Abstract: The invention discloses a cannabinoid nano-micelle preparation and a preparation method thereof. The cannabinoid nano-micelle preparation includes cannabinoid and an amphiphilic polymer, wherein the content of the cannabinoid is 1-40% by weight, the content of the amphiphilic polymer is 1-99%, and the preparation method includes the following steps: (1) preparing a cannabinoid nano-micelle solution from cannabinoid and an amphiphilic polymer; (2) drying the micellar solution obtained in the step (1) to obtain cannabinoid nano-micelle powder; and (3) preparing the cannabinoid nano-micelle powder obtained in the step (2) into the cannabinoid nano-micelle preparation.

Abstract: Disclosed are an inclusion compound containing a non-psychoactive cannabinoid, and a method for preparation thereof. The inclusion compound is prepared by means of the following method: a cannabis extract is subjected to, in sequence, dissolving in organic solvent, incorporation of inclusion agent, analysis and removal of impurities in water-organic solvent, and vacuum drying and precipitation, and thus obtained. In the inclusion compound, psychoactive ingredients such as tetrahydrocannabidiol (THC) and ?9-tetrahydrocannabinol (THCV) may be completely removed, effectively enriching the non-psychoactive ingredients such as cannabidiol (CBD), cannabigerol (CBG), cannabichromene (CBC), and so on with a total content of greater than 50%. The processing technique of the preparation method is simple to perform, and is conducive to commercialization.

Abstract: Disclosed is a method for degrading cannabinoid, wherein the method carries out a photocatalytic reaction on a liquid containing cannabinoid, the method specifically comprising: (1) a photocatalytic reaction; (2) filtering; and (3) recycling of a photocatalyst. After the liquid containing the cannabinoid is treated using the method, the cannabinoid content is obviously reduced and can reach ppm-level. The raw materials and reagents used in the method are cheap and easy to obtain, the operation and testing methods are simple, and the photocatalyst can be recycled, avoiding waste of resources, and facilitating industrialization.

Abstract: The present invention discloses a repairing line system, which includes a plurality of packages, a substrate having a plurality of data lines awaiting for repair, two repairing lines, and two connecting lines. The repairing line includes outgoing lines led from the packages and a wire disposed on three sides of the substrate without the packages disposed and coupled to the outgoing lines. The wires insulatively intersect second terminals of the data lines awaiting for repair. The connecting line insulatively intersects the outgoing lines and first terminals of the data lines. The present invention further discloses a repair method of the repairing line system. The repairing line system and the repair method of the present invention utilize the same repairing lines led from different packages to connect with each other for forming whole connected wires, thereby increasing flexibility of the repairing line system in repairing data lines.

Abstract: The present invention discloses a repairing line system, which includes a plurality of packages, a substrate having a plurality of data lines awaiting for repair, two repairing lines, and two connecting lines. The repairing line includes outgoing lines led from the packages and a wire disposed on three sides of the substrate without the packages disposed and coupled to the outgoing lines. The wires insulatively intersect second terminals of the data lines awaiting for repair. The connecting line insulatively intersects the outgoing lines and first terminals of the data lines. The present invention further discloses a repair method of the repairing line system. The repairing line system and the repair method of the present invention utilize the same repairing lines led from different packages to connect with each other for forming whole connected wires, thereby increasing flexibility of the repairing line system in repairing data lines.

Abstract: The present invention discloses a repairing line system, which includes a plurality of packages, a substrate having a plurality of data lines awaiting for repair, two repairing lines, and two connecting lines. The repairing line includes outgoing lines led from the packages and a wire disposed on three sides of the substrate without the packages disposed and coupled to the outgoing lines. The wires insulatively intersect second terminals of the data lines awaiting for repair. The connecting line insulatively intersects the outgoing lines and first terminals of the data lines. The present invention further discloses a repair method of the repairing line system. The repairing line system and the repair method of the present invention utilize the same repairing lines led from different packages to connect with each other for forming whole connected wires, thereby increasing flexibility of the repairing line system in repairing data lines.

Abstract: The present invention discloses a repairing line system, which includes a plurality of packages, a substrate having a plurality of data lines awaiting for repair, two repairing lines, and two connecting lines. The repairing line includes outgoing lines led from the packages and a wire disposed on three sides of the substrate without the packages disposed and coupled to the outgoing lines. The wires insulatively intersect second terminals of the data lines awaiting for repair. The connecting line insulatively intersects the outgoing lines and first terminals of the data lines. The present invention further discloses a repair method of the repairing line system. The repairing line system and the repair method of the present invention utilize the same repairing lines led from different packages to connect with each other for forming whole connected wires, thereby increasing flexibility of the repairing line system in repairing data lines.