Patents by Inventor Jun-Yu Chen
Jun-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11838367Abstract: Various embodiments include a method for deploying field device into an Internet of Things (IoT). The method may include: acquiring information from a field device using an edge device; transmitting the acquired information to a cloud platform; wherein the information comprises data and an industrial IoT model; converting the industrial IoT model into a graph; performing similarity analysis based on the graph; classifying the industrial IoT model based on the similarity analysis; generating a first industrial IoT model comprising a type or an example; performing data mapping on the first industrial IoT model; and operating the field device as part of the IoT.Type: GrantFiled: December 9, 2019Date of Patent: December 5, 2023Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Qi Wang, He Yu, Jun Jie Chen, Wen Jing Zhou, Yue Hua Zhang, Teng Fei Wu, Yang Wang
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Patent number: 11799724Abstract: Various embodiments of the teachings herein include a method for generating a virtual Internet-of-things device on the basis of an Internet-of-things model. The method may include: obtaining a first number of Internet-of-things models for an Internet-of-things solution; subjecting a variable in the first number of Internet-of-things models to variable attribute expansion to add an extended variable attribute to the variable, wherein the variable subjected to variable attribute expansion is capable of data simulation; configuring variable link relations and variable link processing rules for the extended Internet-of-things models to obtain an Internet-of-things model configuration file; and obtaining a second number of virtual Internet-of-things devices on the basis of a virtual physical network device architecture by using the Internet-of-things model configuration file.Type: GrantFiled: September 29, 2019Date of Patent: October 24, 2023Assignee: SIEMENS AKTIENGESELLSCHAFTInventors: Qi Wang, He Yu, Jun Jie Chen, Wen Jing Zhou, Yue Hua Zhang, Teng Fei Wu, Yang Wang
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Publication number: 20230319418Abstract: A head-mounted display device and a control method for an eye-tracking operation are provided. The head-mounted display device includes a frame, a track, a sensor and a controller. The track is disposed on a peripheral region of the frame. The sensor is disposed on the track, and is configured to capture a target image of a target area. The controller is coupled to the sensor, is configured to generate a control signal according to the target image, and adjust a position of the sensor on the peripheral region by moving the sensor according to the control signal.Type: ApplicationFiled: January 3, 2023Publication date: October 5, 2023Applicant: HTC CorporationInventors: Yan-Min Kuo, Jun-Lin Guo, Wei-Chen Chen, Chih-Lin Chang, Wei-Cheng Hsu, Cheng-Yu Chen
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Publication number: 20230268256Abstract: An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.Type: ApplicationFiled: August 18, 2022Publication date: August 24, 2023Applicant: Unimicron Technology Corp.Inventors: Chin-Sheng Wang, Ra-Min Tain, Wen-Yu Lin, Tse-Wei Wang, Jun-Ho Chen, Guang-Hwa Ma
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Publication number: 20230268257Abstract: An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board.Type: ApplicationFiled: September 5, 2022Publication date: August 24, 2023Applicant: Unimicron Technology Corp.Inventors: Chin-Sheng Wang, Ra-Min Tain, Wen-Yu Lin, Tse-Wei Wang, Jun-Ho Chen, Guang-Hwa Ma
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Patent number: 10973139Abstract: A flexible modularized system is configured to support graphics processing unit (GPU) cards of different dimensions. The system includes a riser bracket with attachment features for being coupled to a printed circuit board (PCB). The system further includes a fixing plate that is coupled to the riser bracket and which includes a plurality of adjustable holes. The system also includes a moving plate that is adjustably coupled to the fixing plate. The moving plate is movable between a plurality of positions. The moving plate has a first end that includes at least one latch, which engages the first adjustable hole in a first position and the second adjustable hole in a second position. The moving plate has a second end that is configured to secure in place one of the GPU cards relative to the PCB.Type: GrantFiled: May 26, 2020Date of Patent: April 6, 2021Assignee: QUANTA COMPUTER INC.Inventors: Yaw-Tzorng Tsorng, Chun Chang, Jun-Yu Chen, Ting-Kuang Pao
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Publication number: 20180294381Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.Type: ApplicationFiled: May 14, 2018Publication date: October 11, 2018Applicant: Everlight Electronics Co., Ltd.Inventors: Wei-Ting Wu, Jun Yu Chen, Han-Hsiang Chiang, Hsien-Chia Lin, Tzu-Pin Lin
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Patent number: 9972608Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.Type: GrantFiled: December 5, 2016Date of Patent: May 15, 2018Assignee: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Wei-Ting Wu, Jun Yu Chen, Han-Hsiang Chiang
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Patent number: 9653653Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.Type: GrantFiled: June 30, 2015Date of Patent: May 16, 2017Assignee: Everlight Electronics Co., Ltd.Inventors: Wei-Ting Wu, Jun Yu Chen, Han-Hsiang Chiang
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Publication number: 20170084588Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.Type: ApplicationFiled: December 5, 2016Publication date: March 23, 2017Inventors: Wei-Ting Wu, Jun Yu Chen, Han-Hsiang Chiang
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Publication number: 20150380607Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.Type: ApplicationFiled: June 30, 2015Publication date: December 31, 2015Inventors: Wei-Ting Wu, Jun Yu Chen, Han-Hsiang Chiang
