Patents by Inventor Jung-Chi Liu

Jung-Chi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BURIED METAL TRACK AND METHODS FORMING SAME
    Publication number: 20240371868
    Abstract: An integrated circuit includes a semiconductor substrate, an isolation region extending into, and overlying a bulk portion of, the semiconductor substrate, a buried conductive track comprising a portion in the isolation region, and a transistor having a source/drain region and a gate electrode. The source/drain region or the gate electrode is connected to the buried conductive track.
    Type: Application
    Filed: July 16, 2024
    Publication date: November 7, 2024
    Inventors: Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang, Ru-Gun Liu, Shih-Ming Chang, Ya-Chi Chou, Yi-Hsiung Lin, Yu-Xuan Huang, Guo-Huei Wu, Yu-Jung Chang
  • Buried metal track and methods forming same
    Patent number: 12125850
    Abstract: An integrated circuit includes a semiconductor substrate, an isolation region extending into, and overlying a bulk portion of, the semiconductor substrate, a buried conductive track comprising a portion in the isolation region, and a transistor having a source/drain region and a gate electrode. The source/drain region or the gate electrode is connected to the buried conductive track.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: October 22, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pochun Wang, Ting-Wei Chiang, Chih-Ming Lai, Hui-Zhong Zhuang, Jung-Chan Yang, Ru-Gun Liu, Shih-Ming Chang, Ya-Chi Chou, Yi-Hsiung Lin, Yu-Xuan Huang, Guo-Huei Wu, Yu-Jung Chang
  • ELECTRONIC DEVICE WITH IMPROVED HEAT DISSIPATION
    Publication number: 20150316966
    Abstract: An electronic device may include: a circuit board having a board surface; a heat-generating source including a first electronic component mounted on the board surface of the circuit board; and a heat dissipating panel stacked over the circuit board, having a panel surface, and formed with a first recess that is indented inwardly from the panel surface and that is defined by a first recess-defining wall. The first electronic component protrudes from the board surface into the first recess to contact the first recess-defining wall.
    Type: Application
    Filed: April 28, 2015
    Publication date: November 5, 2015
    Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.
    Inventors: Yung-Chih CHEN, Jun-Wei SU, Chien-Hsiang HSIEH, Jung-Chi LIU, Yu-Lin HSIEH
  • Fixing element capable of rotatably fixing a ribbon roller in a ribbon cartridge
    Patent number: 7223032
    Abstract: A ribbon roller is fixed in a ribbon cartridge via a fixing element. The fixing element includes an accommodation means and a fastening element. The accommodation means fixes a tab of the ribbon roller, and the fastening element engages the ribbon cartridge. When transporting the ribbon cartridge, the fixing element is capable of preventing the ribbon roller from rotating so as to prevent the ribbon from wrinkling and affecting printing quality.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: May 29, 2007
    Assignee: Hi-Touch Imaging Technologies Co., Ltd.
    Inventors: Jung-Chi Liu, Yu-Feng Lin
  • FIXING ELEMENT CAPABLE OF ROTATABLY FIXING A RIBBON ROLLER IN A RIBBON CARTRIDGE
    Publication number: 20070041769
    Abstract: A ribbon roller is fixed in a ribbon cartridge via a fixing element. The fixing element includes an accommodation means and a fastening element. The accommodation means fixes a tab of the ribbon roller, and the fastening element engages the ribbon cartridge. When transporting the ribbon cartridge, the fixing element is capable of preventing the ribbon roller from rotating so as to prevent the ribbon from wrinkling and affecting printing quality.
    Type: Application
    Filed: October 24, 2005
    Publication date: February 22, 2007
    Inventors: Jung-Chi Liu, Yu-Feng Lin