Abstract: A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.

Abstract: A collapsible computer table and frame includes two pairs of folding frames, a table board, an upper placing board and a lower placing board. Each folding frame consists of a horizontal frame rod for fixing a table board, a back frame rod with a lower end pivotally connected with an end of the horizontal frame rods, and a front feet and a rear feet pivotally connected with the horizontal frame rods. The back frame rod has its lower end pivotally connected with the horizontal frame rod and the rear feet. The folding connect rods are pivotally connected between the upper placing board to let the upper placing board to swing. The table board is fixed on the horizontal frame rods, folding connect rods are provided between the front and the rare foot, and then the whole computer table and frame can be easily collapsed.