Patents by Inventor Jung-Chou Oung

Jung-Chou Oung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8323348
    Abstract: This invention relates to a bone implant that includes a bioinert substrate covered with a ceramic layer containing a plurality of indentations. The total surface area of the indentations is 30-70% of the total surface area of the ceramic layer. This invention also relates to a method of preparing such a bone implant. The method includes: (1) affixing a ceramic layer on the surface of a bioinert substrate; (2) forming a plurality of indentations in the ceramic layer, wherein the total surface area of the indentations is 30-70% of the total surface area of the ceramic layer; and (3) immobilizing a biopolymer onto the ceramic layer via covalent bonding.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: December 4, 2012
    Assignee: Taiyen Biotech Co., Ltd.
    Inventors: Wen-Fu T. Lai, Li-Chern Pan, Pau-Yee Lim, Jung-Chou Oung, Chun-Wei Chen
  • Patent number: 8004386
    Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: August 23, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chung Chen, Hung-Kun Lee, Jung-Chou Oung
  • Publication number: 20090256670
    Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.
    Type: Application
    Filed: June 9, 2008
    Publication date: October 15, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Chung Chen, Hung-Kun Lee, Jung-Chou Oung
  • Publication number: 20060190091
    Abstract: This invention relates to a bone implant that includes a bioinert substrate covered with a ceramic layer containing a plurality of indentations. The total surface area of the indentations is 30-70% of the total surface area of the ceramic layer. This invention also relates to a method of preparing such a bone implant. The method includes: (1) affixing a ceramic layer on the surface of a bioinert substrate; (2) forming a plurality of indentations in the ceramic layer, wherein the total surface area of the indentations is 30-70% of the total surface area of the ceramic layer; and (3) immobilizing a biopolymer onto the ceramic layer via covalent bonding.
    Type: Application
    Filed: February 22, 2005
    Publication date: August 24, 2006
    Inventors: Wen-Fu Lai, Li-Chern Pan, Pau-Yee Lim, Jung-Chou Oung, Chun-Wei Chen
  • Publication number: 20050139492
    Abstract: An electrochemical method is provided, whereby electrodes are coated with conductive diamond film material. The method detects the concentration of metal ions and organic compounds in solutions by using square wave voltammetry of pulsed voltammetry. Since the electrodes coated with conductive diamond film material enable the user to obtain broader range of voltage measurement, the number of chemicals detected is greatly increased and the accuracy thereof improved.
    Type: Application
    Filed: June 3, 2004
    Publication date: June 30, 2005
    Applicant: Industrial Technology Research Institute
    Inventors: Shan-Shan Chou, Shu-Fang Hsu, Pau-Yee Lin, Hsuan-Chin Lai, Jung-Chou Oung
  • Publication number: 20040108211
    Abstract: A surface treatment for a wrought copper foil relatives to a surface treatment procedure for a wrought cooper foil for use on a flexible PCB. The surface treatment comprises the steps of bi-polar electrochemical degreasing, acid etching and nodularization, electroplating a barrier layer and an anti-tarnish layer and coating a silane coupling agent layer to a copper foil. One side of the copper foil is nodularization, and a Zn—Ni barrier layer and a Cr—Zn anti-tarnish layer are electroplated on the copper foil. Finally, the organic silane coupling agent is coated to the roughened surface of the copper foil to modify the surface characters to impart the peel strength. Whereby, the cooper foil has very low profile, high peel strength, finer-pattern property, low HCl undercut and high thermal oxidation property.
    Type: Application
    Filed: December 6, 2002
    Publication date: June 10, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Chiu-Yen Chiu, Jung-Chou Oung, Jin-Yaw Liu
  • Publication number: 20040031689
    Abstract: An electrochemical catalyst electrode to increase bonding durability between covering layers and a metal substrate is made by processing a metal substrate at a high temperature and etching the metal substrate to form a large number of etching pores on granular surfaces; heating the metal substrate to transform the surface thereof to an oxygen interstitial layer; laminating an inner covering layer which is compatible to the oxygen interstitial layer on the metal substrate and deeply planted into the pores to form included angles to increase adhering force between the inner covering layer and the substrate and to reduce peeling on the interface; and forming an outer covering layer on the layers with stabilizing additive added in the outer covering layer to enhance the stability of the outer surface of the covering layers thereby to reduce dissolution of noble metal; and greatly increase stability and durability of the electrode.
    Type: Application
    Filed: August 19, 2002
    Publication date: February 19, 2004
    Applicant: Industrial Technology Research Institute
    Inventors: Pau-Yee Lim, Yeushin Yen, Li-Chen Kuo, Jung-Chou Oung, Husan-Chin Lau