Patents by Inventor June Gun Park

June Gun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D formed LDS liner and method of manufacturing liner
    Patent number: 9914184
    Abstract: A method of manufacturing a 3D LDS liner includes providing an LDS sheet, forming 3D contoured liners in the LDS sheet, laser structuring circuit patterns on the 3D contoured liners to provide a laser structured circuit pattern, selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners, and removing the 3D contoured liners from the LDS sheet. A formed LDS liner includes a thin LDS film having a 3D contoured surface vacuum formed from an LDS sheet. The LDS film includes an inner surface and an outer surface. A laser structured circuit pattern is etched into the LDS film, and a conductive layer is selectively plated on the laser structured circuit pattern forming a circuit on the LDS film. The circuit may have a non-planar region.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: March 13, 2018
    Assignees: TE Connectivity Corporation, Tyco Electronics AMP Korea Co., Ltd.
    Inventors: Bruce Bishop, Jung Hoon Kim, June Gun Park
  • 3D FORMED LDS LINER AND METHOD OF MANUFACTURING LINER
    Publication number: 20170095889
    Abstract: A method of manufacturing a 3D LDS liner includes providing an LDS sheet, forming 3D contoured liners in the LDS sheet, laser structuring circuit patterns on the 3D contoured liners to provide a laser structured circuit pattern, selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners, and removing the 3D contoured liners from the LDS sheet. A formed LDS liner includes a thin LDS film having a 3D contoured surface vacuum formed from an LDS sheet. The LDS film includes an inner surface and an outer surface. A laser structured circuit pattern is etched into the LDS film, and a conductive layer is selectively plated on the laser structured circuit pattern forming a circuit on the LDS film. The circuit may have a non-planar region.
    Type: Application
    Filed: October 2, 2015
    Publication date: April 6, 2017
    Inventors: Bruce Bishop, Jung Hoon Kim, June Gun Park