Abstract: An electronic device includes a first circuit board, a first shielding cover and a first solder. The first circuit board has a first surface, a second surface and a first edge. The first and second surfaces are on opposite sides. The first edge is on one side of the circuit board. The first shielding cover is disposed on the first surface and covers a first region of the first circuit board. The first shielding cover includes a first main body and first and second shielding elements. The first shielding element is connected between the first main body and the second shielding element and parallel to the first surface. The second shielding element is parallel to the first edge and perpendicular to the first surface. The first solder is located between the first main body and the first region to connect the first shielding cover to the first circuit board.