Patents by Inventor Jun-young OH
Jun-young OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250062481Abstract: A battery module includes a plurality of overlapped battery cells and an insert panel inserted between the overlapped battery cells. The battery module further includes a top flange extended in an overlapping direction of the battery cells above the battery cells.Type: ApplicationFiled: March 14, 2024Publication date: February 20, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Hyun Chang Kang, Ji Woong Jung, Yu Ri Oh, Jun Young Kang, Sun Keun Park, Byung Su Kim, In Gook Son
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Patent number: 12215042Abstract: Provided is a wastewater purification method, the method including: supplying a first mixed stream, in which an acid component and wastewater including water, a nitrile-based monomer, and ammonia are mixed, to a first column; recovering the nitrile-based monomer from an upper discharge stream from the first column; supplying a second mixed stream, in which a lower discharge stream from the first column and a base component are mixed, to a second column; and recovering the ammonia from an upper discharge stream from the second column and separating purified wastewater.Type: GrantFiled: July 1, 2022Date of Patent: February 4, 2025Assignee: LG Chem, Ltd.Inventors: Suk Yung Oh, Yong Heon Cho, Jung Su Han, Jun Seok Ko, Nam Young Yoon, Sung Hwan Kim
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Publication number: 20250022426Abstract: A source driver includes a pin to which a first voltage or a second voltage is applied; an output multiplexer configured to select a data voltage and a black grayscale voltage of pixel data; and a controller configured to control a voltage level of the black grayscale voltage differently depending on the voltage applied to the pin.Type: ApplicationFiled: July 1, 2024Publication date: January 16, 2025Applicant: LX SEMICON CO., LTD.Inventors: Jun Young OH, Min Young JEONG, Yong Woo CHOI, Jung Bae YUN
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Publication number: 20240178202Abstract: A semiconductor device includes: a semiconductor layer including a wire and an electrical element; and a plurality of metal pads on a surface of the semiconductor layer, wherein the plurality of metal pads includes a first metal pad and a second metal pad, wherein the second metal pad is smaller in surface area or diameter on the surface of the semiconductor layer than the first metal pad, and wherein the second metal pad is between a first region of the surface of the semiconductor layer where the first metal pad is and a second region of the surface of the semiconductor layer where a surface metal density is zero (0).Type: ApplicationFiled: July 20, 2023Publication date: May 30, 2024Inventors: Byeongchan KIM, Un-Byoung KANG, Jumyong PARK, Dongjoon OH, Jun Young OH, Jeongil LEE, Chungsun LEE
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Patent number: 11996365Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: GrantFiled: February 27, 2023Date of Patent: May 28, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang
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Patent number: 11955359Abstract: The present disclosure provides a magazine supporting equipment for supporting a magazine with multiple input ports. The magazine supporting equipment comprises a contact plate, a first sidewall plate, and a second sidewall plate. The contact plate is in contact with the magazine. The first sidewall plate extends vertically from one end of the contact plate. The second sidewall plate parallel is to the first sidewall plate and extends vertically from one end to the other end of the contact plate. The first sidewall plate extends along at least a part of a first sidewall of the magazine. The second sidewall plate extends along at least a part of a second sidewall of the magazine. The first sidewall plate and the second sidewall plate include control openings through which gas flows in and out.Type: GrantFiled: March 15, 2021Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jun Young Oh, Seung Hwan Kim, Jong Ho Park, Yong Kwan Lee, Jong Ho Lee
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Patent number: 11699626Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.Type: GrantFiled: June 23, 2021Date of Patent: July 11, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Jun-young Oh, Hyun-ki Kim, Sang-soo Kim, Seung-hwan Kim, Yong-kwan Lee
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Publication number: 20230132272Abstract: The semiconductor device may include a substrate, a first insulating layer on a bottom surface of the substrate, an interconnection structure in the first insulating layer, a second insulating layer on a bottom surface of the first insulating layer, and a plurality of lower pads provided in the second insulating layer. Each lower pad may be provided such a width of a top surface thereof is smaller than a width of a bottom surface thereof. The lower pads may include first, second, and third lower pads. In a plan view, the first and third lower pads may be adjacent to center and edge portions of the substrate, respectively, and the second lower pad may be disposed therebetween. A width of a bottom surface of the second lower pad may be smaller than that of the first lower pad and may be larger than that of the third lower pad.Type: ApplicationFiled: July 22, 2022Publication date: April 27, 2023Inventors: JUN YOUNG OH, UN-BYOUNG KANG, BYEONGCHAN KIM, JUMYONG PARK, CHUNGSUN LEE
