Patents by Inventor Junfei Zhu

Junfei Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE WITH SERPENTINE CONDUCTOR AND METHOD OF MAKING
    Publication number: 20230138918
    Abstract: An integrated circuit (IC) package includes a one or more die and an interposer. The interposer is coupled to the die and includes circuit traces. The circuit traces are provided in a serpentine configuration. A method can be used to fabricate an integrated circuit package.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 4, 2023
    Inventors: Michael Wang, Cheng Lee, Joon Yeob Lee, Reza Sharifi, Liming Tsau, Junfei Zhu