Patents by Inventor Junbo Gao

Junbo Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Achieving electromagnetic interference shielding protection by deposition of highly conductive compositions
    Patent number: 10858523
    Abstract: Provided herein are highly conductive compositions (having a volume resistivity no greater than 1×10?3 Ohms·cm) using silver flake, powder or suspension in solvent for electromagnetic interference (EMI) applications. This high conductivity will allow the use of very thin films for EMI shielding protection, which in turn will be helpful to reduce package sizes. In some embodiments, the coating composition is applied on the device surface by suitable means, e.g., by an electrostatic spray process, air spray process, ultrasonic spray process, spin coating process, or the like.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: December 8, 2020
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Junbo Gao, Qizhuo Zhuo, Xinpei Cao, Glenda Castaneda
  • ACHIEVING ELECTROMAGNETIC INTERFERENCE SHIELDING PROTECTION BY DEPOSITION OF HIGHLY CONDUCTIVE COMPOSITIONS
    Publication number: 20180163063
    Abstract: Provided herein are highly conductive compositions (having a volume resistivity no greater than 1×10?3 Ohms·cm) using silver flake, powder or suspension in solvent for electromagnetic interference (EMI) applications. This high conductivity will allow the use of very thin films for EMI shielding protection, which in turn will be helpful to reduce package sizes. In some embodiments, the coating composition is applied on the device surface by suitable means, e.g., by an electrostatic spray process, air spray process, ultrasonic spray process, spin coating process, or the like.
    Type: Application
    Filed: January 24, 2018
    Publication date: June 14, 2018
    Inventors: Junbo GAO, Qizhuo Zhou, Xinpei Cao, Glenda Castaneda
  • Chain extended epoxy to improve adhesion of conductive die attach film
    Patent number: 9200184
    Abstract: A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 1, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Junbo Gao, Gina Hoang
  • Chain Extended Epoxy to Improve Adhesion of Conductive Die Attach Film
    Publication number: 20130306916
    Abstract: A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.
    Type: Application
    Filed: March 15, 2013
    Publication date: November 21, 2013
    Applicant: Henkel Corporation
    Inventors: Junbo Gao, Gina Hoang