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Publication number: 20230095051Abstract: Provided is an electrode rolling apparatus and method for performing a multi-stage induction heating. By use of the apparatus and method, it is possible to prevent camber generation on the non-coated part region during the process of rolling an electrode substrate, and it is possible to increase the efficiency of the manufacturing process.Type: ApplicationFiled: July 9, 2021Publication date: March 30, 2023Applicant: LG Energy Solution, Ltd.Inventors: Hwan Han Kim, Young Woong Son, Jeong Soo Seol, Jun Young Oh
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Patent number: 11610845Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: GrantFiled: August 3, 2021Date of Patent: March 21, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang
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Patent number: 11562965Abstract: A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.Type: GrantFiled: December 28, 2020Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Chul Kim, Sang Soo Kim, Yong Kwan Lee, Hyun Ki Kim, Seok Geun Ahn, Jun Young Oh
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Patent number: 11538801Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.Type: GrantFiled: April 1, 2021Date of Patent: December 27, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Jongho Park, Seung Hwan Kim, Jun Young Oh, Jungjoo Kim, Yongkwan Lee, Dong-Ju Jang
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Publication number: 20220068904Abstract: A semiconductor package includes a first substrate that includes a first trench on a recessed portion of a bottom surface of the first substrate and a first through hole extending through the first substrate to the first trench, a first semiconductor chip on the first substrate, a first capacitor chip in the first trench and on the first substrate, and a first molding layer on the first substrate and covering the first semiconductor chip. The first molding layer includes a first part that extends parallel to a top surface of the first substrate, a second part connected to the first part and extending vertically in the first through hole, and a third part connected to the second part and surrounding the first capacitor chip. A bottom surface of the third part is coplanar with the bottom surface of the first substrate.Type: ApplicationFiled: April 1, 2021Publication date: March 3, 2022Applicant: Samsung Electronics Co., Ltd.Inventors: Jongho PARK, Seung Hwan KIM, Jun Young OH, Jungjoo KIM, Yongkwan LEE, Dong-Ju JANG
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Publication number: 20210391199Abstract: The present disclosure provides a magazine supporting equipment for supporting a magazine with multiple input ports. The magazine supporting equipment comprises a contact plate, a first sidewall plate, and a second sidewall plate. The contact plate is in contact with the magazine. The first sidewall plate extends vertically from one end of the contact plate. The second sidewall plate parallel is to the first sidewall plate and extends vertically from one end to the other end of the contact plate. The first sidewall plate extends along at least a part of a first sidewall of the magazine. The second sidewall plate extends along at least a part of a second sidewall of the magazine. The first sidewall plate and the second sidewall plate include control openings through which gas flows in and out.Type: ApplicationFiled: March 15, 2021Publication date: December 16, 2021Inventors: Jun Young OH, Seung Hwan KIM, Jong Ho PARK, Yong Kwan LEE, Jong Ho LEE
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Publication number: 20210366832Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: ApplicationFiled: August 3, 2021Publication date: November 25, 2021Inventors: JONGHO PARK, SEUNG HWAN KIM, JUN YOUNG OH, Kyong Hwan KOH, SANGSOO KIM, DONG-JU JANG
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Publication number: 20210366834Abstract: A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.Type: ApplicationFiled: December 28, 2020Publication date: November 25, 2021Inventors: Sun Chul Kim, Sang Soo Kim, Yong Kwan Lee, Hyun Ki Kim, Seok Geun Ahn, Jun Young Oh
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Publication number: 20210320043Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Applicant: Samsung Electronics Co., Ltd.Inventors: Jun-young OH, Hyun-ki KIM, Sang-soo KIM, Seung-hwan KIM, Yong-kwan LEE
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Patent number: 11107769Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: GrantFiled: April 10, 2020Date of Patent: August 31, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang
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Patent number: 11069588Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.Type: GrantFiled: March 19, 2019Date of Patent: July 20, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Jun-young Oh, Hyun-ki Kim, Sang-soo Kim, Seung-hwan Kim, Yong-kwan Lee
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Publication number: 20210035913Abstract: A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.Type: ApplicationFiled: April 10, 2020Publication date: February 4, 2021Inventors: JONGHO PARK, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim, Dong-Ju Jang