Patents by Inventor Jun-young OH

Jun-young OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of manufacturing the same
    Patent number: 11699626
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: July 11, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-young Oh, Hyun-ki Kim, Sang-soo Kim, Seung-hwan Kim, Yong-kwan Lee
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210320043
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-young OH, Hyun-ki KIM, Sang-soo KIM, Seung-hwan KIM, Yong-kwan LEE
  • Semiconductor package and method of manufacturing the same
    Patent number: 11069588
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: July 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jun-young Oh, Hyun-ki Kim, Sang-soo Kim, Seung-hwan Kim, Yong-kwan Lee
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200043820
    Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.
    Type: Application
    Filed: March 19, 2019
    Publication date: February 6, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-young OH, Hyun-ki KIM, Sang-soo KIM, Seung-hwan KIM, Yong-kwan LEE
  • METHOD AND APPARATUS FOR PROVIDING COMMUNITY WIDGET
    Publication number: 20100191830
    Abstract: Provided are a method and apparatus for providing a community widget at a first client device, the method including: receiving a client widget including authentication information from a server; searching a second client device in which the client widget is installed; performing mutual authentication with the second client device by using the authentication information; and transmitting, if the mutual authentication is successful, a community widget to the second client device.
    Type: Application
    Filed: August 31, 2009
    Publication date: July 29, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Bong-yen KIM, Soo-kang BAE, Seung-han GO, Jun-young OH