Abstract: The present invention relates to an allulose storage package for increasing storage stability of allulose syrup and a method for increasing the storage stability of allulose.

Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on the insulating layer; and a protective layer disposed on the insulating layer and the circuit pattern, and including first and second regions having different heights; wherein the circuit pattern includes: a first-first circuit pattern corresponding to the first region of the protective layer; and a first-second circuit pattern corresponding to the second region of the protective layer, wherein a height of the first region of the protective layer is lower than a height of the first-first circuit pattern, wherein a height of the second region of the protective layer is higher than a height of the first-second circuit pattern, wherein a surface of the first-first circuit pattern includes: a first portion in contact with the first region of the protective layer, and a second portion excluding the first portion, and wherein a surface roughness Ra of the first portion is different from a surface roughness Ra of t

Abstract: A circuit board according to an embodiment includes an insulating layer including first to third regions; an outer circuit pattern disposed on upper surfaces of the first to third regions of the insulating layer, and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer circuit pattern includes a first trace disposed on an upper surface of the first region of the insulating layer; a first pad disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace; and a height of the first trace is different from a height of the first pad.

Abstract: A circuit board according to an embodiment includes: an insulating layer including first to third regions; an outer layer circuit pattern disposed on an upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer layer circuit pattern includes: a first trace disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein a height of the first trace is different from a height of the second trace; and an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace.

Abstract: A circuit board according to an embodiment includes: an insulating layer including a first region and a second region; a plurality of outer layer circuit patterns disposed on upper surfaces of the first region and the second region of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer and a second part disposed on the second region of the insulating layer; wherein the first part includes an upper surface having a curved surface and exposes an upper surface of an outer layer circuit pattern disposed on the first region of the insulating layer, wherein the second part covers an upper surface of an outer layer circuit pattern disposed on the second region of the insulating layer, and wherein at least a part of the upper surface of the first part is positioned lower than the upper surface of the outer layer circuit pattern.

Abstract: A circuit board according to an embodiment comprises: an insulating layer including first to third regions; an outer layer circuit pattern disposed on the upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed in the first region of the insulating layer, a second part disposed in the second region, and a third part disposed in the third region, wherein the outer layer circuit pattern has a first height, the third part of the solder resist is disposed on the upper surface of the outer layer circuit pattern to have a second height, the first region includes a first sub-region and a second sub-region, the first part includes a first sub-part disposed in the first sub-region and a second sub-part disposed in the second sub-region, the upper surface of the first sub-part is located to be higher than the upper surface of the outer layer circuit pattern and lower than the upper surface of the third part, the upper surface of the second sub-part is loc

Abstract: A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective l

Abstract: A liquid lens includes a first plate in which a cavity accommodating a conductive liquid and a non-conductive liquid is formed; a first electrode disposed on the first plate; a second electrode disposed under the first plate; a second plate disposed on the first electrode; and a third plate disposed under the second electrode, wherein the conductive liquid includes a solvent comprising 20 to 60% by weight of water and 20 to 60% by weight of antifreeze; 10 to 20% by weight of a solute; and 0.4 to 2% by weight of a chelation agent or an ion inhibitor.

Abstract: A printed circuit board (PCB) device is provided, which includes a base board, a part, and a conductive elastic member configured to electrically connect the base board with the part. The conductive elastic member comprises a non-conductive body and at least one conductive interconnect port provided on the non-conductive body and configured to electrically connect an interconnect terminal of the base board with an interconnect terminal of the part.

Abstract: A mobile apparatus and control method thereof are provided, which includes an audio data signal input unit arranged to receive an audio data signal. An audio output unit is arranged to output an audio signal according to the received audio data signal within a first reproduction frequency. A balanced armature is arranged to output an audio signal according to the received audio data signal within a second reproduction frequency band. The second reproduction frequency band is different from the first reproduction frequency band. An audio signal processor is arranged to adjust the first reproduction frequency band and the second reproduction frequency band such that a combination of the first reproduction frequency band and the second reproduction frequency band is wider than the first reproduction frequency band and the second reproduction frequency band individually.

Abstract: A silicon carbide powder according to the embodiment includes nitrogen having a concentration in a range of about 100 ppm to about 5000 ppm. A method for manufacturing silicon carbide powder according to the embodiment includes preparing a mixture by mixing a silicon source including silicon with a solid carbon source or a carbon source including an organic carbon compound; heating the mixture; cooling the mixture; and supplying a nitrogen-based gas into the mixture.