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Patent number: 9053322Abstract: A computing environment security method is provided. The method includes: a) dissolving an application package to be tested to obtain at least one data set, wherein each data set corresponds to contents with respect to one of a plurality of aspects of the application package; and b) evaluating whether the application package is a repackaged application according to the at least one data set. Step (b) includes: c) for each data set, analyzing a characteristic relationship of the contents with respect to the aspect corresponding to the data set to accordingly generate characteristic data for the data set; and d) determining whether the application package to be tested is a repackaged application package according to the characteristic data of the at least one data set and a search result obtained from a database, wherein the search result corresponds to the characteristic data within a corresponding distance.Type: GrantFiled: January 15, 2013Date of Patent: June 9, 2015Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pang-Chieh Wang, Jun-Bin Shi, Shu-Fen Yang, Jun-Yu Chen
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Patent number: 8655260Abstract: A system for creating the learning organizational tool known as a concept map to thereby facilitate learning includes a manipulation-sensing device with a wireless data transceiver, an information integration platform, and a data processing device. The wireless manipulating-sensing device allows users to physically manipulate the concept map and then transmit/receive data related to the results of the physical manipulation via a wireless network. The wireless manipulation-sensing device includes a plurality of conceptual modules for recording data in the process of learning a concept map, a plurality of connecting modules for recording data of the connection relations between the conceptual modules, and a plurality of connecting wires connected between the plurality of conceptual modules and the plurality of connecting modules to form connection relations therebetween.Type: GrantFiled: May 26, 2010Date of Patent: February 18, 2014Assignee: National Taiwan UniversityInventors: Hsiu-Ping Yueh, Chih-Ting Lin, Shih-Kuan Hsu, Jo-Yi Huang, Jen-Jun Pan, Jun-Yu Chen, Yen-Liang Chou
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Publication number: 20140020094Abstract: A computing environment security method is provided. The method includes: a) dissolving an application package to be tested to obtain at least one data set, wherein each data set corresponds to contents with respect to one of a plurality of aspects of the application package; and b) evaluating whether the application package is a repackaged application according to the at least one data set. Step (b) includes: c) for each data set, analyzing a characteristic relationship of the contents with respect to the aspect corresponding to the data set to accordingly generate characteristic data for the data set; and d) determining whether the application package to be tested is a repackaged application package according to the characteristic data of the at least one data set and a search result obtained from a database, wherein the search result corresponds to the characteristic data within a corresponding distance.Type: ApplicationFiled: January 15, 2013Publication date: January 16, 2014Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Pang-Chieh Wang, Jun-Bin Shi, Shu-Fen Yang, Jun-Yu Chen
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Publication number: 20110223575Abstract: A system for creating the learning organizational tool known as a concept map to thereby facilitate learning includes a manipulation-sensing device with a wireless data transceiver, an information integration platform, and a data processing device. The wireless manipulating-sensing device allows users to physically manipulate the concept map and then transmit/receive data related to the results of the physical manipulation via a wireless network. The wireless manipulation-sensing device includes a plurality of conceptual modules for recording data in the process of learning a concept map, a plurality of connecting modules for recording data of the connection relations between the conceptual modules, and a plurality of connecting wires connected between the plurality of conceptual modules and the plurality of connecting modules to form connection relations therebetween.Type: ApplicationFiled: May 26, 2010Publication date: September 15, 2011Applicant: NATIONAL TAIWAN UNIVERSITYInventors: Hsiu-Ping Yueh, Chih-Ting Lin, Shih-Kuan Hsu, Jo-Yi Huang, Jen-Jun Pan, Jun-Yu Chen, Yen-Liang Chou
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Patent number: 7558484Abstract: The present invention provides a kind of ultra-wide band wireless system, which changes the previous electronic structure for ultra-wide band pulse generator, and uses light to generate pulse signal, transformed by microwave differentiator to Gaussian monocycle pulse transmission signal, the derived pulse signal can provide several GHz bandwidth to transmit fast speed information, and further complete the new ultra-wide band wireless system. It reduces the complexity of electronic system and enhances output signal quality by means of light property, with considerable leading advantage. And the signal generated by this system has broader band and no infringe property, its 10 dB band falls within the range prescribed by the Federal Communication Committee of United States (FCC), successfully realizing the ultra wide band fiberoptic wireless collection network system, and further attaining the goal of seamless communication collection.Type: GrantFiled: March 6, 2006Date of Patent: July 7, 2009Assignee: Chang Gung Memorial UniversityInventors: Wen-Piao Lin, Jun-Yu Chen
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Publication number: 20070206951Abstract: The present invention provides a kind of ultra-wide band wireless system, which changes the previous electronic structure for ultra-wide band pulse generator, and uses light to generate pulse signal, transformed by microwave differentiator to Gaussian monocycle pulse transmission signal, the derived pulse signal can provide several GHz bandwidth to transmit fast speed information, and further complete the new ultra-wide band wireless system. It reduces the complexity of electronic system and enhances output signal quality by means of light property, with considerable leading advantage. And the signal generated by this system has broader band and no infringe property, its 10 dB band falls within the range prescribed by the Federal Communication Committee of United States (FCC), successfully realizing the ultra wide band fiberoptic wireless collection network system, and further attaining the goal of seamless communication collection.Type: ApplicationFiled: March 6, 2006Publication date: September 6, 2007Applicant: Chang Gung UniversityInventors: Wen-Piao Lin, Jun-Yu Chen