Patents by Inventor June-Ho Shin

June-Ho Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10547571
    Abstract: A message service providing method for a message service linked to a search service and a message server and a user terminal for performing the method are disclosed. The message service providing method includes identifying an instant message input through a message input box of a message application switching from a chat mode to a search mode or a suggested search word selected from suggested search words in a suggested search word list displayed in conjunction with the message input box, transferring, to a search server, a search request for a search word including a whole or a portion of the identified instant message or suggested search word in response to a user input provided to the message application, receiving search result data derived through the search word.
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: January 28, 2020
    Assignee: KAKAO CORP.
    Inventors: June Seong Joe, Doo Wahn Park, Won Muk Kim, Dong Ho Shin, Ji Hye Choe, Seung Jin Park, Hyun Hee Park, Ji Eun Choi, Seung Uk Seo, Yu Mi Kim, Jin Woo Choi, Yang Kyun Park
  • Publication number: 20190189668
    Abstract: A semiconductor device includes a lower device and an upper device disposed on the lower device. The lower device includes a lower substrate, a lower plug pad disposed on the lower substrate, and a lower interlayer dielectric layer on the lower plug pad. The upper device includes an upper substrate, an etch-delay structure in a lower portion of the upper substrate, an upper plug pad disposed on a bottom surface of the upper substrate, an upper interlayer dielectric layer on the upper plug pad, and a via plug configured to penetrate the upper substrate and contact the upper plug pad and the lower plug pad. The via plug includes a first portion in contact with the upper plug pad and the first etch-delay structure, and a second portion in contact with the lower plug pad.
    Type: Application
    Filed: February 11, 2019
    Publication date: June 20, 2019
    Inventors: BYUNG-JUN PARK, CHANG-ROK MOON, SEUNG-HUN SHIN, SEONG-HO OH, TAE-SEOK OH, JUNE-TAEG LEE
  • Patent number: 8877877
    Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: November 4, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Sang-Ran Koh, June-Ho Shin, Woo-Han Kim, Sung-Hwan Cha, Hyun-Jung Ahn
  • Patent number: 8512870
    Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: August 20, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn, Young-Eun Choi
  • Patent number: 8455605
    Abstract: A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: June 4, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Sang-Ran Koh, June-Ho Shin, Hyun-Jung Ahn, Sung-Hwan Cha, Young-Eun Choi, Doo-Young Jung, Sang-Kyun Kim, Jong-Seob Kim
  • Patent number: 8344075
    Abstract: A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:
    Type: Grant
    Filed: July 14, 2011
    Date of Patent: January 1, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Woo-Han Kim, June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn
  • Publication number: 20120270998
    Abstract: A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
    Type: Application
    Filed: June 28, 2012
    Publication date: October 25, 2012
    Inventors: Sang-Ran KOH, June-Ho SHIN, Hyun-Jung AHN, Sung-Hwan CHA, Young-Eun CHOI, Doo-Young JUNG, Sang-Kyun KIM, Jong-Seob KIM
  • Publication number: 20120271006
    Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:
    Type: Application
    Filed: June 28, 2012
    Publication date: October 25, 2012
    Inventors: June-Ho SHIN, Sang-Ran KOH, Sung-Hwan CHA, Hyun-Jung AHN, Young-Eun CHOI
  • Publication number: 20120046423
    Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
    Type: Application
    Filed: August 11, 2011
    Publication date: February 23, 2012
    Inventors: Sang-Ran KOH, June-Ho Shin, Woo-Han Kim, Sung-Hwan Cha, Hyun-Jung Ahn
  • Publication number: 20120029157
    Abstract: A modified siloxane polymer composition, an encapsulant, and an electronic device, the modified siloxane polymer including a modified siloxane polymer and a reticular siloxane polymer, the modified siloxane polymer including a cyclic siloxane moiety having at least two Si—O bonds with a cyclic structure, a substituted or unsubstituted linear siloxane moiety linked to Si of the cyclic siloxane moiety with a C2 to C10 alkylene group therebetween, and double bonds at its terminal ends.
    Type: Application
    Filed: July 28, 2011
    Publication date: February 2, 2012
    Inventors: Woo-Han KIM, June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn
  • Publication number: 20120016083
    Abstract: A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:
    Type: Application
    Filed: July 14, 2011
    Publication date: January 19, 2012
    Inventors: Woo-Han KIM, June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyung-Jung Ahn