Abstract: The present invention relates to a thermoplastic composite composition comprising (a) a first polymer resin including a polyphenylene sulfide polymer having a melt index (ASTM D-1238, 235° C.) of 100 to 150 g/10 min; (b) a second polymer resin including a polyphenylene sulfide polymer having a melt index (ASTM D-1238, 235° C.) of 250 to 850 g/10 min, and an amorphous monomer having an aliphatic cyclobutanediol; (c) a carbon fiber surface-treated with a polyimide; (d) a fatty acid compound; and (e) a heat-resistant additive.

Abstract: Disclosed is a lower cross member of a vehicle. The lower cross member includes a core member configured to be disposed on a vehicle floor so as to extend in a width direction of the vehicle, to be formed of a composite material including unidirectional carbon fiber or bidirectional carbon fiber, and to have a cross-section including at least one closed curve, a lower layer configured to extend in an extending direction of the core member, to be disposed between the core member and the vehicle floor, and to be formed of a composite material including a first multi-axial glass fabric, and an upper layer configured to extend in the extending direction of the core member, to be disposed on an upper surface of the core member, and to be formed of a composite material including a second multi-axial glass fabric.

Abstract: The present invention relates to a thermoplastic composite composition and a molded product manufactured therefrom, and more specifically, to a high-rigidity and high-heat resistance thermoplastic composite composition and a molded product manufactured therefrom. The thermoplastic composite composition includes: (a) a first polymer resin including a polyphenylene sulfide polymer having a melt index (ASTM D-1238, 235° C.) of 100 to 150 g/10 min; (b) a second polymer resin including a polyphenylene sulfide polymer having a melt index (ASTM D-1238, 235° C.) of 250 to 850 g/10 min, and an amorphous monomer having an aliphatic cyclobutanediol; (c) a carbon fiber surface-treated with a polyimide; (d) a fatty acid compound; and (e) a heat-resistant additive.

Abstract: Disclosed is a lower cross member of a vehicle. The lower cross member includes a core member configured to be disposed on a vehicle floor so as to extend in a width direction of the vehicle, to be formed of a composite material including unidirectional carbon fiber or bidirectional carbon fiber, and to have a cross-section including at least one closed curve, a lower layer configured to extend in an extending direction of the core member, to be disposed between the core member and the vehicle floor, and to be formed of a composite material including a first multi-axial glass fabric, and an upper layer configured to extend in the extending direction of the core member, to be disposed on an upper surface of the core member, and to be formed of a composite material including a second multi-axial glass fabric.

Abstract: A semiconductor memory device includes a circuit chip including a first substrate, peripheral circuit elements which are defined on the first substrate and a first dielectric layer which covers the peripheral circuit elements, and having first pads which are coupled to the peripheral circuit elements, on one surface thereof; a memory chip including a second substrate which is disposed on a base dielectric layer, a memory cell array which is defined on the second substrate and a second dielectric layer which covers the memory cell array, and having second pads which are coupled with the first pads, on one surface thereof which is bonded with the one surface of the circuit chip; a contact passing through the base dielectric layer and the second dielectric layer; and one or more dummy contacts passing through the base dielectric layer and the second dielectric layer, and disposed around the contact.

Abstract: A semiconductor memory device includes a circuit chip including a first substrate, peripheral circuit elements which are defined on the first substrate and a first dielectric layer which covers the peripheral circuit elements, and having first pads which are coupled to the peripheral circuit elements, on one surface thereof; a memory chip including a second substrate which is disposed on a base dielectric layer, a memory cell array which is defined on the second substrate and a second dielectric layer which covers the memory cell array, and having second pads which are coupled with the first pads, on one surface thereof which is bonded with the one surface of the circuit chip; a contact passing through the base dielectric layer and the second dielectric layer; and one or more dummy contacts passing through the base dielectric layer and the second dielectric layer, and disposed around the contact.

