Abstract: A bio sample collection device including: a housing; a cap part detachably fastened to the housing, and including a bio sample collector for collecting a bio sample; and a bio sample processing liquid storage unit storing bio sample processing liquid, the bio sample processing liquid storage unit being formed to be broken when the cap part is combined with the housing after bio sample is collected so that the bio sample processing liquid is mixed with the bio sample.

Abstract: Disclosed are an intraoral sensor and an X-ray imaging system. The intraoral sensor includes a sensor panel, a circuit unit, a memory, a battery, a casing, a first connector, and a power terminal. The X-ray imaging system includes a docking station with the intraoral sensor docked thereto, the docking station configured to provide a second connector connected to the first connector to perform at least one function of receiving the image signal stored in the memory, and charging the battery, or includes a transmission cable detachably connected to the intraoral sensor, and configured to provide a third connector connected to the first connector to transmit the image signal.

Abstract: A biological sample processing apparatus, including: a pipette block with which a plurality of pipettes for sucking or discharging a biological sample in a multi-well plate in which wells are arranged in a matrix shape along row and column directions are detachably coupled; a pipette block forward and backward transfer unit configured to move the pipette block along a forward and backward direction along a process direction; a pipette block top and bottom transfer unit configured to move the pipette block along a vertical direction; a magnetic field applying unit disposed below the multi-well plate for applying a magnetic field to a well of the multi-well plate; and a heating unit disposed below the multi-well plate so as to be spaced apart from the magnetic field applying unit, for heating a well of the multi-well plate.

Abstract: A bio sample collection device including: a housing; a cap part detachably fastened to the housing, and including a bio sample collector for collecting a bio sample; and a bio sample processing liquid storage unit storing bio sample processing liquid, the bio sample processing liquid storage unit being formed to be broken when the cap part is combined with the housing after bio sample is collected so that the bio sample processing liquid is mixed with the bio sample.

Abstract: A biological sample processing apparatus, including: a pipette block with which a plurality of pipettes for sucking or discharging a biological sample in a multi-well plate in which wells are arranged in a matrix shape along row and column directions are detachably coupled; a pipette block forward and backward transfer unit configured to move the pipette block along a forward and backward direction along a process direction; a pipette block top and bottom transfer unit configured to move the pipette block along a vertical direction; a magnetic field applying unit disposed below the multi-well plate for applying a magnetic field to a well of the multi-well plate; and a heating unit disposed below the multi-well plate so as to be spaced apart from the magnetic field applying unit, for heating a well of the multi-well plate.

Abstract: The present invention discloses a device for detecting x-rays inside the mouth, which can be conveniently moved inside the mouth, can increase user convenience, and has improved economic feasibility. The device for detecting x-rays inside the mouth according to the present invention comprises: a sensor unit having a sensor built therein for detecting x-rays; a hinge unit formed on one surface of the sensor unit; and a cable connecting unit including a pivoting connecting portion having an external cable coupled thereto and coupled to be pivotable to the hinge unit. An internal cable withdrawn from the sensor unit is electrically connected to the external cable through the inside of the cable connecting unit by means of the hinge unit and the pivoting connecting portion.

Abstract: Disclosed are an intraoral sensor and an X-ray imaging system. The intraoral sensor includes a sensor panel, a circuit unit, a memory, a battery, a casing, a first connector, and a power terminal. The X-ray imaging system includes a docking station with the intraoral sensor docked thereto, the docking station configured to provide a second connector connected to the first connector to perform at least one function of receiving the image signal stored in the memory, and charging the battery, or includes a transmission cable detachably connected to the intraoral sensor, and configured to provide a third connector connected to the first connector to transmit the image signal.

Abstract: The present invention discloses a device for detecting x-rays inside the mouth, which can be conveniently moved inside the mouth, can increase user convenience, and has improved economic feasibility. The device for detecting x-rays inside the mouth according to the present invention comprises: a sensor unit having a sensor built therein for detecting x-rays; a hinge unit formed on one surface of the sensor unit; and a cable connecting unit including a pivoting connecting portion having an external cable coupled thereto and coupled to be pivotable to the hinge unit. An internal cable withdrawn from the sensor unit is electrically connected to the external cable through the inside of the cable connecting unit by means of the hinge unit and the pivoting connecting portion.

Abstract: Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.

Abstract: A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.

Abstract: Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.

Abstract: A flip chip semiconductor device having an improved structure and a method of manufacturing the flip chip semiconductor device, in which a semiconductor chip can be more securely joined to a lead frame while preventing contact defects between the two. The flip chip semiconductor device includes: a semiconductor chip having electrode pads formed on one side; conductive bumps formed on the electrode pads of the semiconductor chip; and a lead frame including a plurality of leads, the ends of which are electrically connected to the conductive bumps, wherein each of the leads has at least one groove formed thereon, and a solder plating layer is provided on the leads in and about the groove and melted to secure the connection with the conductive bumps.