between the substrate and the chip is minimized, so that the height of the sealed wall can be decreased, thereby reducing the size of a wave filter package.

Abstract: An anti-EMI shielding package includes a substrate, a component disposed on the substrate, a glue-injection layer, and a shielding metal layer covering the outer surface of the glue-injection layer. A grounding terminal is positioned on an outer side of the substrate. The substrate defines a first through hole, the component defines a second through hole, and a conductive layer is coated on the inner wall of the first through hole and the second through hole. The shielding metal layer, the conductive layer of the second through hole, the conductive layer of the first through hole, and the grounding terminal are connected and form a conductive loop, the shielding metal layer being grounded. A method of making same provides a simple and reliable shielding package formed with less material and low cost.

Abstract: A wave filter package and a method for manufacturing wave filter packages are presented. The wave filter package includes a chip, a substrate, and a sealed wall, the sealed wall being set up between the chip and the substrate so as to form a sealed chamber. The distance between the substrate and the chip is minimized, so that the height of the sealed wall can be decreased, thereby reducing the size of a wave filter package.

Abstract: A fabrication method of manufacturing a package a plurality of electronic components in an encapsulation body, firstly, mounting the plurality of electronic components and one ends of a plurality of metal resilient units on a substrate. After that, the plurality of electronic components and the plurality of metal resilient units are encapsulated on the substrate to form an encapsulation body with another ends of the plurality of metal resilient units exposed on an exterior surface of the encapsulation body. Then etching remaining epoxy resin on the other ends of the plurality of metal resilient units.

Abstract: A fabrication method of manufacturing a package a plurality of electronic components in an encapsulation body, firstly, mounting the plurality of electronic components and one ends of a plurality of metal resilient units on a substrate. After that, the plurality of electronic components and the plurality of metal resilient units are encapsulated on the substrate to form an encapsulation body with another ends of the plurality of metal resilient units exposed on an exterior surface of the encapsulation body. Then etching remaining epoxy resin on the other ends of the plurality of metal resilient units.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: A molding device for a semiconductor chip package includes a first molding die, a second molding die opposite to the first molding die and a plurality of pistons. The second molding die defines a plurality of cylinders for receiving the corresponding pistons. The first molding die and the second molding die collectively form a molding cavity to accommodate a substrate. The first molding die includes a protruding portion defining a groove opening towards the second molding die. The protruding portion and the second molding die collectively form an entrance and an exit on two sides of the groove. Each of the plurality of pistons is compressed to force a molding compound flowing through the entrance, the groove and the exit to fill into the molding cavity so as to encapsulate the substrate.

Abstract: A multi-layer ceramic electronic component includes a ceramic base, a pair of exterior electrodes located on two ends of the ceramic base, respectively, an inner electrode embedded in the ceramic base, and a solder blocking layer located between the pair of the exterior electrodes and projecting from an exterior surface of the ceramic base.

Abstract: An exemplary electronic package structure includes a substrate configured with a solder pad, a metal support element, an electronic component connected to the solder pad, and an encapsulation body. The metal support element is located between the solder pad and the electronic component. As a result, a gap is defined between the substrate and the electronic component. A height of the gap is equal to a height of the solder pad plus a height of the metal support element. The encapsulation body encapsulates the electronic component together with the substrate and the gap is completely filled with material of the encapsulation body.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: A package structure comprising a first substrate, a second substrate, an encapsulation layer sandwiched between the first and second substrates, and at least one electronic component mounted on the first substrate and isolated from the second substrate by the encapsulation layer. At least one conducting hole is defined in the encapsulation layer to communicate the at least one electronic component with the second substrate. An inner wall of each of the at least one conducting hole is coated with a first metal layer to electrically connect the at least one electronic component to the second substrate.

Abstract: A semiconductor assembly package includes a package unit, a shielding layer and a protection layer. The package unit includes a semiconductor assembly, a daughter substrate and a mold compound. The semiconductor assembly is disposed on and electrically connected to the daughter substrate. The daughter substrate includes a metal portion grounded. The mold compound encapsulates the semiconductor assembly and the daughter substrate to expose the metal portion out of the package unit. The shielding layer is applied to the package unit and electrically connected to the metal portion, to provide electromagnetic shielding for the semiconductor assembly. The non-conductive protection layer is covered on the shielding layer.