Abstract: Provided is a folding packaging cooler box convertible from a box mode to an unfolding mode or vice versa, comprising: a box portion having a bottom portion, sidewall portions and joint portions configured to connect with one another and to form a single plane in the unfolding mode; and a cooling reinforcing portion configured to be inserted to the inside of the box and to form a hexahedron shape together with said box portion when said box portion is converted into the box mode, wherein said cooling reinforcing portion comprises a reinforcing bottom portion configured to form a lower surface and to face the bottom portion of the said box portion upon conversion into the box mode; reinforcing sidewall portions configured to connect with the said reinforcing bottom portion and to face the sidewall portions of said box portion; and reinforcing joint portions configured to join said reinforcing sidewall portions, to be folded to face itself and to be in close contact with the reinforcing sidewall portions, upon

Abstract: Provided is a folding packaging cooler box convertible from a box mode to an unfolding mode or vice versa, comprising: a box portion having a bottom portion, sidewall portions and joint portions configured to connect with one another and to form a single plane in the unfolding mode; and a cooling reinforcing portion configured to be inserted to the inside of the box and to form a hexahedron shape together with said box portion when said box portion is converted into the box mode, wherein said cooling reinforcing portion comprises a reinforcing bottom portion configured to form a lower surface and to face the bottom portion of the said box portion upon conversion into the box mode; reinforcing sidewall portions configured to connect with the said reinforcing bottom portion and to face the sidewall portions of said box portion; and reinforcing joint portions configured to join said reinforcing sidewall portions, to be folded to face itself and to be in close contact with the reinforcing sidewall portions, upon

Abstract: Provided is a folding packaging cooler box convertible from a box mode to an unfolding mode or vice versa, comprising: a box portion having a bottom portion, sidewall portions and joint portions configured to connect with one another and to form a single plane in the unfolding mode; and a cooling reinforcing portion configured to be inserted to the inside of the box and to form a hexahedron shape together with said box portion when said box portion is converted into the box mode, wherein said cooling reinforcing portion comprises a reinforcing bottom portion configured to form a lower surface and to face the bottom portion of the said box portion upon conversion into the box mode; reinforcing sidewall portions configured to connect with the said reinforcing bottom portion and to face the sidewall portions of said box portion; and reinforcing joint portions configured to join said reinforcing sidewall portions, to be folded to face itself and to be in close contact with the reinforcing sidewall portions, upon

Abstract: Provided is a folding packaging cooler box convertible from a box mode to an unfolding mode or vice versa, comprising: a box portion having a bottom portion, sidewall portions and joint portions configured to connect with one another and to form a single plane in the unfolding mode; and a cooling reinforcing portion configured to be inserted to the inside of the box and to form a hexahedron shape together with said box portion when said box portion is converted into the box mode, wherein said cooling reinforcing portion comprises a reinforcing bottom portion configured to form a lower surface and to face the bottom portion of the said box portion upon conversion into the box mode; reinforcing sidewall portions configured to connect with the said reinforcing bottom portion and to face the sidewall portions of said box portion; and reinforcing joint portions configured to join said reinforcing sidewall portions, to be folded to face itself and to be in close contact with the reinforcing sidewall portions, upon

Abstract: Provided is a folding packaging cooler box convertible from a box mode to an unfolding mode or vice versa, comprising: a box portion having a bottom portion, sidewall portions and joint portions configured to connect with one another and to form a single plane in the unfolding mode; and a cooling reinforcing portion configured to be inserted to the inside of the box and to form a hexahedron shape together with said box portion when said box portion is converted into the box mode, wherein said cooling reinforcing portion comprises a reinforcing bottom portion configured to form a lower surface and to face the bottom portion of the said box portion upon conversion into the box mode; reinforcing sidewall portions configured to connect with the said reinforcing bottom portion and to face the sidewall portions of said box portion; and reinforcing joint portions configured to join said reinforcing sidewall portions, to be folded to face itself and to be in close contact with the reinforcing sidewall portions, upon

Abstract: A semiconductor package includes a support member having first and second surfaces opposing each other, having first and second through-holes, spaced apart from each other, and having a wiring structure that connects the first and second surfaces to each other; a connection member disposed on the second surface of the support member and having redistribution layers connected to the wiring structure; a semiconductor chip disposed in the first through-hole and having connection pads connected to the redistribution layers; a second passive component disposed in the second through-hole and connected to the redistribution layers; a first encapsulant disposed on the first surface of the support member and encapsulating the first passive component; and a second encapsulant encapsulating the support member, the first encapsulant, and the semiconductor chip.

Abstract: A semiconductor package includes a support member having first and second surfaces opposing each other, having first and second through-holes, spaced apart from each other, and having a wiring structure that connects the first and second surfaces to each other; a connection member disposed on the second surface of the support member and having redistribution layers connected to the wiring structure; a semiconductor chip disposed in the first through-hole and having connection pads connected to the redistribution layers; a second passive component disposed in the second through-hole and connected to the redistribution layers; a first encapsulant disposed on the first surface of the support member and encapsulating the first passive component; and a second encapsulant encapsulating the support member, the first encapsulant, and the semiconductor chip.