Patents by Inventor Jun-Yu Zhan

Jun-Yu Zhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cable management bracket and electronic device
    Patent number: 11968796
    Abstract: A cable management bracket includes a frame and a buckle member. The frame includes a first side portion and a second side portion, wherein the first side portion is opposite to the second side portion. The first side portion has a pivot hole, a first restraining portion and a second restraining portion, wherein the first restraining portion is located between the pivot hole and the second restraining portion. The second side portion has a first engaging portion. The buckle member includes a pivot portion and a second engaging portion. The pivot portion is inserted into the pivot hole and sandwiched in between the first restraining portion and the second restraining portion. The second engaging portion is rotatably engaged with the first engaging portion.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: April 23, 2024
    Assignee: Wistron Corporation
    Inventor: Jun-Yu Zhan
  • CABLE MANAGEMENT BRACKET AND ELECTRONIC DEVICE
    Publication number: 20230209762
    Abstract: A cable management bracket includes a frame and a buckle member. The frame includes a first side portion and a second side portion, wherein the first side portion is opposite to the second side portion. The first side portion has a pivot hole, a first restraining portion and a second restraining portion, wherein the first restraining portion is located between the pivot hole and the second restraining portion. The second side portion has a first engaging portion. The buckle member includes a pivot portion and a second engaging portion. The pivot portion is inserted into the pivot hole and sandwiched in between the first restraining portion and the second restraining portion. The second engaging portion is rotatably engaged with the first engaging portion.
    Type: Application
    Filed: March 31, 2022
    Publication date: June 29, 2023
    Applicant: Wistron Corporation
    Inventor: Jun-Yu Zhan
  • Wafer-level homogeneous bonding optical structure and method to form the same
    Patent number: 11137581
    Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: October 5, 2021
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Chih-Sheng Chang, Teng-Te Huang, Shu-Hao Hsu, Jun-Yu Zhan, Jen-Hui Lai
  • WAFER-LEVEL OPTICAL STRUCTURE
    Publication number: 20200135788
    Abstract: A wafer-level optical structure includes at least two optical lens sets disposed on an optically transparent wafer, at least one trench disposed between two adjacent optical lens sets to divide the two adjacent optical lens sets, at least one spacer disposed between two adjacent optical lens sets to be correspondingly and partially disposed in the trench, and an adhesive disposed inside the trench.
    Type: Application
    Filed: October 24, 2018
    Publication date: April 30, 2020
    Inventors: Chih-Sheng Chang, Teng-Te Huang, Shu-Hao Hsu, Jun-Yu Zhan
  • Wafer-level optical structure
    Patent number: 10636829
    Abstract: A wafer-level optical structure includes at least two optical lens sets disposed on an optically transparent wafer, at least one trench disposed between two adjacent optical lens sets to divide the two adjacent optical lens sets, at least one spacer disposed between two adjacent optical lens sets to be correspondingly and partially disposed in the trench, and an adhesive disposed inside the trench.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: April 28, 2020
    Assignee: HIMAX TECHNOLOGIES LIMITED
    Inventors: Chih-Sheng Chang, Teng-Te Huang, Shu-Hao Hsu, Jun-Yu Zhan
  • WAFER-LEVEL HOMOGENEOUS BONDING OPTICAL STRUCTURE AND METHOD TO FORM THE SAME
    Publication number: 20200103633
    Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 2, 2020
    Inventors: Chih-Sheng Chang, Teng-Te Huang, Shu-Hao Hsu, Jun-Yu Zhan, Jen-Hui Lai