Patents by Inventor Jung Bae Jun

Jung Bae Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11790252
    Abstract: According to one embodiment, An apparatus for preprocessing a security log includes a field divider configured to divide a character string of a security log into a plurality of fields on the basis of a structure of the security log, an ASCII code converter configured to convert a character string included in each of the plurality of divided fields into ASCII codes, and a vector data generator configured to generate vector data for each of the plurality of divided fields using the converted ASCII codes.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: October 17, 2023
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Jang-Ho Kim, Young-Min Cho, Jung-Bae Jun, Seong-Hyeok Seo, Jang-Mi Shin
  • Publication number: 20220377095
    Abstract: A web scanning attack detection device includes a web log collector collecting web logs generated for a preset time with respect to each of at least one client connected to a web site, a field value extractor extracting field values for a target field from the web logs, a classifier calculating an appearance frequency of each of the field values in the web logs and classify each of the field values as one of a normal group and a candidate group based on the appearance frequency, and a detector calculating a similarity between each field value classified as the normal group and each field value classified as the candidate group, detects an anomaly field value among each field value classified as the candidate group based on the similarity, and detecting an anomaly web log including the anomaly field value among the web logs.
    Type: Application
    Filed: May 20, 2022
    Publication date: November 24, 2022
    Inventors: Jung-Eun LEE, Jang-Ho KIM, Jung-Bae JUN, Dae-Yong KIM
  • Patent number: 11475133
    Abstract: A method of training a malicious code detection model and a method of detecting a malicious code. The method includes acquiring application programming interface (API) call information of called functions from a result log of performing dynamic analysis of a malicious code, calculating time intervals between timestamps using the timestamps which indicate API call times extracted from the API call information, determining a feature value of the malicious code on the basis of the time intervals, and training the malicious code detection model using an API call sequence included in the API call information and the feature value.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Jang Mi Shin, Young Min Cho, Jung Bae Jun, Jang Ho Kim, Tae Jin Iyn
  • Publication number: 20210133323
    Abstract: A method of training a malicious code detection model and a method of detecting a malicious code. The method includes acquiring application programming interface (API) call information of called functions from a result log of performing dynamic analysis of a malicious code, calculating time intervals between timestamps using the timestamps which indicate API call times extracted from the API call information, determining a feature value of the malicious code on the basis of the time intervals, and training the malicious code detection model using an API call sequence included in the API call information and the feature value.
    Type: Application
    Filed: October 28, 2020
    Publication date: May 6, 2021
    Inventors: Jang Mi SHIN, Young Min CHO, Jung Bae JUN, Jang Ho KIM, Tae Jin IYN
  • Publication number: 20210136032
    Abstract: A method for generating a summary of URL (Uniform Resource Locator) according to an aspect of the inventive concept is performed by a computer device. The method may include obtaining a URL, parsing the URL to extract fields from the URL, generating attribute information indicating characteristics of each field for the fields, and generating a summary of the URL using the attribute information. A summary of an URL may be generated by reflecting structural characteristics of the URL, and the summary may be provided to URL clustering. Therefore, URL clustering in which the structural characteristics of the URL are fully reflected becomes possible. Furthermore, unlike existing machine learning-based clustering, a URL summary is generated based on rules and applied to URL clustering. Therefore, an operation time required for URL summarization or clustering is short, and it is possible to immediately reflect new data.
    Type: Application
    Filed: October 27, 2020
    Publication date: May 6, 2021
    Inventors: Jang Ho KIM, Young Min CHO, Jung Bae JUN, Jang Mi SHIN, Tae Jin IYN
  • Publication number: 20200134487
    Abstract: According to one embodiment, An apparatus for preprocessing a security log includes a field divider configured to divide a character string of a security log into a plurality of fields on the basis of a structure of the security log, an ASCII code converter configured to convert a character string included in each of the plurality of divided fields into ASCII codes, and a vector data generator configured to generate vector data for each of the plurality of divided fields using the converted ASCII codes.
