Patents by Inventor June HUH

June HUH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250085674
    Abstract: Provided are a scalable analog passive intermodulation (PIM) module, a method of controlling analog PIM, a signal processing circuit, and a sensor device. The scalable analog PIM module includes a first plural number of digital-to-analog converters (DACs), a first plural number of static random access memory (SRAM) calculators connected to the first plural number of DACs, at least one analog-to-digital converter (ADC) connected to the first plural number of SRAM calculators and configured to convert an analog convolution result signal into digital convolution data, and an analog PIM controller configured to output an enable control signal for enabling a second number, which is equal to or less than first plural number, of SRAM calculators among the first plural number of SRAM calculators to the first plural number of SRAM calculators on the basis of the convolution data output from the ADC.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Applicants: SKAIChips Co., Ltd., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Kang Yoon LEE, Jong Wan JO, Sung June BYUN, Dae Young CHOI, Young Gun PU, Joon Mo YOO, Yeon Jae JUNG, Hyung Ki HUH, Seok Kee KIM
  • Publication number: 20240360350
    Abstract: Provided are a heat dissipation molding agent having an excellent heat dissipation property and a heat dissipation film formed using the heat dissipation molding agent. In two different component-type heat dissipation molding agents, various forms of heat dissipation fillers are included in a silicone resin. The heat dissipation fillers are treated to be hydrophobic, and an anti-settling agent is introduced to the heat dissipation molding agent. Accordingly, the miscibility of the heat dissipation fillers is improved and excellent heat dissipation properties are acquired.
    Type: Application
    Filed: April 27, 2023
    Publication date: October 31, 2024
    Inventors: Hak Gue YEO, June HUH, Ye Il KIM
  • Publication number: 20190322787
    Abstract: Disclosed is a triblock copolymer including two terminal blocks derived from a block copolymer and a middle block incorporated between the terminal blocks. The middle block has a higher surface energy than the terminal blocks. Also disclosed is a method for preparing the triblock copolymer. The preparation method provides a generalized approach that is highly applicable to processes for the mass production of block copolymers and can be applied to various combinations of block copolymers as well as to specific combinations of copolymers. Also disclosed is a method for nanopatterning using the triblock copolymer. The nanopatterning method enables the formation of nanopatterns with sub-10 nm feature size with simple process and reduced cost. Therefore, the nanopatterning method can be widely used in various industrial fields such as semiconductor lithography and memory devices.
    Type: Application
    Filed: April 8, 2019
    Publication date: October 24, 2019
    Applicants: Korea University Research and Business Foundation, Institute for Research & Industry Cooperation, Pusan National University
    Inventors: Joona BANG, Sanghoon WOO, Youngson CHOE, June HUH, Hyun Suk WANG
  • Patent number: 9725550
    Abstract: A block copolymer is provided. The block copolymer according to an exemplary embodiment includes a first block represented by Chemical Formula 1 and a second block represented by Chemical Formula 2: wherein COM1 and COM2 are independently selected from a polystyrene moiety, polymethylmethacrylate moiety, polyethylene oxide moiety, polyvinylpyridine moiety, polydimethylsiloxane moiety, polyferrocenyldimethylsilane moiety, and polyisoprene moiety, R1 is hydrogen or an alkyl group with 1 to 10 carbon atoms, Ph is a phenyl group, a is 1 to 50, R2 is hydrogen or an alkyl group with 1 to 10 carbon atoms, and b is 1 to 50.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: August 8, 2017
    Assignees: Samsung Display Co., Ltd., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SOGANG UNIVERSITY RESEARCH FOUNDATION
    Inventors: Min Hyuck Kang, Su Mi Lee, Myung Im Kim, Tae Woo Kim, Seung-Won Park, Xie Lei, Na Na Kang, Bong-Jin Moon, Joona Bang, Sang Hoon Woo, Jin Yeong Lee, Hyun Jung Jung, June Huh
  • Patent number: 9557639
    Abstract: A method of patterning a block copolymer layer, the method including: providing a substrate with a guide pattern formed on a surface thereof; forming a block copolymer layer on the substrate with the guide pattern, the block copolymer layer including a block copolymer; and directing self-assembly of the block copolymer on the substrate according to the guide pattern to form n/2 discrete domains, wherein the guide pattern includes a block copolymer patterning area having a 90-degree bending portion, and an outer apex and an inner apex of the 90-degree bending portion are each rounded, the outer apex having a first curvature radius r1, and the inner apex having a second curvature radius r2, respectively, and the width of the patterning area W, the first curvature radius r1 and the second curvature radius r2, satisfy Inequation 1: 2 + 2 - ( 1 + 2 ) [ ( n + 2 ) 2 n ? ( n + 1 ) ] 1 3 ? r 1 - r 2 W ? 2 + 2 - ( 1 + 2 ) [ ( n - 2 ) 2 n ? ( n - 1 )
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: January 31, 2017
    Assignees: SAMSUNG ELECTRONICS CO., LTD., YONSEI UNIVESITY, UNIVERSITY-INDUSTRY FOUNDATION(UIF)
    Inventors: Mi-Jeong Kim, In Taek Han, June Huh, Seong-Jun Jeong, Haeng Deog Koh, Youn Jung Park
  • Publication number: 20160090435
    Abstract: A block copolymer is provided. The block copolymer according to an exemplary embodiment includes a first block represented by Chemical Formula 1 and a second block represented by Chemical Formula 2: wherein COM1 and COM2 are independently selected from a polystyrene moiety, polymethylmethacrylate moiety, polyethylene oxide moiety, polyvinylpyridine moiety, polydimethylsiloxane moiety, polyferrocenyldimethylsilane moiety, and polyisoprene moiety, R1 is hydrogen or an alkyl group with 1 to 10 carbon atoms, Ph is a phenyl group, a is 1 to 50, R2 is hydrogen or an alkyl group with 1 to 10 carbon atoms, and b is 1 to 50.
