Patents by Inventor Jung-Chien Chang
Jung-Chien Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8581114Abstract: A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion.Type: GrantFiled: February 3, 2010Date of Patent: November 12, 2013Assignees: Planarmag, Inc., Mutual-Tek Industries Co., Ltd.Inventors: William Lee Harrison, Jung-Chien Chang
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Patent number: 8516693Abstract: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate.Type: GrantFiled: April 9, 2009Date of Patent: August 27, 2013Assignee: Mutual-Tek Industries Co., Ltd.Inventor: Jung-Chien Chang
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Publication number: 20130190677Abstract: Disclosed is a photo-stimulation method employing an agonist agent, and a kit for introducing same. The method includes the following steps: providing a light-emitting diode (LED) illuminant which is a yellow, red, green, blue LED or a mixture of two or more kinds thereof, and an agonist agent which contains 0.5% to 2% calcium ion; and adding the agonist agent to a subject and illuminating the subject by the LED illuminant to promote collagen synthesis, to suppress microbial growth, or to inhibit melanin synthesis, wherein the yellow LED is in an illuminance range from 1,000 to 3,500 lux, the red LED is in an illuminance range from 6,000 to 9,500 lux, the green LED is in an illuminance range from 1000 to 5000 lux, and the blue LED is in an illuminance range from 3,000 to 7,000 lux.Type: ApplicationFiled: May 14, 2012Publication date: July 25, 2013Applicant: Forward Electronics Co., Ltd.Inventors: Ming-Chieh TU, Yi-Wei HSIAO, Chung-Pei LEE, Jung-Chien CHANG, Xin-Fan HUANG, Yu-Chia TSAO
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Publication number: 20130190844Abstract: Disclosed is a photo-stimulation method and device with a light mixture. The method includes the following steps: providing a light-emitting diode (LED) illuminant which is a combination of a yellow LED and a red LED; and illuminating a subject by the LED illuminant to promote collagen synthesis, to suppress microbial growth, or to inhibit melanin synthesis, wherein the yellow LED is in an illuminance range from 1,000 to 3,500 lux, the red LED is in an illuminance range from 6,000 to 9,500 lux, and the number ratio of the yellow LED to the red LED is 0.5-2:0.5-2.Type: ApplicationFiled: May 14, 2012Publication date: July 25, 2013Applicant: Forward Electronics Co., Ltd.Inventors: Ming-Chieh TU, Yi-Wei Hsiao, Chung-Pei Lee, Jung-Chien Chang, Yu-Chia Tsao
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Publication number: 20130190843Abstract: Disclosed is a photo-stimulation method and device. The method includes the following steps: providing a light-emitting diode (LED) illuminant which is a yellow, red, or blue LED; and illuminating a subject by the LED illuminant to promote collagen synthesis, to suppress microbial growth, or to inhibit melanin synthesis, wherein the yellow LED is in an illuminance range from 1,000 to 3,500 lux, the red LED is in an illuminance range from 6,000 to 9,500 lux, and the blue LED is in an illuminance range from 3,000 to 7,000 lux.Type: ApplicationFiled: May 14, 2012Publication date: July 25, 2013Applicant: Forward Electronics Co., Ltd.Inventors: Ming-Chieh TU, Yi-Wei Hsiao, Chung-Pei Lee, Jung-Chien Chang, Yu-Chia Tsao
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Patent number: 8478396Abstract: A phototherapy patch is disclosed, which includes: an adhesive layer, having a first surface and an opposite second surface; a pharmaceutical drug layer, disposed on the first surface of the adhesive layer; and a spontaneous emission layer, disposed over the pharmaceutical drug layer and capable of emitting therapeutic light by light illumination or a chemical reaction. Accordingly, the phototherapy patch according to the present invention has no power supply disposed therein, and thereby is suitable to be manufactured as a particularly thin and thus inconspicuous device.Type: GrantFiled: July 19, 2012Date of Patent: July 2, 2013Assignee: Forward Electronics Co., Ltd.Inventors: Yu-Chia Tsao, Yi-Wen Yang, Jung-Chien Chang
