Abstract: A lumbar support apparatus for a vehicle seat includes: a seatback frame having an adjustable inclination angle; an operating mechanism disposed at an upper portion of the seatback frame, the operating mechanism including a connector generating an operating force in a vertical direction by being in contact with a fixture fixed to a vehicle body when the inclination angle of the seatback frame is adjusted; and a support mechanism disposed at a lower portion of the seatback frame, connected to the connector, receiving the operating force generated from the connecting mechanism, and configured to slide in a front and rear direction depending on an application direction of the operating force, such that when the inclination angle of the seatback frame is adjusted to be directed rearward, the support mechanism receives the operating force of the operating mechanism and is advanced forward to support a waist of an occupant.

Abstract: A lumbar support apparatus for a vehicle seat includes: a seatback frame having an adjustable inclination angle; an operating mechanism disposed at an upper portion of the seatback frame, the operating mechanism including a connector generating an operating force in a vertical direction by being in contact with a fixture fixed to a vehicle body when the inclination angle of the seatback frame is adjusted; and a support mechanism disposed at a lower portion of the seatback frame, connected to the connector, receiving the operating force generated from the connecting mechanism, and configured to slide in a front and rear direction depending on an application direction of the operating force, such that when the inclination angle of the seatback frame is adjusted to be directed rearward, the support mechanism receives the operating force of the operating mechanism and is advanced forward to support a waist of an occupant.

Abstract: Provided is a video monitoring apparatus connectable to at least one camera which acquires at least one first video by photographing at least one monitoring area, the video monitoring apparatus including at least one processor to implement; a video display generator configured to display a second video of a display area which is included in the monitoring area; an event detector configured to detect whether an event has occurred in the monitoring area; and a marker display generator configured to display an event marker indicating occurrence of the event on the second video when the event has occurred in the monitoring area except the display area.

Abstract: A chemical mechanical polishing (CMP) device includes a rotatable CMP pad located on a polishing platen, a rotatable wafer carrier located on an upper portion of the CMP pad and including a wafer, and a surface-roughness measuring device which is located apart from a surface of the CMP pad in a vertical direction and measures surface roughness of the CMP pad, wherein the surface-roughness measuring device includes a sensor array having a plurality of sensors, and the sensor array is horizontally movable over the upper portion of the CMP pad.

Abstract: A connector, which is coupled to a first communication component, including: a connector body; a fitting portion, which is formed on one end of the connector body, configured to fix the connector body by being adhered to a wall of the first communication component; and a ground stabilization member coupled to the connector body and the first communication component, wherein the ground stabilization member includes: a fixing portion configured to fix the ground stabilization member to an inner wall of the connector body; an insertion portion inserted in an insertion hole of the first communication component, wherein a plurality of slots imparting elasticity are formed; and a ground contact portion configured to perform a grounding function by contacting an inner wall of the insertion hole due to the elasticity.

Abstract: A connector, which is coupled to a first communication component, including: a connector body; a fitting portion, which is formed on one end of the connector body, configured to fix the connector body by being adhered to a wall of the first communication component; and a ground stabilization member coupled to the connector body and the first communication component, wherein the ground stabilization member includes: a fixing portion configured to fix the ground stabilization member to an inner wall of the connector body; an insertion portion inserted in an insertion hole of the first communication component, wherein a plurality of slots imparting elasticity are formed; and a ground contact portion configured to perform a grounding function by contacting an inner wall of the insertion hole due to the elasticity.

Abstract: A method for providing a new workflow that reuses an existing workflow includes displaying one or more collections of existing workflows available for selection; receiving a selection of one of the one or more existing workflow collections; displaying one or more existing workflows associated with the selected existing workflow collection; receiving a selection of one of the existing workflows in the selected existing workflow collection; receiving a selection of a variable in the selected existing workflow to be used in the new workflow; and storing the new workflow such that, when executed, the new workflow utilizes the selected variable from the existing workflow.

Abstract: A system includes a workflow design application further including a user interface for displaying at least one project server platform type available for selection, and a project mode module configured to retrieve at least one available customizable project workflow component from the project server via a project server application programming interface (API). The user interface is configured to receive a project server platform type selection via the user interface, and, upon receiving the project server platform type selection, display the retrieved at least one customizable project workflow component, receive at least one customizable project workflow component selection, receive a customization selection for the selected customizable project workflow component, and receive a request to generate at least a portion of a project workflow based on the customization selection for the selected customizable project workflow component.

