Abstract: The present disclosure relates to a ceramic susceptor including a ceramic plate having an electrode disposed thereon, wherein the ceramic plate may include an electrode pad connected to the electrode and an electrode rod having one end connected to the electrode pad to supply power to the electrode, and the electrode rod may include an extension part connected to the electrode pad and a power connection part provided at an end of a tapered portion of the extension part.

Abstract: Disclosed is a susceptor including a purge gas channel for supplying purge gas. The present disclosure provides a susceptor including: a plate having a heating element layer embedded therein; and a hollow shaft joined to a bottom of the plate, wherein the plate includes a purge gas channel layer disposed on a plane different from that of the heating element layer, and the purge gas channel layer includes an internal channel and multiple radial branch channels extending outward from the internal channel.

Abstract: An embodiment of the present disclosure provides a ceramic heater including a plate having a heat-generation body and a first passage, a shaft having a hollow, and a thermocouple inserted into the first passage, wherein the first passage includes an A-th passage part parallel with a first surface of the plate and a B-th passage part inclined with respect to the first surface. Furthermore, an embodiment of the present disclosure provides a ceramic heater including a plate having a heat-generation body and a first passage, a shaft having a hollow, and a thermocouple inserted into the first passage, wherein the first passage includes an A-th passage part parallel with an upper surface of the plate, and a C-th passage part disposed between the A-th passage part and an upper end portion of the shaft and gradually narrowing from the upper end portion of the shaft to the A-th passage.

Abstract: Disclosed is a susceptor for high-temperature use having a shaft with low thermal conductivity, wherein in a susceptor including a plate for wafer mounting and a shaft coupled to the plate, the plate and the shaft each include a sintered body having 90 wt % or more of an AlN phase, the sintered body of the plate is a magnesium-containing AlN sintered body having a volume resistance of 5*108 ?·cm or more at 650° C., and the sintered body of the shaft is an AlN sintered body having a room-temperature thermal conductivity of 100 W/mK or less.

Abstract: The present invention relates to a ceramic heater. The ceramic heater of the present invention comprises: a heater plate in which a heating element is disposed and which is made of a ceramic material; a shaft which has a tubular shape with a through-hole and is coupled to the bottom surface of the heater plate and in which a rod for supplying power to the heating element through the through-hole is received; and a continuous or discontinuous air pocket which is provided in a joint with which the heater plate and the shaft come into contact and by which the heater plate and the shaft are coupled to each other, wherein the air pocket is formed along the joining surface of the joint.

Abstract: The present invention relates to a ceramic heater. The ceramic heater of the present invention comprises: a heater plate in which a heating element is disposed and which is made of a ceramic material; a shaft which has a tubular shape with a through-hole and is coupled to the bottom surface of the heater plate and in which a rod for supplying power to the heating element through the through-hole is received; and a continuous or discontinuous air pocket which is provided in a joint with which the heater plate and the shaft come into contact and by which the heater plate and the shaft are coupled to each other, wherein the air pocket is formed along the joining surface of the joint.

Abstract: Disclosed is a susceptor for high-temperature use having a shaft with low thermal conductivity, wherein in a susceptor including a plate for wafer mounting and a shaft coupled to the plate, the plate and the shaft each include a sintered body having 90 wt % or more of an AlN phase, the sintered body of the plate is a magnesium-containing AlN sintered body having a volume resistance of 5*108 ?·cm or more at 650° C., and the sintered body of the shaft is an AlN sintered body having a room-temperature thermal conductivity of 100 W/mK or less.

Abstract: The present disclosure discloses a substrate heating apparatus for heating a substrate, wherein the substrate heating apparatus includes: a body including a substrate seating portion on which the substrate is seated, to support the substrate; a first heating element located in an inner region of the body; a second heating element located in an outer region surrounding the inner region; a third heating element configured to transmit current to the second heating element across the inner region of the body; and a connecting member electrically interconnecting the second heating element and the third heating element, wherein the connecting member is made of a molybdenum-tungsten alloy containing molybdenum and tungsten.