Abstract: A semiconductor memory device includes a peripheral circuit region including a first substrate, a peripheral circuit element disposed at least partially over the first substrate, a first dielectric layer covering the peripheral circuit element and a bottom wiring line disposed in the first dielectric layer and electrically coupled to the peripheral circuit element; a cell region including a second substrate disposed over the first dielectric layer, a memory cell array disposed over the second substrate; a second dielectric layer covering the memory cell array; a contact coupled to the bottom wiring line by passing through the second dielectric layer and the first dielectric layer in a first direction perpendicular to a top surface of the second substrate; and at least one dummy contact disposed adjacent to the contact in the second dielectric layer.

Abstract: A semiconductor memory device includes a peripheral circuit region including a first substrate, a peripheral circuit element disposed at least partially over the first substrate, a first dielectric layer covering the peripheral circuit element and a bottom wiring line disposed in the first dielectric layer and electrically coupled to the peripheral circuit element; a cell region including a second substrate disposed over the first dielectric layer, a memory cell array disposed over the second substrate; a second dielectric layer covering the memory cell array; a contact coupled to the bottom wiring line by passing through the second dielectric layer and the first dielectric layer in a first direction perpendicular to a top surface of the second substrate; and at least one dummy contact disposed adjacent to the contact in the second dielectric layer.

Abstract: The present invention relates to a bumper system for a vehicle, and provides a bumper system for a vehicle, the system comprising: a bumper beam which has a fastening hole formed through each end thereof in the forward and backward direction; a crash box which is inserted into the fastening hole of the bumper beam; and a bracket which is fastened to the bumper beam so as to be able to prevent the crash box from being separated. Thereby, the system can meet both low speed crash regulations and RCAR performance.

Abstract: The present invention relates to a bumper system for a vehicle, and provides a bumper system for a vehicle, the system comprising: a bumper beam which has a fastening hole formed through each end thereof in the forward and backward direction; a crash box which is inserted into the fastening hole of the bumper beam; and a bracket which is fastened to the bumper beam so as to be able to prevent the crash box from being separated. Thereby, the system can meet both low speed crash regulations and RCAR performance.

Abstract: A vehicle front structure is provided. The vehicle front structure includes a front bumper beam having a plurality of brackets that extend in the downward direction of a vehicle and coupling components that protrude forward from ends of the respective brackets. A stiffener is horizontally disposed on the coupling components and vertical pins vertically pass through the stiffener from the coupling components.

Abstract: A vehicle front structure is provided. The vehicle front structure includes a front bumper beam having a plurality of brackets that extend in the downward direction of a vehicle and coupling components that protrude forward from ends of the respective brackets. A stiffener is horizontally disposed on the coupling components and vertical pins vertically pass through the stiffener from the coupling components.

Abstract: A bumper beam assembly system includes a bumper beam and a stay connecting the bumper beam to a vehicle, wherein the stay is replaceably coupled to both sides of the bumper beam to occupy a corner portion of the bumper beam. The bucket structure includes a frame assembly part that is coupled to a frame, a first sidewall disposed on one side of the frame assembly part to constitute the corner portion of the bumper beam, a second sidewall disposed on the other side of the frame, and a bumper beam assembly part extending from the frame assembly part, the first sidewall, and the second sidewall in a flange shape and coupled to the bumper beam.

Abstract: A bumper beam assembly system includes a bumper beam and a stay connecting the bumper beam to a vehicle, wherein the stay is replaceably coupled to both sides of the bumper beam to occupy a corner portion of the bumper beam. The bucket structure includes a frame assembly part that is coupled to a frame, a first sidewall disposed on one side of the frame assembly part to constitute the corner portion of the bumper beam, a second sidewall disposed on the other side of the frame, and a bumper beam assembly part extending from the frame assembly part, the first sidewall, and the second sidewall in a flange shape and coupled to the bumper beam.

Abstract: Provided is a bumper beam assembly system. The A bumper beam assembly system includes a bumper beam and a stay connecting the bumper beam to a vehicle, wherein the stay is replaceably coupled to both sides of the bumper beam to occupy a corner portion of the bumper beam.