Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, a third bonding pad structure, a first internal bonding wire, and a second internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The third bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the third bonding pad structure via the first internal bonding wire. The third bonding pad structure is electrically coupled to the second bonding pad structure via the second internal bonding wire.

Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, a third bonding pad structure, a first internal bonding wire, and a second internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The third bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the third bonding pad structure via the first internal bonding wire. The third bonding pad structure is electrically coupled to the second bonding pad structure via the second internal bonding wire.

Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, and an internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the second bonding pad structure via the internal bonding wire. The integrated circuit device having a better electrical performance is provided by eliminating internal resistance drop in power supply trails or ground trails, and improving signal integrity of the integrated circuit device.

Abstract: A module structure of touch display panel is provided. The module structure comprises a backlight module, a liquid crystal panel, a touch layer, a first circuit board, a second circuit board, and a protection layer. The liquid crystal panel is disposed above the backlight module; the touch layer is disposed on the liquid crystal panel. The first circuit board is disposed on the liquid crystal panel, and is further disposed with a first side of the liquid crystal panel and a first side of the touch layer. The second circuit board is disposed on the liquid crystal panel, and is further disposed with a second side of the liquid crystal panel and a second side of the touch layer. Additionally, the protection layer is disposed above the touch layer, the first circuit board, and the second circuit board.

Abstract: A module structure of touch display panel is provided. The module structure comprises a backlight module, a liquid crystal panel, a touch layer, a first circuit board, a second circuit board, and a protection layer. The liquid crystal panel is disposed above the backlight module; the touch layer is disposed on the liquid crystal panel. The first circuit board is disposed on the liquid crystal panel, and is further disposed with a first side of the liquid crystal panel and a first side of the touch layer. The second circuit board is disposed on the liquid crystal panel, and is further disposed with a second side of the liquid crystal panel and a second side of the touch layer. Additionally, the protection layer is disposed above the touch layer, the first circuit board, and the second circuit board.

Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, and an internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the second bonding pad structure via the internal bonding wire. The integrated circuit device having a better electrical performance is provided by eliminating internal resistance drop in power supply trails or ground trails, and improving signal integrity of the integrated circuit device.

Abstract: A video decoding apparatus capable of controlling presentation of sub-pictures includes a first decoder, a second decoder, a first scaler, a second scaler and a combiner. The first decoder and the second decoder respectively decode a digital audio/video signal to generate a decoded video and a decoded sub-picture. In accordance with an output picture size, the decoded video size, the decoded sub-picture size and a sub-picture aspect ratio, the first scaler and the second scaler generate a first scaling factor and a second scaling factor. The combiner combines the decoded video and the decoded sub-picture according to the first scaling factor and the second scaling factor and outputs the combination thereof. A video decoding method and a digital audio/video playback system capable of controlling presentation of sub-pictures are also disclosed.

Abstract: A video decoding apparatus capable of controlling presentation of sub-pictures includes a first decoder, a second decoder, a first scaler, a second scaler and a combiner. The first decoder and the second decoder respectively decode a digital audio/video signal to generate a decoded video and a decoded sub-picture. In accordance with an output picture size, the decoded video size, the decoded sub-picture size and a sub-picture aspect ratio, the first scaler and the second scaler generate a first scaling factor and a second scaling factor. The combiner combines the decoded video and the decoded sub-picture according to the first scaling factor and the second scaling factor and outputs the combination thereof. A video decoding method and a digital audio/video playback system capable of controlling presentation of sub-pictures are also disclosed.

Abstract: An apparatus and method for video decoding decodes a coded video bitstream with a smaller buffer to reconstruct a sequence and outputs it for reducing cost. The apparatus comprises a decoding component, a strip buffer and an outputting component. The decoding component receives the coded video bitstream and decodes it to reconstruct a decoded picture of the sequence. The strip buffer stores a fraction of the decoded picture. The outputting component reads the strip buffer and outputs the fraction of the decoded picture sequentially.

Abstract: A video decoding apparatus capable of controlling presentation of sub-pictures includes a first decoder, a second decoder, a first scaler, a second scaler and a combiner. The first decoder and the second decoder respectively decode a digital audio/video signal to generate a decoded video and a decoded sub-picture. In accordance with an output picture size, the decoded video size, the decoded sub-picture size and a sub-picture aspect ratio, the first scaler and the second scaler generate a first scaling factor and a second scaling factor. The combiner combines the decoded video and the decoded sub-picture according to the first scaling factor and the second scaling factor and outputs the combination thereof. A video decoding method and a digital audio/video playback system capable of controlling presentation of sub-pictures are also disclosed.

Abstract: A video decoding apparatus capable of controlling presentation of sub-pictures includes a first decoder, a second decoder, a first scaler, a second scaler and a combiner. The first decoder and the second decoder respectively decode a digital audio/video signal to generate a decoded video and a decoded sub-picture. In accordance with an output picture size, the decoded video size, the decoded sub-picture size and a sub-picture aspect ratio, the first scaler and the second scaler generate a first scaling factor and a second scaling factor. The combiner combines the decoded video and the decoded sub-picture according to the first scaling factor and the second scaling factor and outputs the combination thereof. A video decoding method and a digital audio/video playback system capable of controlling presentation of sub-pictures are also disclosed.