Abstract: A speaker device and an electronic device including the speaker device. The speaker device includes a speaker body, which includes a front surface, a rear surface, and a side surface provided between the front surface and the rear surface, and a sealing member provided to enclose at least the side surface of the speaker body, in which the sealing member isolates sound output through the front surface of the speaker body and sound output through the rear surface of the speaker body from each other. The speaker device and the electronic device including the same may be implemented variously according to an embodiment.

Abstract: A vacuum heat treatment apparatus according to the embodiment comprises a chamber; a thermal insulator in the chamber; a reaction container in the thermal insulator; a heating member between the reaction container and the the thermal insulator for heating the reaction container; and a temperature measuring member in or on a surface of the reaction container, wherein the temperature measuring member comprises a thermocouple and a protective tube surrounding the thermocouple, and the protective tube comprises tungsten (W), tantalum (Ta), or silicon carbide (SiC).

Abstract: A method for manufacturing a silicon carbide powder according to the embodiment includes forming a mixture by mixing a silicon (Si) source containing silicon with a solid carbon (C) source or a C source containing an organic carbon compound; heating the mixture; cooling the mixture; and supplying hydrogen gas into the mixture.

Abstract: A mobile apparatus and control method thereof are provided, which includes an audio data signal input unit arranged to receive an audio data signal. An audio output unit is arranged to output an audio signal according to the received audio data signal within a first reproduction frequency. A balanced armature is arranged to output an audio signal according to the received audio data signal within a second reproduction frequency band. The second reproduction frequency band is different from the first reproduction frequency band. An audio signal processor is arranged to adjust the first reproduction frequency band and the second reproduction frequency band such that a combination of the first reproduction frequency band and the second reproduction frequency band is wider than the first reproduction frequency band and the second reproduction frequency band individually.

Abstract: Disclosed are silicon carbide powders and a method of preparing the same. The method includes forming a mixture by mixing a silicon (Si) source, a carbon (C) source, and a silicon carbide (SiC) seed, and reacting the mixture. The silicon carbide (SiC) powders include silicon carbide (SiC) grains having a ?-type crystal phase and a grain size in a range of about 5 ?m to about 100 ?m.

Abstract: A mobile apparatus and control method thereof are provided, which includes an audio data signal input unit arranged to receive an audio data signal. An audio output unit is arranged to output an audio signal according to the received audio data signal within a first reproduction frequency. A balanced armature is arranged to output an audio signal according to the received audio data signal within a second reproduction frequency band. The second reproduction frequency band is different from the first reproduction frequency band. An audio signal processor is arranged to adjust the first reproduction frequency band and the second reproduction frequency band such that a combination of the first reproduction frequency band and the second reproduction frequency band is wider than the first reproduction frequency band and the second reproduction frequency band individually.

Abstract: A silicon carbide powder includes at least one group selected from a first group comprising an alpha phase silicon carbide pulverulent body of which a granule size (D50) is greater than 0 ?m and less than 45 ?m with impurities less than 10 ppm, a second group comprising an alpha phase silicon carbide pulverulent body of which a granule size is greater than 45 ?m and less than 75 ?m with impurities less than 10 ppm, and a third group comprising an alpha phase silicon carbide pulverulent body of which a granule size is greater than 75 ?m and less than 110 ?m with impurities less than 10 ppm. In addition, a method for preparing a silicon carbide powder includes adding seeds to a beta silicon carbide powder, and forming an alpha silicon carbide powder by heat treating the beta silicon carbide powder.

Abstract: A method of fabricating silicon carbide powder according to the embodiment comprises the steps of preparing a mixture by mixing a silicon source comprising silicon, a silicon carbide source and a carbone source comprising at least one of a solid carbon and a organic compound; and reacting the mixture.

Abstract: A method of fabricating silicon carbide powder according to the embodiment comprises the steps of preparing a mixture by mixing a silicon source comprising silicon with a carbon source comprising a solid carbon source or an organic carbon compound; reacting the mixture; and controlling the reacting of the mixture, wherein the step of controlling the reacting comprises a step of supplying process gas or reaction product gas.