Abstract: To program in a nonvolatile memory device including a cell region including first metal pads and a peripheral region including second metal pads and vertically connected to the cell region by the first metal pads and the second metal pads, a memory block is provided with a plurality of sub blocks disposed in a vertical direction where the memory block includes a plurality of cell strings each including a plurality of memory cells connected in series and disposed in the vertical direction. A plurality of intermediate switching transistors are disposed in a boundary portion between two adjacent sub blocks in the vertical direction. Each of the plurality of intermediate switching transistors is selectively activated based on a program address during a program operation. The selectively activating each of the plurality of intermediate switching transistors includes selectively turning on one or more intermediate switching transistors in a selected cell string based on the program address.

Abstract: A ferroelectric memory cell has a semiconductor substrate of a first conductivity type having a first region and a second region with each being of a second conductivity type, with a channel region therebetween. The first region and the second region are aligned in a first direction. A gate dielectric is over at least a portion of the channel region. A gate is over the gate dielectric, with the gate extending in a direction transverse to the first direction termination at a termination point not overlapping the first region, the second region and the channel region. A ferroelectric capacitor is at the termination point. The ferroelectric capacitor has a first end and a second end with the first end connected to the gate. The ferroelectric memory cell has three terminals: the first region, the second region, and the second end. In another embodiment, an insulator is over at least a portion of the first region.