Abstract: A method of fabricating a non-volatile memory integrated circuit device and a non-volatile memory integrated circuit device fabricated by using the method are provided. A device isolation region is formed in a substrate to define a cell array region and a peripheral circuit region. A plurality of first and second pre-stacked gate structures is formed in the cell array region, and each has a structure in which a lower structure, a conductive pattern and a first sacrificial layer pattern are stacked. Junction regions are formed in the cell array region. Spacers are formed on side walls of the first and second pre-stacked gate structures. A second sacrificial layer pattern filling each space between the second pre-stacked gate structures is formed. The first sacrificial layer pattern is removed from each of the first and second pre-stacked gate structures.

Abstract: A method of fabricating a non-volatile memory integrated circuit device and a non-volatile memory integrated circuit device fabricated by using the method are provided. A device isolation region is formed in a substrate to define a cell array region and a peripheral circuit region. A plurality of first and second pre-stacked gate structures is formed in the cell array region, and each has a structure in which a lower structure, a conductive pattern and a first sacrificial layer pattern are stacked. Junction regions are formed in the cell array region. Spacers are formed on side walls of the first and second pre-stacked gate structures. A second sacrificial layer pattern filling each space between the second pre-stacked gate structures is formed. The first sacrificial layer pattern is removed from each of the first and second pre-stacked gate structures.

Abstract: A method of fabricating a non-volatile memory integrated circuit device and a non-volatile memory integrated circuit device fabricated by using the method are provided. A device isolation region is formed in a substrate to define a cell array region and a peripheral circuit region. A plurality of first and second pre-stacked gate structures is formed in the cell array region, and each has a structure in which a lower structure, a conductive pattern and a first sacrificial layer pattern are stacked. Junction regions are formed in the cell array region. Spacers are formed on side walls of the first and second pre-stacked gate structures. A second sacrificial layer pattern filling each space between the second pre-stacked gate structures is formed. The first sacrificial layer pattern is removed from each of the first and second pre-stacked gate structures.

Abstract: In a method of chemically and mechanically polishing a layer, a substrate on which the layer having stepped portions is formed is prepared. The layer is primarily chemically and mechanically polished at a temperature of about 30° C. to about 80° C. to remove the stepped portions of the layer. The layer is secondarily chemically and mechanically polished without the stepped portions at a temperature of about 5° C. to about 25° C. to form a flat layer having a desired thickness. Thus, the stepped portions may be rapidly removed in an initial period so that the method may have an improved throughput.

Abstract: A method of fabricating a non-volatile memory integrated circuit device and a non-volatile memory integrated circuit device fabricated by using the method are provided. A device isolation region is formed in a substrate to define a cell array region and a peripheral circuit region. A plurality of first and second pre-stacked gate structures is formed in the cell array region, and each has a structure in which a lower structure, a conductive pattern and a first sacrificial layer pattern are stacked. Junction regions are formed in the cell array region. Spacers are formed on side walls of the first and second pre-stacked gate structures. A second sacrificial layer pattern filling each space between the second pre-stacked gate structures is formed. The first sacrificial layer pattern is removed from each of the first and second pre-stacked gate structures.

Abstract: An image resolution conversion method and apparatus based on a projection onto convex sets (POCS) method are provided. The image resolution conversion method comprises detecting an edge region and a direction of the edge region in an input low-resolution image frame in order to generate an edge map and edge direction information, generating a directional point spread function based on the edge map and the edge direction information, interpolating the input low-resolution image frame into a high-resolution image frame, generating a residual term based on the input low-resolution image frame, the high-resolution image frame, and the directional point spread function, and renewing the high-resolution image frame according to a result of comparing the residual term with a threshold.

Abstract: Example embodiments are directed to a method of planarizing a semiconductor device. A first CMP process may be performed on an insulating layer to remove a stepped structure of the insulating layer. A second CMP process may be performed to planarize the insulating layer with the stepped structure removed until a given pattern is exposed. A process temperature of the first CMP process may be higher than that of the second CMP process. Accordingly, an initial stepped structure may be more readily removed in a planarization process of a surface of the semiconductor device, which may reduce the CMP process time and may increase the degree of planarization.

Abstract: An improved sensing device and method for leveling a semiconductor wafer in a chemical mechanical polishing apparatus, which easily detects the change of pressure from a semiconductor wafer contacting with the polishing surface. The present invention includes a polishing platen having a polishing pad on the upper leveled surface thereof, and fixed to a rotatable platen driving shaft. A carrier is rotatably provided on the upper surface of the polishing platen and holding the semiconductor wafer such that the lower surface of the semiconductor wafer is uniformly contacted with the polishing pad. A pressure detecting sensor senses the pressure applied from the semiconductor wafer on the polishing pad and outputs a corresponding signal.