Patents by Inventor Jung Fong Huang

Jung Fong Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7316266
    Abstract: A liquid-cooled pipe for use in a liquid-cooled heat sink kit is disclosed to include a pipe body, which has a close end, an open end, an axial passage extending from the close end to the open end, and a longitudinal series of through holes in the peripheral wall, a plurality of partition members respectively inserted into the axial passage of the pipe body connected in series with the partition plate of one partition member stopped against the legs of next such that each two adjacent partition members define with the pipe body a respective small chamber in fluid communication with two through holes of the pipe body, and an end cover plate fixedly fastened to the pipe body to seal the open end.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: January 8, 2008
    Assignee: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang
  • Patent number: 7278467
    Abstract: A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, each liquid-cooled heat pipes having two close ends and a plurality of enclosed chambers spaced between the two close ends, and a plurality of straight flow-guide pipes respectively fastened to the grooves at the bottom side of the heat radiator and connected between the two liquid-cooled heat pipes to form with the enclosed chambers of the liquid-cooled heat pipes a detoured flow passage for the passing of a cooling fluid in one direction.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: October 9, 2007
    Assignee: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang
  • Patent number: 7273092
    Abstract: A modularized cooler includes the at least two heat radiator modules arranged in a stack, each heat radiator module having a set of radiation fins, heat-exchange tubes arranged in parallel and surrounded by the radiation fins, two locating plates holding the heat-exchange tubes in place, and a plurality of first bends and second bends respectively connected between every two adjacent heat-exchange tubes at two sides of the radiation fins and forming with the heat-exchange tubes a continuously S-shaped piping having an inlet and an outlet, and at least one connecting tubes that connect the S-shaped pipings of the heat radiator modules in series.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: September 25, 2007
    Assignee: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang
  • Patent number: 7147042
    Abstract: An improved heat collector in a fluid-cooling system for a computer includes a case, and a cooling plate. The case comprises a water inlet, a water outlet, a top surface, and a bottom surface, wherein the bottom surface is a heat collecting face. The cooling plate is firmly connected to the top surface of the case, the cooling plate further comprising a plurality of cooling fins protruded upwards. A natural airflow can be formed among the cooling fins of the heat collector; therefore the heat collector can also radiate heat to air to improve the cooling efficiency.
    Type: Grant
    Filed: March 25, 2005
    Date of Patent: December 12, 2006
    Assignee: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang
  • Publication number: 20060108105
    Abstract: A modularized cooler includes the at least two heat radiator modules arranged in a stack, each heat radiator module having a set of radiation fins, heat-exchange tubes arranged in parallel and surrounded by the radiation fins, two locating plates holding the heat-exchange tubes in place, and a plurality of first bends and second bends respectively connected between every two adjacent heat-exchange tubes at two sides of the radiation fins and forming with the heat-exchange tubes a continuously S-shaped piping having an inlet and an outlet, and at least one connecting tubes that connect the S-shaped pipings of the heat radiator modules in series.
    Type: Application
    Filed: March 25, 2005
    Publication date: May 25, 2006
    Applicant: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang
  • Publication number: 20060108099
    Abstract: A liquid-cooled pipe for use in a liquid-cooled heat sink kit is disclosed to include a pipe body, which has a close end, an open end, an axial passage extending from the close end to the open end, and a longitudinal series of through holes in the peripheral wall, a plurality of partition members respectively inserted into the axial passage of the pipe body connected in series with the partition plate of one partition member stopped against the legs of next such that each two adjacent partition members define with the pipe body a respective small chamber in fluid communication with two through holes of the pipe body, and an end cover plate fixedly fastened to the pipe body to seal the open end.
    Type: Application
    Filed: March 25, 2005
    Publication date: May 25, 2006
    Applicant: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang
  • Patent number: 7047759
    Abstract: A liquid cooling system is disclosed to include a first cooler module, a second cooler module, a connecting tube connected between the vertically arranged coiled tube of the first cooler module and the vertically arranged coiled tube of the second cooler module, a working liquid passing through the coiled tubes of the two cooler modules, and an electric fan set in between the two cooler modules to suck air into the first cooler module and to blow air into the second cooler module, enhancing the heat dissipation effect.
    Type: Grant
    Filed: August 2, 2005
    Date of Patent: May 23, 2006
    Assignee: Forward Electronics Co., Ltd.
    Inventors: Jung Fong Huang, Chih Chien Huang
  • Publication number: 20060090883
    Abstract: A liquid-cooled heat radiator kit is disclosed to include a heat radiator, which has radiation elements at the top wall and parallel grooves at the bottom wall, two liquid-cooled heat pipes bilaterally arranged in parallel at the bottom side of the heat radiator, each liquid-cooled heat pipes having two close ends and a plurality of enclosed chambers spaced between the two close ends, and a plurality of straight flow-guide pipes respectively fastened to the grooves at the bottom side of the heat radiator and connected between the two liquid-cooled heat pipes to form with the enclosed chambers of the liquid-cooled heat pipes a detoured flow passage for the passing of a cooling fluid in one direction.
    Type: Application
    Filed: March 25, 2005
    Publication date: May 4, 2006
    Applicant: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang
  • Publication number: 20060076122
    Abstract: A improved heat collector in a fluid-cooling system for a computer includes a case, and a cooling plate. The case comprises a water inlet, a water outlet, a top surface, and a bottom surface, wherein the bottom surface is a heat collecting face. The cooling plate firmly connected to the top surface of the case, the cooling plate further comprising a plurality of cooling fins protruded upwards. A nature airflow can be formed among the cooling fins of the heat collector; therefore the heat collector can also radiate heat to air to improve the cooling efficiency.
    Type: Application
    Filed: March 25, 2005
    Publication date: April 13, 2006
    Applicant: Forward Electronics Co., Ltd.
    Inventors: Jung-Fong Huang, Chih-Chien Huang