Abstract: The present invention relates to a peptide structure specifically binding to carbonic anhydrase IX (CAIX), and a use thereof. The CAIX-binding peptide ligand of the present invention contains D-amino acids, and thus has high binding specificity to CAIX while being stable in the body, and a cyclic CAIX-binding peptide structure comprising same can bind to CAIX with high affinity in the body, and thus is effective in the diagnosis, prevention, suppression or treatment of diseases mediated by CAIX.

Abstract: An automatic replacement apparatus for a feed material includes a discharge unit discharging a feed material to the outside, a pair of feed units disposed to be adjacent to the discharge unit and having a feed roll around which the feed material is wound, and a pair of material joint units respectively provided in the pair of feed units connecting a front end of a first feed material waiting in a first feed unit, one of the pair of feed units, and an end of a second feed material being transferred from a second feed unit, the other of the pair of feed units, to the discharge unit in a butt joint manner.

Abstract: An automatic replacement apparatus for a feed material includes a discharge unit discharging a feed material to the outside, a pair of feed units disposed to be adjacent to the discharge unit and having a feed roll around which the feed material is wound, and a pair of material joint units respectively provided in the pair of feed units connecting a front end of a first feed material waiting in a first feed unit, one of the pair of feed units, and an end of a second feed material being transferred from a second feed unit, the other of the pair of feed units, to the discharge unit in a butt joint manner.

Abstract: The present invention provides a manufacturing method of a microneedle biosensor including a support layer including a) a step of forming a mold by forming grooves corresponding to shapes of microneedles of a working electrode, a counter electrode, and a reference electrode in a solid resin block; b) a step of imprinting the working electrode, the counter electrode, and the reference electrode using acryl or PLA on the mold; c) a step of forming a support layer by coating an epoxy- or urethane-based photo-curable adhesion after performing the step b); d) a step of forming a metal layer by forming shadow masks corresponding to patterns of the working electrode, the counter electrode, and the reference electrode and sputtering an Au or Au+Ti/Cr adhesive layer, after performing the step c); and e) forming a passivation layer on the metal layer.

Abstract: Disclosed is a microneedle biosensor and a manufacturing method for same, the microneedle biosensor comprising: a working electrode that comprises a circular thin-film first base, a plurality of microneedles protruding vertically upwards from the first base, and first wiring extending from one side of the circumference of the first base; a counter electrode that comprises a second base which is a three-quarter circle strip thin-film that is concentric with the first base and separated by a set distance from the circumference of the first base, a plurality of microneedles protruding vertically upwards from the second base, and second wiring extending from one side of the second base so as to be disposed on a level with the first wiring; and a reference electrode that comprises a third base which is a quarter circle strip thin-film that is separated by a set difference from the other side of the second base, is concentric with the first base and is separated by a set distance from the circumference of the first

Abstract: An automatic replacement apparatus for a feed material includes a discharge unit discharging a feed material to the outside, a pair of feed units disposed to be adjacent to the discharge unit and having a feed roll around which the feed material is wound, and a pair of material joint units respectively provided in the pair of feed units connecting a front end of a first feed material waiting in a first feed unit, one of the pair of feed units, and an end of a second feed material being transferred from a second feed unit, the other of the pair of feed units, to the discharge unit in a butt joint manner.

Abstract: An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.

Abstract: A low-noise, high-power-factor power supply includes a transformer having a primary winding connected to a pair of a.c. input terminals via a rectifier circuit, and a secondary winding connected to a pair of d.c. output terminals via a rectifying and smoothing circuit. Connected between the pair of outputs of the rectifier circuit via at least part of the transformer primary, a switch is turned on and off to keep the d.c. output voltage constant. A smoothing capacitor is connected between the pair of outputs of the rectifier circuit via at least part of the transformer primary and a serial connection of a reverse blocking diode and an inductor. For noise reduction a bypass capacitor is connected between the pair of outputs of the rectifier circuit and in parallel with the serial circuit of the inductor and the reverse blocking diode and at least part of the transformer primary and the smoothing capacitor. The bypass capacitor is less in capacitance than the smoothing capacitor.

Abstract: A low-noise, high-power-factor power supply includes a transformer having a primary winding connected to a pair of a.c. input terminals via a rectifier circuit, and a secondary winding connected to a pair of d.c. output terminals via a rectifying and smoothing circuit. Connected between the pair of outputs of the rectifier circuit via at least part of the transformer primary, a switch is turned on and off to keep the d.c. output voltage constant. A smoothing capacitor is connected between the pair of outputs of the rectifier circuit via at least part of the transformer primary and a serial connection of a reverse blocking diode and an inductor. For noise reduction a bypass capacitor is connected between the pair of outputs of the rectifier circuit and in parallel with the serial circuit of the inductor and the reverse blocking diode and at least part of the transformer primary and the smoothing capacitor. The bypass capacitor is less in capacitance than the smoothing capacitor.