Abstract: A power supply system includes a power supply unit (PSU) and a burst power supply module, and both the PSU and the burst power supply module are connected to a bus of the cabinet. The power supply system is configured to perform operations comprising: detecting a status of the cabinet in which the power supply system is located; and when the status indicates that a transient power-supply event occurs in the cabinet, triggering, based on a transient power supply requirement, coordination between the PSU and the burst power supply module to supply power to the cabinet. The burst power supply module is additionally disposed in the power supply system in the cabinet. When the PSU supplies power to the cabinet at a constant power, the burst power supply module connected to the bus may obtain electric energy and store the electric energy.

Abstract: A power supply circuit board is provided with a step-down converter and a power input port, and the step-down converter is electrically connected to the power input port. The power input port is configured to receive an input voltage, and the step-down converter is configured to convert the input voltage into a voltage required by a chip component. The power supply circuit board is further provided with a first connector, and the first connector is electrically connected to the step-down converter. The first connector mates with a second connector of a voltage regulator in the chip component, the first connector is disposed opposite to the second connector, and the chip component obtains, through the first connector, the voltage required by the chip component.

Abstract: An integrated cooling source apparatus is connected to an air-to-liquid heat exchange mode component through a liquid cooling pipeline and is connected to a liquid-to-liquid heat exchange mode component through the liquid cooling pipeline. The air-to-liquid heat exchange mode component and the liquid-to-liquid heat exchange mode component are connected through the liquid cooling pipeline. The integrated cooling source apparatus is configured to provide a coolant through the liquid cooling pipeline, and the coolant sequentially passes through the air-to-liquid heat exchange mode component configured to dissipate heat for a first component of a device and the liquid-to-liquid heat exchange mode component configured to dissipate heat for a second component of the device. The integrated cooling source apparatus is further configured to receive the coolant that is output after heat is dissipated for the second component.

Abstract: The present disclosure relates to heat dissipation apparatuses. In an example, a node includes a structural module, a circuit board, a liquid pipe, and a liquid leakage monitoring apparatus. The circuit board is securely mounted on the structural module, and an electronic component including a chip is disposed on the circuit board. The liquid pipe is disposed on the circuit board, and is configured to dissipate heat for the electronic component on the circuit board. The liquid leakage monitoring apparatus includes a drainage pipe sleeved outside the liquid pipe. There is a specific gap between the drainage pipe and the liquid pipe. In response to at least that leakage occurs in the liquid pipe, leaked coolant flows in the drainage pipe.

Abstract: A computing system includes a plurality of fusion nodes and a plurality of switching nodes. A first fusion node in the plurality of fusion nodes includes a plurality of computing chips and at least one first switching chip. The at least one first switching chip is configured to implement communication connection between the plurality of computing chips. A first switching node in the plurality of switching nodes is coupled to the first fusion node through a connector. The first switching node is configured to implement communication connection between the first fusion node and another fusion node in the plurality of fusion nodes. The switching chip and the computing chips are deployed nearby. A mode of orthogonal connection and two-level data exchange is used between the plurality of fusion nodes and the plurality of switching nodes, to build a high-density system with high performance, a high bandwidth, and low latency.

Abstract: The present disclosure relates to computer system power supply methods, apparatuses, and devices. In one example method, a power management circuit in a computer system obtains a parameter that affects a power supply capability, determines, based on the parameter, the power supply capability of a power supply to provide a burst power for a component in the computer system, and controls the power supply to supply power to the component in the computer system based on the power supply capability. The power management circuit determines the power supply capability of the power supply based on the real-time dynamic parameter that affects the power supply capability, and controls the power supply to provide electric energy of the burst power for the component in the computer system based on the power supply capability of the power supply.

Abstract: A server power supply includes a first voltage input line, a second voltage input line, a ground cable, a switch, and a voltage limiting device. The switch and the voltage limiting device are connected in series and located between the first voltage input line and the ground cable. When a voltage of the first voltage input line is greater than a conduction voltage, both the switch and the voltage limiting device are in an ON state, so that the server is protected from a relatively high voltage. When the voltage of the first voltage input line decreases and is less than the conduction voltage after the voltage of the first voltage input line is greater than the conduction voltage, the voltage limiting device is in an OFF state.

Abstract: The present disclosure relates to heat dissipation apparatuses. In an example, a node includes a structural module, a circuit board, a liquid pipe, and a liquid leakage monitoring apparatus. The circuit board is securely mounted on the structural module, and an electronic component including a chip is disposed on the circuit board. The liquid pipe is disposed on the circuit board, and is configured to dissipate heat for the electronic component on the circuit board. The liquid leakage monitoring apparatus includes a drainage pipe sleeved outside the liquid pipe. There is a specific gap between the drainage pipe and the liquid pipe. In response to at least that leakage occurs in the liquid pipe, leaked coolant flows in the drainage pipe.