Patents by Inventor Jung-Chan Cho
Jung-Chan Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240134478Abstract: A method of driving an electronic device includes displaying a plurality of fingerprint recognition icons on a display device configured to perform fingerprint recognition, and releasing a lock state of the display device through a fingerprint authentication process upon determining at least one first fingerprint recognition icon among the plurality of fingerprint recognition icons is touched. The plurality of fingerprint recognition icons include at least one first fingerprint recognition icon configured to support the fingerprint recognition and at least one second fingerprint recognition icon configured to not support the fingerprint recognition.Type: ApplicationFiled: September 7, 2023Publication date: April 25, 2024Inventors: Byung Han YOO, Jung Woo PARK, Hyang A PARK, Dae Young LEE, Hyun Dae LEE, Kang Bin JO, Sang Hwan CHO, Sung-Chan JO
-
Publication number: 20200326832Abstract: Disclosed is an electronic device including a housing, a speaker positioned at a first portion of the housing, a microphone positioned at a second portion of the housing, a touch screen display positioned at a third portion of the housing, a communication circuit positioned inside the housing or attached to the housing, a processor positioned inside the housing and operatively connected to the speaker, the microphone, the display, and the communication circuit, and a memory positioned inside the housing and operatively connected to the processor.Type: ApplicationFiled: October 10, 2018Publication date: October 15, 2020Inventors: Seo Young LEE, Joo Young SON, Jung Chan CHO, Dae Kyu SHIN, Ji Hyun KIM, Ji Yoon PARK, Da Som LEE
-
Publication number: 20140334108Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.Type: ApplicationFiled: July 24, 2014Publication date: November 13, 2014Inventors: Jin-San JUNG, Joo-Han LEE, Jung-Chan CHO, Hyun-Seok CHOI
-
Patent number: 8641453Abstract: A memory module may include a module substrate having a side portion. The side portion may be adapted or configured to be inserted into a socket of a main board. A plurality of connection pads may be arranged along the side portion. The connection pads may have a step portion of a first height from a surface of the side portion and a contact portion of a second height that is greater than the first height from the surface of the side portion. At least one semiconductor package may be mounted on the module substrate and electrically connected to the connection pads.Type: GrantFiled: August 19, 2011Date of Patent: February 4, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Jin-San Jung, Jung-Chan Cho, Hyun-Seok Choi
-
Publication number: 20120318562Abstract: A working panel includes first array board patterns arranged in a first region and including first and second guide bar patterns facing each other and N first unit board patterns, where N is a natural number greater than or equal to 2, positioned between the first and second guide bar patterns, and second array board patterns including third and fourth guide bar patterns facing each other, and M second unit board patterns, where 1?M<N, positioned between the third and fourth guide bar patterns.Type: ApplicationFiled: April 3, 2012Publication date: December 20, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kyu-Tae Kim, Yong-Hyun Kim, Jung-Chan Cho, Jin-San Jung
-
Publication number: 20120083139Abstract: A memory module may include a module substrate having a side portion. The side portion may be adapted or configured to be inserted into a socket of a main board. A plurality of connection pads may be arranged along the side portion. The connection pads may have a step portion of a first height from a surface of the side portion and a contact portion of a second height that is greater than the first height from the surface of the side portion. At least one semiconductor package may be mounted on the module substrate and electrically connected to the connection pads.Type: ApplicationFiled: August 19, 2011Publication date: April 5, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jin-San Jung, Jung-Chan Cho, Hyun-Seok Choi
-
Patent number: 8089774Abstract: A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a second surface facing the first surface. The overlap portion of the flexible PCB part overlaps the rigid PCB part, and the non-overlap portion does not overlap the rigid PCB part. The flexible PCB part may include an overlap stacked structure including at least one doubling portion.Type: GrantFiled: December 19, 2007Date of Patent: January 3, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Hyun-Seok Choi, Yong-Hyun Kim, Jung-Chan Cho, Hyung-Mo Hwang
-
Patent number: 8076772Abstract: A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal lines are electrically coupled to the electronic components. A heat sink is disposed on one surface of the interconnection substrate to dissipate heat of the electronic components, and in which no signal lines are arranged. The printed circuit board includes a bending substrate coupling the interconnection substrate to the heat sink, and formed of a flexible material configured to be bent.Type: GrantFiled: June 25, 2008Date of Patent: December 13, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Hyung-Mo Hwang, Yong-Hyun Kim, Jung-Chan Cho, Hyun-Seok Choi
