Abstract: An electronic device for enhancing accuracy upon contactless body temperature measurement is provided. The electronic device includes an image sensor for obtaining an image of an object, a temperature sensor disposed at a position adjacent to the image sensor for measuring a temperature of the obtained object, and a controller for performing control to determine the temperature of the object using a focal length of a camera module including the image sensor corresponding to a time of obtaining the image of the object and a temperature output from the temperature sensor corresponding to the time of obtaining the image of the object.

Abstract: A user terminal of the present invention includes a display including a screen on which an image is displayable, and configured to output light having a specific wavelength from at least a partial region of the screen; an image capturer configured to capture an image of a user's body; and a controller configured to control the display to output first light of a first wavelength range from a first region on the screen, control the image capturer to capture an image, analyze the captured image, and control the display to display analysis information on a second region of the screen.

Abstract: An electronic device for enhancing accuracy of a contactless body temperature measurement is provided. The electronic device includes a camera module for determining whether an image of an object is in focus, a temperature sensor for measuring a temperature of the object, and a processor for determining, as a temperature of the object, a temperature output from the temperature sensor corresponding to a focus matching time as a result of determining whether the image of the object is in focus.

Abstract: A mobile device and a method thereof are provided. The mobile device includes a display configured to display an image; a metal bezel surrounding an outer perimeter of the display; a temperature sensor configured to measure a temperature of an object via the metal bezel; and a controller configured to control the display to output the temperature measured using the temperature sensor.

Abstract: Disclosed are a method and apparatus for controlling a booster circuit such that maximum power is extracted from a power supply while power consumption for monitoring power generated by the power supply is reduced, and an apparatus for extracting maximum power by using the method and apparatus for controlling a booster circuit.

Abstract: A mobile device and a method thereof are provided. The mobile device includes a display configured to display an image; a metal bezel surrounding an outer perimeter of the display; a temperature sensor configured to measure a temperature of an object via the metal bezel; and a controller configured to control the display to output the temperature measured using the temperature sensor.

Abstract: An electronic device for enhancing accuracy upon contactless body temperature measurement is provided. The electronic device includes an image sensor for obtaining an image of an object, a temperature sensor disposed at a position adjacent to the image sensor for measuring a temperature of the obtained object, and a controller for performing control to determine the temperature of the object using a focal length of a camera module including the image sensor corresponding to a time of obtaining the image of the object and a temperature output from the temperature sensor corresponding to the time of obtaining the image of the object.

Abstract: An electronic device for enhancing accuracy of a contactless body temperature measurement is provided. The electronic device includes a camera module for determining whether an image of an object is in focus, a temperature sensor for measuring a temperature of the object, and a processor for determining, as a temperature of the object, a temperature output from the temperature sensor corresponding to a focus matching time as a result of determining whether the image of the object is in focus.

Abstract: Disclosed are a method and apparatus for controlling a booster circuit such that maximum power is extracted from a power supply while power consumption for monitoring power generated by the power supply is reduced, and an apparatus for extracting maximum power by using the method and apparatus for controlling a booster circuit.

Abstract: A solar cell module includes a window unit integrally formed with a transparent substrate unit, a plurality of solar cells, and an electrode unit electrically connected to the solar cells. The solar cells and the electrode unit are provided in the transparent substrate unit.

Abstract: Disclosed is an interposer including a polyhedral body having first and second surfaces facing each other, a plurality of electric terminals formed on the first surface; and a plurality of vias extending through the first and second surfaces. In addition, a semiconductor package includes a printed circuit board having a plurality of electric contacts formed on an upper surface and an interposer having first and second surfaces facing each other, vias extending through the first and second surfaces, and first electric terminals formed on the first surface. The interposer is seated on the printed circuit board so that the vias correspond to the electric contacts.

Abstract: A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit and the bottom of the recess. The main board further comprising a cover over said recess, said cover being a second integrated circuit or a second PC board, which may further having attached an integrated circuit positioned within the recess.