    Type: Application
    Filed: October 28, 2019
    Publication date: April 30, 2020
    Inventors: Jang-Ho Kim, Young-Min Cho, Jung-Bae Jun, Seong-Hyeok Seo, Jang-Mi Shin
  • Patent number: 9181411
    Abstract: The present invention provides rigid polyurethane foam comprising thermally expandable particles which are displaced to penetrate a strut of a structure of the polyurethane foam so that the particles are exposed into one or more cells of the polyurethane foam during foaming. Further, the rigid polyurethane foam can comprise hollow thermally expanded particles which are displaced to penetrate a surface of a cell in the polyurethane foam so that the particles are exposed into one or more cells of the polyurethane foam during foaming. The rigid polyurethane of the present invention can have excellent insulating properties.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: November 10, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Kyung Hyun Baek, Jung Bae Jun, Jung Kyu Ju
  • Patent number: 9045608
    Abstract: The rigid polyurethane foam includes thermally expandable fine particles disposed between two or more adjacent cells, so as to be exposed to the inside and/or the outside of a unit cell, and a filler which is dispersed on the surface of the thermally expandable fine particles and/or on the inner and/or outer surfaces of the unit cell. The cells of the rigid polyurethane foam can be small and uniform in size and can be highly insulating.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: June 2, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Kyung Hyun Baek, Jung Bae Jun, Jung Kyu Ju
  • Patent number: 8828543
    Abstract: Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: September 9, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Tae Sub Bae, Jin Gyu Park, Jung Bae Jun, Jae Ho Lee, Jung Il Park, Sang Woon Lee
  • Patent number: 8129023
    Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films which can be used in circuit board mounting applications. The conductive particles have a uniform shape, a narrow particle diameter distribution, and appropriate compressive de-formability and recoverability from deformation. In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Further disclosed are polymer-based particles used in the conductive particles.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: March 6, 2012
    Assignee: Cheil Industries Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Jae Ho Lee, Tae Sub Bae
  • Patent number: 8089151
    Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle. Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.
    Type: Grant
    Filed: August 7, 2006
    Date of Patent: January 3, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Heung Se Lee
  • Publication number: 20110123807
    Abstract: The present invention provides a thermally expandable microsphere having a core-shell structure comprising: a shell including a thermoplastic polymer and a long-chain crosslinking agent having a weight-average molecular weight between cross-linking sites of more than about 500; and a core including a foaming agent. The thermally expandable microsphere of the present invention can have excellent foaming characteristics and an even (uniform) microsphere diameter.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 26, 2011
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Jung Bae Jun, Kyung Hyun Baek, Jung Kyu Ju
  • Publication number: 20110124753
    Abstract: The present invention provides rigid polyurethane foam comprising thermally expandable particles which are displaced to penetrate a strut of a structure of the polyurethane foam so that the particles are exposed into one or more cells of the polyurethane foam during foaming. Further, the rigid polyurethane foam can comprise hollow thermally expanded particles which are displaced to penetrate a surface of a cell in the polyurethane foam so that the particles are exposed into one or more cells of the polyurethane foam during foaming. The rigid polyurethane of the present invention can have excellent insulating properties.
    Type: Application
    Filed: November 23, 2010
    Publication date: May 26, 2011
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Kyung Hyun BAEK, Jung Bae JUN, Jung Kyu JU
  • Patent number: 7851063
    Abstract: Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films, which can be used in circuit board mounting applications. The conductive particles can exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing conductive particles including the polymer particles as a component is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Because the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, the particles can exhibit enhanced conducting properties.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: December 14, 2010
    Assignee: Cheil Industries Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Jae Ho Lee, Tae Sub Bae
  • Patent number: 7815999
    Abstract: An insulated conductive particle for an anisotropic conductive film is disclosed. One embodiment of the particle includes a conductive particle and insulating fixative particles discontinuously fixed on the surface of the conductive particle. The insulating particles provides insulation with other adjacent insulated conductive particles, while the insulated conductive particle is electrically connected between electrodes with the insulating fixative particles being deviated from its position. The instant disclosure also provides a method for manufacturing the insulated conductive particle, an anisotropic conductive adhesive film containing the insulated conductive particles, and an electrically connected structure using the film.
    Type: Grant
    Filed: November 10, 2006
    Date of Patent: October 19, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Jin Gyu Park, Tae Sub Bae, Jung Bae Jun, Jae Ho Lee, Jae Geun Hong
  • Patent number: 7566494
    Abstract: Insulated conductive particles, anisotropic adhesive films, and electrical connections using the same are provided. In some embodiments of the present invention, an insulated conductive particle includes a conductive particle with insulating microparticles bound thereto, wherein the insulating microparticles include a hard particle region and a soft functional resin region, and wherein the soft functional resin region includes a functional group capable of binding a metal.
    Type: Grant
    Filed: January 5, 2006
    Date of Patent: July 28, 2009
    Assignee: Cheil Industries, Inc.
    Inventors: Jung Bae Jun, Jin Gyu Park, Jae Ho Lee
  • Publication number: 20070145585
    Abstract: Embodiments of the present invention include a conductive particle that includes a conductive nickel/gold (Ni/Au) complex metal layer having a phosphorous content of less than about 1.5 weight percent formed on the surface of a polymer resin particle. Methods of forming the same are also included. A conductive particle with a Ni/Au complex metal layer having less than about 1.5 weight percent of phosphorous may have relatively high conductivity while providing relatively good adhesion of the Ni/Au metal layer to the polymer resin particle. Further embodiments of the present invention provide an anisotropic adhesive composition comprising a conductive particle according to an embodiment of the invention.
    Type: Application
    Filed: August 7, 2006
    Publication date: June 28, 2007
    Inventors: Jung Bae Jun, Jin Gyu Park, Heung Se Lee