Patents by Inventor June-o Song

June-o Song has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220359784
    Abstract: Disclosed is a method for manufacturing a supporting substrate for a semiconductor light emitting device, the method including: preparing a substrate having a groove; introducing a material into the groove of the substrate, the material serving to form a thermal and/or electrical pass; and compressing the material inwards from both ends of the groove, using a compressing means.
    Type: Application
    Filed: June 24, 2020
    Publication date: November 10, 2022
    Inventor: June O SONG
  • Publication number: 20220302363
    Abstract: A light emitting device package including first and second frames spaced apart from each other; a body disposed between the first and second frames, the body including a cavity having a side surface; and a light emitting device disposed in the cavity. Further, the side surface of the cavity includes a first side portion spaced from the light emitting device and disposed around the light emitting device, a groove portion disposed around the first side portion, and a second side portion disposed around the groove portion.
    Type: Application
    Filed: May 16, 2022
    Publication date: September 22, 2022
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Young Shin KIM, June O. SONG, Chang Man LIM, Won Jung KIM, Ki Seok KIM
  • Publication number: 20220293548
    Abstract: A light emitting device package including a package body comprising a first opening; a light emitting device disposed in the first opening and including a first bonding part and a second bonding part; a first conductor disposed below the first bonding part; and a second conductor disposed below the second bonding part. Further, the first conductor is electrically connected to the first bonding part, and the second conductor is electrically connected to the second bonding part.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 15, 2022
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: June O SONG, Ki Seok KIM, Chang Man LIM
  • Patent number: 11398589
    Abstract: The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: July 26, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung Kim, June O Song, Chang Man Lim, Ki Seok Kim
  • Patent number: 11374153
    Abstract: A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: June 28, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: June O Song, Ki Seok Kim, Won Jung Kim
  • Patent number: 11373973
    Abstract: A light emitting device package according to an embodiment may include a first package body including first and second openings passing through the upper surface and lower surface thereof; a second package body disposed on the first package body and including a third opening passing through the upper surface and lower surface thereof; a light emitting device disposed in the third opening; a first resin disposed between the upper surface of the first package body and the light emitting device; and a second resin disposed in the third opening.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 28, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: June O Song, Ki Seok Kim, Chang Man Lim
  • Patent number: 11367809
    Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: June 21, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Patent number: 11367820
    Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 21, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Young Shin Kim, June O Song, Chang Man Lim, Won Jung Kim, Ki Seok Kim
  • Patent number: 11355679
    Abstract: The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 7, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung Kim, Ki Seok Kim, June O Song, Chang Man Lim
  • Patent number: 11342487
    Abstract: A light emitting device package according to an embodiment may comprise: a first package body including a first and a second opening; a light emitting device disposed on the first package body and including a first and a second bonding part; and a first resin disposed between the first package body and the light emitting device. The light emitting device may comprise one surface on which the first and second bonding parts are disposed, the first bonding part may comprise a first side surface and a lower surface facing the first package body, and the second bonding part may comprise a second side surface opposite to the first side surface, and a lower surface facing the first package body.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: May 24, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung Kim, Ki Seok Kim, June O Song, Chang Man Lim
  • Patent number: 11335838
    Abstract: A light emitting device including a contact layer, a blocking layer over the contact layer, a protection layer adjacent the blocking layer, a light emitter over the blocking layer, and an electrode layer coupled to the light emitter. The electrode layer overlaps the blocking layer and protection layer, and the blocking layer has an electrical conductivity that substantially blocks flow of current from the light emitter in a direction towards the contact layer. In addition, the protection layer may be conductive to allow current to flow to the light emitter or non-conductive to block current from flowing from the light emitter towards the contact layer.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: May 17, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Kwang Ki Choi, Hwan Hee Jeong, Sang Youl Lee, June O Song
  • Patent number: 11329205
    Abstract: A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: May 10, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Chang Man Lim, June O Song, Ki Seok Kim
  • Patent number: 11322667
    Abstract: A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: May 3, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Chang Man Lim, June O Song, Won Jung Kim
  • Patent number: 11302853
    Abstract: A semiconductor device package provided in an embodiment comprises: first and second frames spaced apart from each other; a body disposed between the first and second frames; and a semiconductor device disposed on the first and the second frame and comprising a semiconductor layer and a first and a second electrode on the semiconductor layer, wherein the first and the second frame comprise a first metal layer having a plurality of pores, and the first metal layer of the first and the second frame may comprise coupling portions in regions where the first metal layer overlaps the first and the second electrode, respectively.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: April 12, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Ki Seok Kim, Hee Jeong Park, June O Song, Chang Man Lim
  • Patent number: 11239394
    Abstract: Disclosed herein is a semiconductor device including a light emitting structure including a first conductive type semiconductor layer, a plurality of active layers disposed to be spaced apart on the first conductive type semiconductor layer, and a plurality of second conductive type semiconductor layers disposed on the plurality of active layers, respectively, a first electrode electrically connected to the first conductive type semiconductor layer, and a plurality of second electrodes electrically connected to the plurality of second conductive type semiconductor layers, respectively, wherein the plurality of active layers include a first active layer, a second active layer, and a third active layer, the light emitting structure includes a first light emitter including the first active layer, a second light emitter including the second active layer, and a third light emitter including the third active layer, the first active layer emits light in a blue wavelength band, the second active layer emits light in
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: February 1, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sun Woo Park, Myung Ho Han, Hyeon Min Cho, June O Song, Chung Song Kim, Ji Hyung Moon, Sang Youl Lee
  • Patent number: 11205740
    Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: December 21, 2021
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Chang Man Lim, Ki Seok Kim, Won Jung Kim, June O Song
  • Publication number: 20210257529
    Abstract: A light-emitting element package according to an embodiment comprises: a body comprising a cavity; the cavity; a first frame and a second frame arranged on the bottom surface of the cavity; a first metal layer disposed on the first frame; an ultraviolet light-emitting element disposed on the first metal layer; and a second metal layer disposed on the second frame and electrically connected to the second frame, wherein the body comprises a separation portion between the first frame and the second frame, the second metal layer extends over the sloping surface of the cavity and the separation portion of the body, and the second metal layer is spaced apart from the first metal layer in the cavity and surrounds the first metal layer.
    Type: Application
    Filed: July 19, 2019
    Publication date: August 19, 2021
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung KIM, June O SONG, Yeong June LEE
  • Publication number: 20210193890
    Abstract: A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 24, 2021
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Chang Man LIM, June O SONG, Ki Seok KIM
  • Publication number: 20210193877
    Abstract: A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively.
    Type: Application
    Filed: October 16, 2018
    Publication date: June 24, 2021
    Applicant: LG INNOTEK CO., LTD.
    Inventors: June O SONG, Ki Seok KIM, Won Jung KIM
  • Publication number: 20210184090
    Abstract: The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 17, 2021
    Inventors: Won Jung KIM, June O SONG, Chang Man LIM, Ki Seok KIM