Abstract: Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The connection between integrated circuit chip and the attachment subject stress often leads to component failure and the addition of an interface layer with a similar thermal expansion coefficient improves reliability. The method may include applying the adhesive on the attachment subject, forming an interface layer between the integrated circuit chip and the adhesive wherein the interface layer has a thermal expansion coefficient similar to a thermal expansion coefficient of the integrated circuit chip. By connecting an integrated circuit chip and the attachment subject to each other by an adhesive via the interface layer, the generation of delamination is minimized and reliability is improved.

Abstract: A main board suitable for slim configurations is disclosed. The main board includes a multi-layer Printed Circuit Board (PCB) in which at least one recess is formed, a first integrated circuit placed in the recess, and a molding that covers the first integrated circuit and the bottom of the recess. The main board further comprising a cover over said recess, said cover being a second integrated circuit or a second PC board, which may further having attached an integrated circuit positioned within the recess.

Abstract: Disclosed is an interposer including a polyhedral body having first and second surfaces facing each other, a plurality of electric terminals formed on the first surface; and a plurality of vias extending through the first and second surfaces. In addition, a semiconductor package includes a printed circuit board having a plurality of electric contacts formed on an upper surface and an interposer having first and second surfaces facing each other, vias extending through the first and second surfaces, and first electric terminals formed on the first surface. The interposer is seated on the printed circuit board so that the vias correspond to the electric contacts.

Abstract: A semiconductor monolithic integrated optical transmitter including a plurality of active layers formed on a semiconductor substrate is disclosed, which comprises: a distributed feedback laser diode including a grating for reflecting light with a predetermined wavelength and a first active layer for oscillating received light from the grating; an electro-absorption modulator including a second active layer for receiving light from the first active layer, wherein the received light intensity is modulated through a change of absorbency in accordance with an applied voltage; an optical amplifier including a third active layer for amplifying received light from the second active layer; a first optical attenuator between the first active layer and the second active layer; and a second optical attenuator between the second active layer and the third active layer.

Abstract: An electronic circuit module and its fabricating method are provided. The electronic circuit module includes a first board and a second board having printed circuit patterns formed on the respective surfaces, and an electronic device disposed between the first board and the second board and having electrodes connected to the first board and the second board through a soldering process.

Abstract: A vertical cavity surface emitting laser (VCSEL) module includes a substrate provided with an etched region formed on a lower surface thereof, a plurality of layers, for photoproduction, laminated on an upper surface of the substrate, and a VCSEL for emitting the light upwards and downwards, wherein the VCSEL module monitors the output of the VCSEL by detecting the light emitted downwards from the VCSEL.

Abstract: A coupling structure for coupling an optical waveguide and an optical device is provided. The coupling structure enables to precisely align the optical waveguide and the optical device so that an optical-alignment error can be reduced within a range of a few ?m. The coupling structure includes a first substrate, at least one optical waveguide formed on the first substrate to transmit an optical signal, optical alignment dummy waveguides symmetrically aligned on the first substrate about the optical waveguide, a second substrate bonded to the first substrate, at least one optical device mounted on a bottom surface of the second substrate and optically connected to the optical waveguide, and optical-alignment patterns formed at the bottom surface of the second substrate corresponding to the optical alignment dummy waveguides, wherein an optical alignment for the optical waveguide and the optical device is achieved by aligning the optical alignment dummy waveguides with the optical-alignment patterns.

Abstract: A filter device for transmitting an optical signal using multiple wavelengths is disclosed. The filter device includes a fixation unit fixed to a substrate, a rotation unit having a filter rotatably installed on the fixation unit, and a control means for obtaining a predetermined wavelength by controlling the rotation angle of the filter through gear combinations corresponding positions of the fixation unit and the rotation unit. The alignment and fixation of the filter are controlled simultaneously through the gearing combinations between the gear teeth on the guide rib of the rotation unit and the teeth of the spur gear fixed to the bolt.