-
Publication number: 20110194260Abstract: A semiconductor package module including a self-assembled organic molecule layer and a method of manufacturing the semiconductor package module is provided. The semiconductor package module may include a module printed circuit board (PCB) having a plurality of metal line patterns and a plurality of mounting pads formed thereon. The semiconductor package may further include an insulation thin film self-assembled on at least one metal line pattern selected from among the plurality of metal line patterns. In order to manufacture the semiconductor package module, the insulation thin film is formed in a manner that the plurality of metal line patterns are formed on the module PCB wherein a plurality of via holes are formed, and then an organic compound is self-assembled on a surface of at least one metal line pattern selected from the plurality of metal line patterns.Type: ApplicationFiled: January 31, 2011Publication date: August 11, 2011Applicant: Samsung Electronics Co., Ltd.Inventors: Jin-san Jung, Joo-han Lee, Jung-chan Cho, Hyun-seok Choi
-
Patent number: 7715200Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.Type: GrantFiled: September 26, 2008Date of Patent: May 11, 2010Assignees: Samsung Electronics Co., Ltd., Samsung Electro-MechanicsInventors: Jung-Chan Cho, Yang-Je Lee, Hyun-Seok Choi, Yong-Hyun Kim, Jung-Hyeon Kim, Hyo-Jae Bang, Do-Hyung Kim, Kyoung-Sun Kim, Young-Ho Lee, Jae-Sang Baik, Yong-Jin Kim
-
Publication number: 20090129041Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.Type: ApplicationFiled: September 26, 2008Publication date: May 21, 2009Inventors: Jung-Chan Cho, Yang-Je Lee, Hyun-Seok Choi, Yong-Hyun Kim, Jung-Hyeon Kim, Hyo-Jae Bang, Do-Hyung Kim, Kyoung-Sun Kim, Young-Ho Lee, Jae-Sang Baik, Yong-Jin Kim
-
Publication number: 20080315402Abstract: A printed circuit board, a memory module having the same, and a fabrication method thereof. The printed circuit board includes an interconnection substrate on which electronic components are mounted and in which a plurality of signal lines are arranged. The signal lines are electrically coupled to the electronic components. A heat sink is disposed on one surface of the interconnection substrate to dissipate heat of the electronic components, and in which no signal lines are arranged. The printed circuit board includes a bending substrate coupling the interconnection substrate to the heat sink, and formed of a flexible material configured to be bent.Type: ApplicationFiled: June 25, 2008Publication date: December 25, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyung-Mo Hwang, Yong-Hyun Kim, Jung-Chan Cho, Hyun-Seok Choi
-
Publication number: 20080186685Abstract: The invention provides a semiconductor memory module. The semiconductor memory module includes a printed circuit board part having a first surface and a second surface facing the first surface, and a metal core having an insert part inserted inside the printed circuit board part and an extension part elongated from at least one side of the printed circuit board. The semiconductor memory module also includes memory parts mounted on the printed circuit board. The metal core has a folding structure having at least one bent portion to substantially cover the memory parts.Type: ApplicationFiled: January 11, 2008Publication date: August 7, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jung-Chan CHO, Hyun-Seok CHOI, Yong-Hyun KIM, Hyung-Mo HWANG, Kyu-Tae KIM
-
Publication number: 20080149372Abstract: A semiconductor memory module includes a printed circuit board (PCB) including a rigid PCB part and a flexible PCB part including an overlap portion, a non-overlap portion, and memory components mounted on the PCB. The rigid PCB part includes a first surface and a second surface facing the first surface. The overlap portion of the flexible PCB part overlaps the rigid PCB part, and the non-overlap portion does not overlap the rigid PCB part. The flexible PCB part may include an overlap stacked structure including at least one doubling portion.Type: ApplicationFiled: December 19, 2007Publication date: June 26, 2008Inventors: Hyun-Seok Choi, Yong-Hyun Kim, Jung-Chan Cho, Hyung-Mo Hwang
-
Publication number: 20070001295Abstract: A semiconductor device and a method of fabricating the same may be provided. The semiconductor device may include an insulation material as a base frame of a PCB, including an opening penetrating the insulation material with sidewalls plated with a gold (Au) layer. The semiconductor device may further include a printed circuit board for use in a module, having a pad whose surface may be coated with an organic solderability preservative (OSP) and an opening whose sidewalls may be plated with a nickel (Ni) layer and a gold (Au) layer, and a semiconductor device mounted on the PCB via the pad. During a temperature cycling reliability test on the semiconductor device, no defects, for example, cracks may form inside the opening.Type: ApplicationFiled: June 19, 2006Publication date: January 4, 2007Inventors: Jung-Chan Cho, Byung-Man Kim, Yong-Hyun Kim