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Publication number: 20130096657Abstract: The present invention relates to a phototherapy device, which is driven by a power supply and includes: a housing, having a top portion, a bottom portion and a handheld portion, where the top portion has a light outlet, the handheld portion connects the top portion and the bottom portion, and the handheld portion has at least one protruding part; a light-transmitting plate, which covers the light outlet; a light-blocking part, formed into a protruding rim along the circumferential direction of the light outlet; an LED module, disposed in the housing and corresponding to the light outlet; and a control module, electrically connected to the power supply and the LED module. Accordingly, the phototherapy device according to the present invention is suitable for handheld use.Type: ApplicationFiled: May 31, 2012Publication date: April 18, 2013Applicant: Forward Electronics Co., Ltd.Inventors: Yi-Wen YANG, Jung-Chien Chang, Ming-Da Yang, Chen-Ho Cheng, Yu-Chia Tsao
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Publication number: 20120314390Abstract: A multilayer circuit board includes a first circuit layer, an insulating layer, a second circuit layer, an intermediate frame, an electronic element, and a third circuit layer. The insulating layer is disposed on the first circuit layer, and the second circuit layer is disposed on the insulating layer. The intermediate frame is disposed on the second circuit layer and has an accommodating space. The electronic element is disposed on the second circuit layer, electrically connected to the second circuit layer and located in the accommodating space. The third circuit layer is disposed on the intermediate frame.Type: ApplicationFiled: August 23, 2012Publication date: December 13, 2012Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.Inventor: Jung-Chien Chang
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Publication number: 20120140232Abstract: An SPR optical fiber sensor and an SPR sensing device using the same are disclosed. The SPR optical fiber sensor includes: an optical fiber substrate having a sensing area; a first metal layer disposed on the sensing area of the fiber substrate; and a second metal layer which is a gold layer and disposed on the first metal layer. In the present invention, two or more layers of different metals are stacked on the sensing area and thus the SPR measurable range can be promoted to improve the sensitivity and chemical stability of the SPR optical fiber sensor.Type: ApplicationFiled: March 2, 2011Publication date: June 7, 2012Applicant: Forward Electronics Co., LtdInventors: Chung-Pei Lee, Yu-Chia Tsao, Jung-Chien Chang
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Patent number: 8110840Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed.Type: GrantFiled: July 12, 2010Date of Patent: February 7, 2012Assignee: Mutual-Tek Undustries Co., Ltd.Inventor: Jung-Chien Chang
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Publication number: 20120013243Abstract: The present invention provides a phosphor composition for AC LEDs, which is represented by the following formula (I): M1?x?ySi2O2?wN2+2w/3:Eux,Ry??(I) wherein, M, R, x, y, and w are defined the same as the specification. In addition, the present invention also provides an AC LED manufactured with the same.Type: ApplicationFiled: September 8, 2010Publication date: January 19, 2012Applicant: Forward Electronics Co., LtdInventors: Ru-Shi Liu, Chiao-Wen Yeh, Hui-Wen Hsu, Wen-Hsiung Li, Jung-Chien Chang, Yu-Bing Lan
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Publication number: 20110307035Abstract: A phototherapy device is disclosed, which is driven by a power supply and includes: an LED module, driven by the power supply to emit therapeutic light; and a polarizer, disposed in a direction toward which the therapeutic light is emitted by the LED module. Accordingly, the phototherapy device according to the present invention can use light of low intensity to achieve therapeutic effect and thereby can be designed in a portable form.Type: ApplicationFiled: October 28, 2010Publication date: December 15, 2011Applicant: Forward Electronics Co., Ltd.Inventors: Yu-Chia Tsao, Yi-Wen Yang, Jung-Chien Chang, Jia-Huey Tsao, Yen-Chun Chen, Hsueh-Ching Shih
