Patents by Inventor Junaida Abu Bakar

Junaida Abu Bakar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Minimizing flux residue by controlling amount of moisture during reflow
    Patent number: 6409070
    Abstract: A method of manufacturing a flip-chip semiconductor device by attaching a semiconductor die to a substrate using solder comprises the steps of applying a no-clean flux to the semiconductor die and the substrate; heating the solder and the flux in a furnace to bond the semiconductor die to the substrate; and underfilling between the semiconductor die and the substrate. While the solder and flux is being heated, a reducing atmosphere in the furnace is being measured to determine the moisture content. When the moisture content exceeds a threshold amount, a signal will be provided. A reflow furnace for practicing the method is also disclosed.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: June 25, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Raj N. Master, Mohammad Z. Khan, Maria G. Guardado, Diong Hing Ding, Junaida Abu Bakar