Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method for manufacturing a semiconductor structure is provided. The method includes: providing a substrate and a dielectric layer on the substrate; forming a hole in the dielectric layer; forming an initial barrier material layer and a conductive layer on an upper surface of the dielectric layer and in the hole; removing part of the initial barrier material layer and part of the conductive layer to form a barrier material layer and a via element in the hole respectively and expose the upper surface of the dielectric layer. An upper surface of the barrier material layer is higher than the upper surface of the dielectric layer.

Abstract: Disclosed are various embodiments of a navigation input device, and methods, systems and components corresponding thereto. According to some embodiments, the navigation input device has a large depth of field associated therewith and employs time- and/or frequency-domain processing algorithms and techniques. The device is capable of providing accurate and reliable information regarding the (X,Y) position of the device on a navigation surface as it is moved laterally thereatop and thereacross, notwithstanding changes in a vertical position of the device that occur during navigation and that do not exceed the depth of field of an imaging lens incorporated therein. According to one embodiment, the navigation input device is a writing instrument that does not require the use of an underlying touch screen, touch pad or active backplane to accurately and reliably record successive (X,Y) positions of the writing device as it is moved across and atop an underlying writing medium.