Patents by Inventor Jung-An Lin

Jung-An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation device and manufacturing method thereof
    Publication number: 20050230081
    Abstract: A heat dissipation device is made by skived-fin technology and has a thermal conductive portion and a plurality of fins. The fins are integrally formed with the thermal conductive portion. Each of the fins has a plurality of through holes, a top portion, and a bottom portion. The bottom portion of each fin connects with the thermal conductive portion with a curve. The thermal conductive portion, which is disposed on the bottom of the heat dissipation device, is integrally formed with the fins in one metal board.
    Type: Application
    Filed: October 12, 2004
    Publication date: October 20, 2005
    Inventor: Jung-An Lin