Patents by Inventor June Che Lu

June Che Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low dielectric resin varnish composition for laminates and the preparation thereof
    Patent number: 8362116
    Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.
    Type: Grant
    Filed: March 15, 2010
    Date of Patent: January 29, 2013
    Assignee: Nan Ya Plastics Corporation
    Inventors: Ming Jen Tzou, June Che Lu, Yi Cheng Lin
  • NOVEL LOW DIELECTRIC RESIN VARNISH COMPOSITION FOR LAMINATES AND THE PREPARATION THEREOF
    Publication number: 20110224345
    Abstract: This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic.
    Type: Application
    Filed: March 15, 2010
    Publication date: September 15, 2011
    Inventors: Ming Jen TZOU, June Che Lu, Yi Cheng Lin
  • ELECTRIC CIRCUIT BOARD COMPOSITION AND A METHOD OF PREPARING CIRCUIT BOARD
    Publication number: 20100311916
    Abstract: The present invention provides a new epoxy resin which is modified with halide and oxazolidone ring. This epoxy resin can improve the peeling strength, Tg, heat resistance, and flame resistance for CCL and be used for print circuit board. The composition comprising (A) a halogen-containing epoxy which containing a oxazolidone ring, about 5˜95 wt % of total weight, (B) epoxy resins with two or above epoxy groups, about 95˜5 wt % of total weight, (C) a curing agent, example of phenol novolac, and (D) a curing accelerator. After laminating the prepreg which had been made by impregnation of the mentioned composition at 170˜210 with 10˜30k gf/cm2, the electric circuit board composition with excellent properties can be obtained. This epoxy resin composition in this invention can achieve the peeling strength>10 lbf/inch, glass transition temperature>155, water absorption<0.2, outstanding heat resistance and pass the UL94 V-0 flame resistance test.
    Type: Application
    Filed: June 8, 2009
    Publication date: December 9, 2010
    Inventors: Ming Jen Tzou, Jung Chung CHIANG, Wen Lung WEI, June Che LU