Patents by Inventor Jung Do CHA

Jung Do CHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for analyzing network in cloud environment
    Patent number: 11882018
    Abstract: An apparatus for analyzing a network according to an embodiment includes a receiving module configured to receive, from a cloud service, information on one or more resources included in the cloud service and information on a network environment of the one or more resources, a topology generation module configured to derive a network topology of the cloud service by using the information on the resources and the information on the network environment, and an analysis module configured to derive, from the network topology, a communication possible path of each of the one or more resources and one or more communication allow policies in the communication possible path.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: January 23, 2024
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Jung Do Cha, Jung Hyun Ahn, Hyeong Jin Lee
  • APPARATUS AND METHOD FOR ANALYZING NETWORK IN CLOUD ENVIRONMENT
    Publication number: 20220141122
    Abstract: An apparatus for analyzing a network according to an embodiment includes a receiving module configured to receive, from a cloud service, information on one or more resources included in the cloud service and information on a network environment of the one or more resources, a topology generation module configured to derive a network topology of the cloud service by using the information on the resources and the information on the network environment, and an analysis module configured to derive, from the network topology, a communication possible path of each of the one or more resources and one or more communication allow policies in the communication possible path.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 5, 2022
    Inventors: Jung Do CHA, Jung Hyun AHN, Hyeong Jin LEE