Abstract: A defect-reducing coating method is disclosed, which is characterized by making the coating surface of a sample face the bottom of the coating chamber, so that the sticking particles on side walls of the coating chamber will not fall on the coating surface of the sample during the coating process, thereby a smooth coating layer can be formed on the coating surface of the sample after the coating process is finished.

Abstract: A heating sticker includes a protective layer, a thermogenic layer, an electrode layer, a cover layer and an adhesive layer, which are superposed in order. The thermogenic layer is a conductive film with transparent carbon nanobuds and defined with a heating area and a non-heating area. The heating area is disposed with insulative grooves. The non-heating area is distributed with micro blocks which are arranged insulatively. The electrode layer has a conductive wire and a ground wire. The conductive wire surrounds the heating area in a non-closed shape. The ground wire is located between the front end and the rear end of the conductive wire and connected to a periphery of the heating area. Conductivity of each of the conductive wire and the ground wire is higher than conductivity of the thermogenic layer. An outer surface of the cover layer is a modified surface which is treated with plasma.

Abstract: The method includes the steps of: a) dividing a large-scale touch sensing pattern to be manufactured into multiple divisional patterns and producing multiple photomasks corresponding to the multiple divisional patterns; b) providing a substrate with a conductive layer; c) disposing a photoresist layer on the conductive layer; d) a first exposure process: forming an exposing divisional pattern and multiple first targets the photoresist layer; e) an adjacent exposure process: forming an adjacent exposing divisional pattern and multiple second targets, and adjacently connecting the adjacent exposing divisional pattern and the exposing divisional pattern originally on the photoresist layer; f) repeating the adjacent exposure process to form multiple adjacent exposing divisional patterns until a complete exposing pattern has been assembled; g) performing a developing process to the photoresist layer; and h) etching the conductive layer to form the large-scale touch sensing pattern on the conductive layer.