Abstract: The embodiments relate to high-efficiency resonant inductance coupling type wireless power transfer. In one embodiment, there proposes an apparatus for wireless power transferring, comprising: a first terminal and a second terminal; a combined coil coupled between the first terminal and the second terminal, wherein the combined coil including a first sub coil having a first end and a second end and a second sub coil having a first end and a second end, the first end of the first sub coil is coupled to the first terminal, the second end of the first sub coil is coupled to the first end of the second sub coil; a first filter coupled in series with the first sub coil at the first end or the second end of the first sub coil; and a second filter coupled between the first end of the second sub coil and the first terminal.

Abstract: A resonating apparatus includes a dielectric resonator on a dielectric supporting substrate, a fluid dielectric membrane which overspreads the dielectric resonator, and a microstrip line which is arranged in the fluid substrate membrane so that it is coupled with the dielectric resonator. The resonating apparatus reduces the conductivity loss by lengthening the distance between the dielectric supporting substrate in the higher layer and the microstrip line in the lower layer when it is used in a multi-layer circuit such as an MMIC. Further, the resonating apparatus increases the dielectric permittivity by using the dielectric resonator which has high dielectric permittivity as well as the fluid dielectric membrane. In this way, the resonating apparatus obtains high Q.

Abstract: A resonating apparatus in accordance with the present invention comprises a dielectric resonator on a dielectric supporting substrate, a fluid dielectric membrane which overspreads the dielectric resonator, and a microstrip line which is arranged in the fluid substrate membrane so that it is coupled with the dielectric resonator. The resonating apparatus reduces the conductivity loss by lengthening the distance between the dielectric supporting substrate in the higher layer and the microstrip line in the lower layer when it is used in a multiplayer circuit or a MMIC. Further, the resonating apparatus increases the dielectric permittivity by using the dielectric resonator which has high dielectric permittivity and futher including the fluid dielectric membrane. In this way, the resonating apparatus obtains high Q.