    Type: Application
    Filed: December 8, 2015
    Publication date: March 31, 2016
    Inventors: Min Hyuck KANG, Su Mi LEE, Myung Im KIM, Tae Woo KIM, Seung-Won PARK, Xie LEI, Na Na KANG, Bong-Jin MOON, Joona BANG, Sang Hoon WOO, Jin Yeong LEE, Hyun Jung JUNG, June HUH
  • Patent number: 9255170
    Abstract: A block copolymer is provided. The block copolymer according to an exemplary embodiment includes a first block represented by Chemical Formula 1 and a second block represented by Chemical Formula 2: wherein COM1 and COM2 are independently selected from a polystyrene moiety, polymethylmethacrylate moiety, polyethylene oxide moiety, polyvinylpyridine moiety, polydimethylsiloxane moiety, polyferrocenyldimethylsilane moiety, and polyisoprene moiety, R1 is hydrogen or an alkyl group with 1 to 10 carbon atoms, Ph is a phenyl group, a is 1 to 50, R2 is hydrogen or an alkyl group with 1 to 10 carbon atoms, and b is 1 to 50.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: February 9, 2016
    Assignees: SAMSUNG DISPLAY CO., LTD., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SOGANG UNIVERSITY RESEARCH FOUNDATION
    Inventors: Min Hyuck Kang, Su Mi Lee, Myung Im Kim, Tae Woo Kim, Seung-Won Park, Xie Lei, Na Na Kang, Bong-Jin Moon, Joona Bang, Sang Hoon Woo, Jin Yeong Lee, Hyun Jung Jung, June Huh
  • Publication number: 20140197132
    Abstract: A block copolymer is provided. The block copolymer according to an exemplary embodiment includes a first block represented by Chemical Formula 1 and a second block represented by Chemical Formula 2: wherein COM1 and COM2 are independently selected from a polystyrene moiety, polymethylmethacrylate moiety, polyethylene oxide moiety, polyvinylpyridine moiety, polydimethylsiloxane moiety, polyferrocenyldimethylsilane moiety, and polyisoprene moiety, R1 is hydrogen or an alkyl group with 1 to 10 carbon atoms, Ph is a phenyl group, a is 1 to 50, R2 is hydrogen or an alkyl group with 1 to 10 carbon atoms, and b is 1 to 50.
    Type: Application
    Filed: November 21, 2013
    Publication date: July 17, 2014
    Applicants: Samsung Display Co., Ltd., Sogang University Research Foundation, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Min Hyuck KANG, Su Mi LEE, Myung Im KIM, Tae Woo KIM, Seung-Won PARK, Xie LEI, Na Na KANG, Bong-Jin MOON, Joona BANG, Sang Hoon WOO, Jin Yeong LEE, Hyun Jung JUNG, June HUH
  • Publication number: 20140193614
    Abstract: A method of patterning a block copolymer layer, the method including: providing a substrate with a guide pattern formed on a surface thereof; forming a block copolymer layer on the substrate with the guide pattern, the block copolymer layer including a block copolymer; and directing self-assembly of the block copolymer on the substrate according to the guide pattern to form n/2 discrete domains, wherein the guide pattern includes a block copolymer patterning area having a 90-degree bending portion, and an outer apex and an inner apex of the 90-degree bending portion are each rounded, the outer apex having a first curvature radius r1and the inner apex having a second curvature radius r2, respectively, and the width of the patterning area W, the first curvature radius r1 and the second curvature radius r2, satisfy Inequation 1: 2 + 2 - ( 1 + 2 ) [ ( n + 2 ) 2 n ? ( n + 1 ) ] 1 3 ? r 1 - r 2 W ? 2 + 2 - ( 1 + 2 ) [ ( n - 2 ) 2 n ? ( n - 1 ) ]
    Type: Application
    Filed: November 13, 2013
    Publication date: July 10, 2014
    Applicants: Yonsei University, University - Industry Foundation(UIF), SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mi-Jeong KIM, In Taek HAN, June HUH, Seong-Jun Jeong, Haeng Deog KOH, Youn Jung PARK