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Publication number: 20110306918Abstract: A phototherapy patch is disclosed, which includes: an adhesive layer, having a first surface and an opposite second surface; a pharmaceutical drug layer, disposed on the first surface of the adhesive layer; and a spontaneous emission layer, disposed over the pharmaceutical drug layer and capable of emitting therapeutic light by light illumination or a chemical reaction. Accordingly, the phototherapy patch according to the present invention has no power supply disposed therein, and thereby is suitable to be manufactured as a particularly thin and thus inconspicuous device.Type: ApplicationFiled: August 18, 2010Publication date: December 15, 2011Applicant: Forward Electronics Co., Ltd.Inventors: Yu-Chia Tsao, Yi-Wen Yang, Jung-Chien Chang
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Publication number: 20110216514Abstract: A combined multilayered circuit board is provided. The combined multilayered circuit board includes a plurality of multilayered circuit boards, at least one of the plurality circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component. The internal chamber is full of air. The combined multilayered circuit board further includes at least one glue layer interposed between each of the plurality of multiple circuit boards for bonding the plurality of multilayered circuit boards together.Type: ApplicationFiled: February 24, 2011Publication date: September 8, 2011Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.Inventor: Jung-Chien Chang
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Publication number: 20110171070Abstract: A method for surface-modifying a sensor device is disclosed, which includes the following steps: providing a sensor device, wherein a surface of the sensor device has a metal film; forming a surface-modification layer having a plurality of carboxyl groups on the metal film of the sensor device by isopropyl alcohol plasma; and forming a poly(acrylic acid) layer on the surface-modification layer, wherein the acrylic acid of the poly(acrylic acid) layer is grafted to the carboxyl of the surface-modification layer. A surface-modified sensor device is also disclosed.Type: ApplicationFiled: March 23, 2011Publication date: July 14, 2011Applicant: Forward Electronics Co., Ltd.Inventors: Shu-Ting CHANG, Hsiao-Ling Yeh, Yu-Chia Tsao, Jung-Chien Chang, Jia-Huey Tsao, Ko-Shao Chen
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Publication number: 20110168438Abstract: The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit.Type: ApplicationFiled: March 23, 2011Publication date: July 14, 2011Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.Inventor: Jung-Chien Chang
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Publication number: 20110108317Abstract: A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion.Type: ApplicationFiled: February 3, 2010Publication date: May 12, 2011Inventors: William Lee HARRISON, Jung-Chien CHANG
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Patent number: 7866202Abstract: Disclosed is a method of fabricating a carbon monoxide detector and a carbon monoxide detector fabricated using the same. Particularly disclosed is a method of fabricating a carbon monoxide detector, which can operate at room temperature and process high detecting selection, and the detector fabricated using the same. The method comprises: providing a substrate having an upper surface; forming two electrode sets on the upper surface of the substrate, and the two electrode sets combined to provide an interdigitated array electrode; forming a tin dioxide layer, which covers the portion of the two electrode sets and the portion of the upper surface; and forming an organic polymer layer on the surface of the tin dioxide layer.Type: GrantFiled: May 16, 2008Date of Patent: January 11, 2011Assignee: Forward Electronics Co., Ltd.Inventors: Ko-Shao Chen, Shu-Juan Liao, Yun-Huang Chen, Jung-Chien Chang
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Publication number: 20100276718Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed.Type: ApplicationFiled: July 12, 2010Publication date: November 4, 2010Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.Inventor: Jung-Chien Chang
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Patent number: D684269Type: GrantFiled: May 22, 2012Date of Patent: June 11, 2013Assignee: Forward Electronics Co., Ltd.Inventors: Chun-Chieh Wang, Ming-Chieh Tu, Chung-Pei Lee, Jung-Chien Chang, Ciou-Jyun Liou