Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A wafer probe card has an adapter module and a probe module detachably mounted together. The adapter module has a holding member and an interposer mounted within the holding plate. The probe module has a frame assembly and a space transformer and a probe assembly mounted within the frame assembly. A fixing plate is mounted on the holding member of the adapter module to constitute an electrical connection among the interposer, space transformer and probe assembly. When any element of the wafer probe card is faulty, the adapter module or the probe module is detached and the faulty element is replaced. The adapter module or the probe module with the replaced element is then reassembled. Alternatively, the adapter module or the probe module can be replaced on a modular basis. Accordingly, it is not necessary that all components be detached entirely, thereby improving the operational speed and efficiency.

Abstract: A wafer probe card has an adapter module and a probe module detachably mounted together. The adapter module has a holding member and an interposer mounted within the holding plate. The probe module has a frame assembly and a space transformer and a probe assembly mounted within the frame assembly. A fixing plate is mounted on the holding member of the adapter module to constitute an electrical connection among the interposer, space transformer and probe assembly. When any element of the wafer probe card is faulty, the adapter module or the probe module is detached and the faulty element is replaced. The adapter module or the probe module with the replaced element is then reassembled. Alternatively, the adapter module or the probe module can be replaced on a modular basis. Accordingly, all components are unnecessarily to be detached entirely, thereby improving the operational speed and efficiency.