Abstract: An etchant composition includes hydrogen peroxide, a carboxylic acid-based compound, a fluorine-based compound, and a nitrogen-based cyclic compound. The hydrogen peroxide is included in an amount of 0.001 to 4 wt %. Additionally or alternatively, the weight ratio between the fluorine-based compound and the nitrogen-based cyclic compound is 1:0.01 to 1:3.

Abstract: The present invention relates to a solder resist composition, and more specifically, to: a solder resist composition that can be used to obtain high reflectance, excellent yellowing resistance, excellent crack resistance, high resolution and flatness, excellent sensitivity, developability, adhesion, solder heat resistance, pencil hardness, solvent resistance, HAST resistance, and high reflectance and high gloss after a HAST test; a dry film and a printed wiring board which include a solder resist layer obtained therefrom; and methods for manufacturing same.

Abstract: Disclosed herein is a method of manufacturing a touch screen panel, including the steps of: forming a spacer array and a mold having a shape corresponding to that of a horizontal groove array or a vertical groove array; fabricating a transparent upper plate having a horizontal groove array including two or more horizontal grooves and a transparent lower plate having a vertical groove array including two or more vertical grooves using the mold; charging a predetermined amount of conductive ink in the horizontal groove array and the vertical groove array; and drying the conductive ink to form a conductive array and then attaching the upper plate to the lower plate.

Abstract: Soot trapping filter (100), and a soot reducing device thereof, the soot trapping filter (100) including trapping means (132) having a plurality of filter granules stacked to form a volume, for trapping soot contained in exhaust gas from a combustion apparatus at a whole volume of the trapping means, wherein the filter granules include a ratio of non-spherical filter granules higher than a predetermined ratio.