Patents by Inventor Junde Zhang

Junde Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure of integrated sensor
    Patent number: 10177055
    Abstract: Provided are an encapsulation structure and encapsulation method for an integrated sensor. The encapsulation structure comprises: a first substrate (1) and a first outer housing (2), the first outer housing and first substrate enclosing a first encapsulation cavity; a plurality of sensors arranged inside the first encapsulation cavity, each of the sensors comprising MEMS sensor chips (3, 8) and ASIC chips (5, 7) electrically connected to the MEMS sensor chips; inside the first encapsulation cavity, the exterior of the ASIC chip of at least one of the sensors is provided with a shielding structure.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: January 8, 2019
    Assignee: Goertek Inc.
    Inventors: Luyu Duanmu, Junde Zhang, Qinglin Song
  • PACKAGING STRUCTURE AND METHOD OF INTEGRATED SENSOR
    Publication number: 20180068914
    Abstract: Provided are an encapsulation structure and encapsulation method for an integrated sensor. The encapsulation structure comprises: a first substrate (1) and a first outer housing (2), the first outer housing and first substrate enclosing a first encapsulation cavity; a plurality of sensors arranged inside the first encapsulation cavity, each of the sensors comprising MEMS sensor chips (3, 8) and ASIC chips (5, 7) electrically connected to the MEMS sensor chips; inside the first encapsulation cavity, the exterior of the ASIC chip of at least one of the sensors is provided with a shielding structure.
    Type: Application
    Filed: December 10, 2015
    Publication date: March 8, 2018
    Inventors: Luyu Duanmu, Junde Zhang, Qinglin Song