Abstract: An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and first one or more conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

Abstract: The present invention discloses a moveable robot that includes a head, a main body, and a moving chassis. A transport mechanism is mounted on the lower part of the moving chassis. The head and the main body are carried by moving chassis. A moveable connection mechanism between the main body and the moving chassis enables relative movements between the two components. A sliding platform comprising a sliding mechanism between the head and the main body allows the head to move relative to the main body. A projection system can a display an image through a window in the head, and to project an interactive map on the ground. An optical sensing system can detect movements of users relative to the displayed map on the ground. The projection system and the optical sensing system in combination provides an interactive user interface for the users. The optical sensing system can also sense the environment to assist obstacle avoidance and route planning moveable robot.

Abstract: A wireless (e.g., near field or RF) communication device, and methods of manufacturing the same are disclosed. The method of manufacturing the wireless communication device includes forming an integrated circuit on a first substrate, printing stud bumps on input and/or output terminals of the integrated circuit, forming an antenna on a second substrate, and electrically connecting ends of the antenna to the stud bumps. The antenna is configured to (i) receive and (ii) transmit or broadcast wireless signals.

Abstract: The present invention discloses a moveable robot that includes a head, a main body, and a moving chassis. A transport mechanism is mounted on the lower part of the moving chassis. The head and the main body are carried by moving chassis. A moveable connection mechanism between the main body and the moving chassis enables relative movements between the two components. A sliding platform comprising a sliding mechanism between the head and the main body allows the head to move relative to the main body. A projection system can a display an image through a window in the head, and to project an interactive map on the ground. An optical sensing system can detect movements of users relative to the displayed map on the ground. The projection system and the optical sensing system in combination provides an interactive user interface for the users. The optical sensing system can also sense the environment to assist obstacle avoidance and route planning moveable robot.

Abstract: An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and first one or more conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

Abstract: An electronic sticker assembly includes a first electronic sticker comprising an upper surface, a lower surface, and a first group of conductive connection dots on the upper surface, a first adhesive layer on the first electronic sticker and comprising a first window. The first window is positioned to expose the first group of one or more conductive connection dots. A second electronic sticker on the first adhesive layer includes a lower surface and one or more second conductive connection dots on the lower surface. The first group of conductive connection dots on the upper surface of the first electronic sticker are in contact with the one or more second conductive connection dots on the lower surface of the second electronic sticker through the first window in the first adhesive layer.

Abstract: A wearable patch capable of wireless communications includes an elastic layer, an adhesive layer under the elastic layer, and a shearable electrode layer that includes: a support substrate comprising one or more openings so positioned to allow the shearable electrode layer to be sheared and elongated, and breathable, an upper electrode layer on the support substrate, and a lower electrode layer under the support substrate. The support substrate can include a via that is conductively connected to the upper electrode layer and the lower electrode layer. The lower electrode can be in contact with a user's body and to pick up electric signals from the user's body.

Abstract: A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Abstract: A wearable tag capable of wireless communications includes a first elastic layer, a second elastic layer over the first elastic layer, wherein the second elastic layer is embedded with a first conductive circuit. The wearable tag includes a dielectric layer on the second elastic layer, a third elastic layer on the dielectric layer, wherein the third elastic layer is embedded with a second conductive circuit, wherein the dielectric layer comprises via holes that contain electric connections between the semiconductor chip and the first conductive circuit. A semiconductor chip is in connection with the first conductive circuit and the second conductive circuit, wherein the semiconductor chip, the first conductive circuit, and the second conductive circuit are configured to wirelessly communicate with external devices. The wearable tag also includes a fourth elastic layer on the semiconductor chip.

Abstract: A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

Abstract: A process for producing a patterned deformable polymer film for use in a deformable polymer device is disclosed. The process includes positioning an intermediary layer between a deformable film and a process tooling and printing at least one electrode on the deformable film by depositing an ink to form the at least one electrode on a first surface of the deformable film, wherein the intermediary layer permits release of the deformable film from the process tooling subsequent to the printing process. Films produced by the inventive processes may find use in electroactive polymer devices.

Abstract: A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

Abstract: A wearable patch capable of wireless communications includes an adhesive layer, and a shearable circuit layer comprising a support substrate comprising one or more openings on the adhesive layer, wherein the one or more openings in the support substrate are so positioned to allow the shearable circuit layer to be sheared and elongated, and breathable. A conductive circuit is embedded in the support substrate. One or more semiconductor chips are in connection with the conductive circuit. An elastic layer is positioned on the shearable circuit layer. The one or more semiconductor chips and the conductive circuit can wirelessly communicate with an external device.

Abstract: A wearable patch capable of wireless communications includes an elastic layer, an adhesive layer under the elastic layer, and a shearable electrode layer that includes: a support substrate comprising one or more openings so positioned to allow the shearable electrode layer to be sheared and elongated, and breathable, an upper electrode layer on the support substrate, and a lower electrode layer under the support substrate. The support substrate can include a via that is conductively connected to the upper electrode layer and the lower electrode layer. The lower electrode can be in contact with a user's body and to pick up electric signals from the user's body.

Abstract: A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

Abstract: An electronic patch includes a first circuit layer comprising a substantially flat first substrate and a first conductive circuit, a second circuit layer comprising a substantially flat second substrate and a second conductive circuit, and an undulated ribbon that connects the first circuit layer and the second circuit layer. The undulated ribbon includes a third conductive circuit that connects the first conductive circuit and the second conductive circuit. An elastic layer encloses the first circuit layer, the second circuit layer, and the undulated ribbons.

Abstract: A three-dimensional electronic patch includes a flat flexible circuit substrate that includes an elastic layer including a first portion and a second portion. The second portion includes at least side connected to the elastic layer and one or more sides defined by one or more cuts in the elastic layer. The three-dimensional electronic patch further includes a first sensor on the first portion of the elastic layer, a first conductive sensing pad under the first portion of the elastic layer and in electrical connection with the first sensor, and a conductive layer under the second portion of the elastic layer and in electrical connection with the first sensor. The second portion is folded to position the conductive layer away from the first portion.