Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus comprises a first treating part performing, a liquid treatment on a plurality of substrates in a batch-type treating, method and a second treating part treating the substrates which have been treated at the first treating part, and performing, the liquid treatment or a drying treatment on a single substrate a single-type treating method.

Abstract: An on-chip network interfacing apparatus and method are provided. The apparatus includes a plurality of on-chip network ports; a switch receiving data from a first on-chip network port of the on-chip network ports and transmitting the received data to a second on-chip network port of the on-chip network ports; and an interface unit interfacing an advanced microcontroller bus architecture (AMBA) signal received from an module, which is designed according to an AMBA on-chip bus protocol, and outputting the interfacing result to the first on-chip network port; and interfacing the on-chip network signal received from the first on-chip network port, and outputting the interfacing result to the module. Accordingly, it is possible to establish communications at increased speeds by interfacing a signal according to the AMBA 2.0 on-chip bus protocol with a signal according to the on-chip network protocol.