Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.

Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

Abstract: A rotor apparatus includes: a rotor configured to rotate around a rotational axis; an angular position identification layer disposed to surround the rotational axis and configured to rotate according to rotation of the rotor, and having a width varying with angular positions of the rotor; and an angular range identification layer disposed to surround the rotational axis and configured to rotate according to the rotation of the rotor, and configured such that a plurality of portions of the angular range identification layer respectively corresponding to a plurality of different angular position ranges of the rotor have different overall widths.

Abstract: A touch operation sensing device configured to be added to an electronic device, the electronic device including a touch member disposed in a housing and having conductivity, the touch operation sensing device includes an oscillation circuit disposed on an internal side of the touch member and including an inductor element and a capacitor element to generate an oscillation signal in response to changed impedance during a touch operation through the touch member, and an insulating member disposed between a first terminal of the inductor element and the touch member, and between a second terminal of the inductor element and the touch member.

Abstract: A rotor apparatus includes: a rotor configured to rotate around a rotational axis; an angular position identification layer disposed to surround the rotational axis and configured to rotate according to rotation of the rotor, and having a width varying with angular positions of the rotor; and an angular range identification layer disposed to surround the rotational axis and configured to rotate according to the rotation of the rotor, and configured such that a plurality of portions of the angular range identification layer respectively corresponding to a plurality of different angular position ranges of the rotor have different overall widths.

Abstract: A touch sensing device in an electronic device, the electronic device including a touch manipulation unit disposed in a housing of the electronic device, the touch manipulation unit including a first insulating member penetrating through the housing, the touch sensing device including a first sensor unit disposed on an internal surface of the first insulating member, and an oscillation circuit connected to the first sensor unit, the oscillation circuit being configured to generate a first oscillation signal having a first resonance frequency that varies in response to a touch capacitance generated in response to the first insulating member being touched, wherein the first sensor unit contacts the internal surface of the first insulating member, and does not contact the housing.

Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.

Abstract: An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

Abstract: A touch sensing device applied to an electronic device including a side portion having a cover that is nonconductive, and a frame that is conductive, includes: a first touch sensing portion including a first sensing electrode and a first sensing inductor disposed inside the cover and electrically connected to each other, wherein, in response to a touch applied through the cover by a human body, a capacitance is varied by the first touch sensing portion according to parasitic capacitance generated between the first sensing electrode and the human body according to the touch applied through the cover; and a reference sensing portion including a reference coil disposed inside the side portion and configured to provide reference inductance of the reference coil that is constant, regardless of a touch applied through the frame.

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

Abstract: A touch sensing device in an electronic device, the electronic device including a touch manipulation unit disposed in a housing of the electronic device, the touch manipulation unit including a first insulating member penetrating through the housing, the touch sensing device including a first sensor unit disposed on an internal surface of the first insulating member, and an oscillation circuit connected to the first sensor unit, the oscillation circuit being configured to generate a first oscillation signal having a first resonance frequency that varies in response to a touch capacitance generated in response to the first insulating member being touched, wherein the first sensor unit contacts the internal surface of the first insulating member, and does not contact the housing.

Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

Abstract: A touch operation sensing device configured to be added to an electronic device, the electronic device including a touch member disposed in a housing and having conductivity, the touch operation sensing device includes an oscillation circuit disposed on an internal side of the touch member and including an inductor element and a capacitor element to generate an oscillation signal in response to changed impedance during a touch operation through the touch member, and an insulating member disposed between a first terminal of the inductor element and the touch member, and between a second terminal of the inductor element and the touch member.

Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

Abstract: A fan-out semiconductor package module that is easily manufactured includes a first connection member including a wiring layer, a first passive component mounted on the first connection member, a first encapsulation portion encapsulating at least a portion of the first connection member and the first passive component, a semiconductor chip having an active surface with a connection pad disposed thereon and an inactive surface opposing the active surface and disposed in a first through-hole penetrating through the first connection member and the first encapsulation portion, a second encapsulation portion covering at least a portion of the semiconductor chip and encapsulating at least a portion of the first encapsulation portion and the first connection member, and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad and the first passive component.

Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.

Abstract: An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.