Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. Encoding and decoding of a target block are performed using intra-prediction. The intra-prediction is intra-prediction that uses bidirectional intra-prediction and a remaining mode. In bidirectional intra-prediction, a prediction value for a target pixel in the target block is determined based on reference pixels in two directions of bidirectional intra-prediction. In intra-prediction using a remaining mode, the remaining mode indicates remaining intra-prediction modes other than MPMs present in an MPM list.

Abstract: An image encoding/decoding method is disclosed. An image decoding method of the present invention may comprise identifying a region by partitioning an image, and determining a prediction mode of the region on the basis of at least one of a size of the region, a partition shape, and a coding parameter of the region. The determined prediction mode of the region may be determined as a prediction mode of all coding blocks included in the region.

Abstract: The present exemplary embodiments may provide a negative electrode material for a lithium secondary battery, the negative electrode material containing nano-silicon, crystalline carbon, amorphous carbon, and carbon nanotubes, wherein one end of the carbon nanotube is located inside the negative electrode material and the other end of the carbon nanotube protrudes out of the negative electrode material, and an average length of the carbon nanotubes protruding out of the negative electrode material is 0.1 ?m to 1 ?m.

Abstract: A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

Abstract: A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.