Patents by Inventor Juncheng GUO

Juncheng GUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12107053
    Abstract: Disclosed is a shielding process for SIP packaging, including: providing a circuit board; cutting the covering layer to form half-cut trenches separating different SIP packaging modules from each other, and to form grooves in each single SIP packaging module; forming a metal overlay, the metal overlay on an outer surface of the SIP packaging module and at positions where the half-cut trenches are located constituting a conformal shielding, the metal overlay at positions where the grooves are located constituting a compartment shielding; and cutting the half-cut trenches to obtain a plurality of SIP packaging modules that are separate from each other.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: October 1, 2024
    Assignee: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: Juncheng Guo, Dewen Tian, Qinglin Song
  • Publication number: 20220254731
    Abstract: Disclosed is a shielding process for SIP packaging, including: providing a circuit board; cutting the covering layer to form half-cut trenches separating different SIP packaging modules from each other, and to form grooves in each single SIP packaging module; forming a metal overlay, the metal overlay on an outer surface of the SIP packaging module and at positions where the half-cut trenches are located constituting a conformal shielding, the metal overlay at positions where the grooves are located constituting a compartment shielding; and cutting the half-cut trenches to obtain a plurality of SIP packaging modules that are separate from each other.
    Type: Application
    Filed: December 6, 2019
    Publication date: August 11, 2022
    Applicant: Weifang Goertek Microelectronics Co., Ltd.
    Inventors: Juncheng Guo, Dewen Tian, Qinglin Song
  • Patent number: 11291748
    Abstract: Provided are the use of poly(N-isopropylacrylamide-co-butyl methacrylate) in preparing an embolism material for blood vessels, an embolism material for blood vessels and the use thereof in preparation of drugs. The embolism material for blood vessels comprises poly(N-isopropylacrylamide-co-butyl methacrylate) and a dispersion medium consisting of an electrolyte, a contrast agent, a pH regulator and water. The concentrations of the polymer, electrolyte and contrast agent are respectively 5-30 mg/ml, 0.1-30 mg/ml and 100-350 mg/ml based on iodine. The embolism material for blood vessels is suitable for embolization therapy of tumors in hypervascular and parenchymal visceral organs.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: April 5, 2022
    Assignee: ANEW-MED LIFE SCIENCE (WUHAN) CO., LTD
    Inventors: Haixia Sun, Hong Liu, Han Li, Jian Zeng, Shuang Liu, Xin Lu, Juncheng Guo, Binghan Yuan, Ling Li
  • Publication number: 20190247536
    Abstract: Provided are the use of poly(N-isopropylacrylamide-co-butyl methacrylate) in preparing an embolism material for blood vessels, an embolism material for blood vessels and the use thereof in preparation of drugs. The embolism material for blood vessels comprises poly(N-isopropylacrylamide-co-butyl methacrylate) and a dispersion medium consisting of an electrolyte, a contrast agent, a pH regulator and water. The concentrations of the polymer, electrolyte and contrast agent are respectively 5-30 mg/ml, 0.1-30 mg/ml and 100-350 mg/ml based on iodine. The embolism material for blood vessels is suitable for embolization therapy of tumors in hypervascular and parenchymal visceral organs.
    Type: Application
    Filed: December 23, 2016
    Publication date: August 15, 2019
    Applicant: ANEW-MED LIFE SCIENCE (WUHAN) CO., LTD
    Inventors: Haixia SUN, Hong LIU, Han LI, Jian ZENG, Shuang LIU, Xin LU, Juncheng GUO, Binghan YUAN, Ling LI