Patents by Inventor Jung-Dae KWON

Jung-Dae KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10527494
    Abstract: The present disclosure relates to a substrate with multiple nano-gaps and a manufacturing method therefor, and more particularly to a multiple nano-gaps substrate with high absorption and capable of using light sources in a wide range, and a manufacturing method therefor.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: January 7, 2020
    Assignee: Korea Intitute of Machinery & Materials
    Inventors: Sung Gyu Park, Jung Heum Yun, Dong Ho Kim, Byung Jin Cho, Jung Dae Kwon, Chae Won Mun
  • Publication number: 20180231418
    Abstract: The present disclosure relates to a substrate with multiple nano-gaps and a manufacturing method therefor, and more particularly to a multiple nano-gaps substrate with high absorption and capable of using light sources in a wide range, and a manufacturing method therefor.
    Type: Application
    Filed: September 24, 2015
    Publication date: August 16, 2018
    Applicant: Korea Institute of Machinery & Materials
    Inventors: Sung Gyu PARK, Jung-Heum YUN, Dong Ho KIM, Byung Jin CHO, Jung Dae KWON, Chae Won MUN
  • Patent number: 9725789
    Abstract: Provided are an apparatus for manufacturing a compound powder, a method of manufacturing an iron-boron compound powder by using the apparatus, a boron alloy powder mixture, a method of manufacturing the boron alloy powder mixture, a combined powder structure, a method of manufacturing the combined powder structure, a steel pipe, and a method of manufacturing the steel pipe The method of manufacturing the boron alloy powder mixture includes: preparing a mixed powder including a boron iron alloy powder and a target powder; heat-treating the mixed powder to boronize at least a portion of the target powder and de-boronize at least a portion of the boron iron alloy powder, thereby de-boronizing the boron iron alloy powder to reduce the melting point of the boron iron alloy powder.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: August 8, 2017
    Assignee: KMT CO., LTD.
    Inventors: Kee-Seok Nam, Jung-Dae Kwon, Jong-Joo Rha, Hee-Chan Ahn, Tae-Su Lim
  • Patent number: 9373484
    Abstract: A plasma generator according to an embodiment of the present invention is provided to generate a high density and stable plasma at near atmospheric pressure by preventing a transition of plasma to arc. The plasma generator includes a plate-shaped lower electrode for seating a substrate; and a cylindrical rotating electrode on the plate-shaped lower electrode, wherein the cylindrical rotating electrode includes an electrically conductive body that is connected to a power supply and includes a plurality of capillary units on an outer circumferential surface of the electrically conductive body; and an insulation shield layer that is made of an insulation material or a dielectric material, exposes a lower surface of the plurality of capillary units, and shields other parts.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: June 21, 2016
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Kee-Seok Nam, Jung-Dae Kwon, Yong Soo Jeong, Gun Hwan Lee, Jung Heum Yoon, Sung Hun Lee, Dong Ho Kim, Jae Wook Kang, Sung Gyu Park, Chang Su Kim
  • Publication number: 20140217881
    Abstract: A plasma generator according to an embodiment of the present invention is provided to generate a high density and stable plasma at near atmospheric pressure by preventing a transition of plasma to arc. The plasma generator includes a plate-shaped lower electrode for seating a substrate; and a cylindrical rotating electrode on the plate-shaped lower electrode, wherein the cylindrical rotating electrode includes an electrically conductive body that is connected to a power supply and includes a plurality of capillary units on an outer circumferential surface of the electrically conductive body; and an insulation shield layer that is made of an insulation material or a dielectric material, exposes a lower surface of the plurality of capillary units, and shields other parts.
    Type: Application
    Filed: August 10, 2012
    Publication date: August 7, 2014
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Kee-Seok Nam, Jung-Dae Kwon, Yong Soo Jeong, Gun Hwan Lee, Jung Heum Yoon, Sung Hun Lee, Dong Ho Kim, Jae Wook Kang, Sung Gyu Park, Chang Su Kim
  • Publication number: 20140096858
    Abstract: Provided are an apparatus for manufacturing a compound powder, a method of manufacturing an iron-boron compound powder by using the apparatus, a boron alloy powder mixture, a method of manufacturing the boron alloy powder mixture, a combined powder structure, a method of manufacturing the combined powder structure, a steel pipe, and a method of manufacturing the steel pipe The method of manufacturing the boron alloy powder mixture includes: preparing a mixed powder including a boron iron alloy powder and a target powder; heat-treating the mixed powder to boronize at least a portion of the target powder and de-boronize at least a portion of the boron iron alloy powder, thereby de-boronizing the boron iron alloy powder to reduce the melting point of the boron iron alloy powder.
    Type: Application
    Filed: June 8, 2012
    Publication date: April 10, 2014
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Kee-Seok Nam, Jung-Dae Kwon, Jong-Joo Rha, Hee-Chan Ahn, Tae-Su Lim
  • Publication number: 20140007933
    Abstract: Disclosed are a thin film solar cell and a method of manufacturing the thin film solar cell. The thin film solar cell according to an exemplary embodiment of the present invention thin film solar cell includes a substrate: a front electrode layer formed on the substrate; an oxide layer formed on the front electrode layer: a light absorbing layer (intrinsic layer) formed on the oxide layer; and a back electrode layer formed on the light absorbing layer, wherein the oxide layer is formed of a material selected from MoO2, WO2, V2O5, NiO and CrO3.
    Type: Application
    Filed: August 10, 2012
    Publication date: January 9, 2014
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Seoung Yoon RYU, Dong Ho KIM, Kee Seok NAM, Yong Soo JEONG, Jung Dae KWON, Sung Hun LEE, Jung Heum YUN, Gun Hwan LEE, Hyung Hwan JUNG, Sung Gyu PARK, Chang Su KIM, Jae Wook KANG, Keong Su LIM, Sang II PARK
  • Publication number: 20140011314
    Abstract: Disclosed are a thin film solar cell and a method of manufacturing the thin film solar cell. The thin film solar cell according to an exemplary embodiment of the present invention thin film solar cell includes a substrate: a front electrode layer formed on the substrate; an oxide layer formed on the front electrode layer: a light absorbing layer (intrinsic layer) formed on the oxide layer; and a back electrode layer formed on the light absorbing layer, wherein the oxide layer is formed of a material selected from MoO3, WO3, V2O5, NiO and CrO3.
    Type: Application
    Filed: August 9, 2013
    Publication date: January 9, 2014
    Applicant: Korea Institute of Machinery & Materials
    Inventors: Seoung Yoon Ryu, Dong Ho Kim, Kee Seok Nam, Yong Soo Jeong, Jung Dae Kwon, Sung Hun Lee, Jung Heum Yun, Gun Hwan Lee, Hyung Hwan Jung, Sung Gyu Park, Chang Su Kim, Jae Wook Kang, Koeng Su Lim, Sang Il Park
  • Publication number: 20120291275
    Abstract: Provided is a method of forming a metal interconnection line on a flexible substrate, wherein the method includes: coating a hard mask layer on at least one surface of the flexible substrate, followed by performing photolithography thereon to form a predetermined hard mask pattern; etching a portion of the flexible substrate by using the hard mask pattern as a mask to form a trench; plasma treating the inside of the trench by using a treatment gas for pre-treating the flexible substrate; coating a seed layer inside the trench; removing the hard mask pattern; and filling the inside of the trench coated with the seed layer with metal. A metal interconnection line formed by using the method may have a strong adhesion force with respect to the flexible substrate.
    Type: Application
    Filed: December 27, 2011
    Publication date: November 22, 2012
    Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Jong-Joo RHA, Kee-Seok NAM, Jung-Dae KWON, Kyu-Hwan LEE, Jong-Soo BAE, Joo-Yul LEE, Jong-Soo KO