Patents by Inventor Jung Hee KI

Jung Hee KI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200407506
    Abstract: Embodiments relate to a polyamide-imide film that maintains its mechanical properties at least at a certain level under the conditions of high temperatures and low temperatures and is excellent in transparency and folding characteristics, a process for preparing the same, and a cover window comprising the same. The polyamide-imide film comprises a polyamide-imide polymer and has an MOR value defined in Equation 1a of 75% or more.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Han Jun KIM, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Sang Hun CHOI, Jung Hee KI, Dong Jin LIM
  • Publication number: 20200407520
    Abstract: The embodiments relate to a polyimide-based film, which comprises a first side and a second side opposite to the first side, wherein the modulus asymmetry (MA) according to Equation 1 is 0.03 to 0.2, a process for preparing the same, and a display device comprising the same.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Dae Seong OH, Jung Hee KI, Sunhwan KIM, Han Jun KIM, Jin Woo LEE, Dong Jin LIM, Dawoo JEONG
  • Publication number: 20200407521
    Abstract: Embodiments relate to a polyamide-imide film that has a clean appearance and transparency and is excellent in antiblocking properties, a process for preparing the same, and a display front panel and a display device comprising the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound; and a filler, wherein the dicarbonyl compound comprises a first dicarbonyl compound and a second dicarbonyl compound, the first dicarbonyl compound and the second dicarbonyl compound are structural isomers to each other, and the FH value of Equation 1 is 0.5 or less.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Dae Seong OH, Jung Hee KI, Sunhwan KIM, Han Jun KIM, Jin Woo LEE, Sang Hun CHOI
  • Publication number: 20200407507
    Abstract: Embodiments relate to a polymer film for a display that maintains a clean appearance and transparency and is excellent in antiblocking properties by securing a certain range of optical slip index (OS), a process for preparing the same, and a front panel and a display device comprising the same. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and a filler and has an optical slip index (0.5) of less than 0.5.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Dae Seong OH, Sunhwan KIM, Han Jun KIM, Jin Woo LEE, Sang Hun CHOI, Jung Hee KI
  • Publication number: 20200407519
    Abstract: The polymer film according to an embodiment comprises at least one polymer resin selected from the group consisting of a polyamide-based resin, a polyimide-based resin, and a polyamide-imide-based resin, and has a haze of 0.6% or less and an in-plane retardation within a specific range for each wavelength band in the visible light region. The polymer film, which has an in-plane retardation within a specific range for each wavelength band in the visible light region, is excellent in transparency and optical properties, and it can remarkably reduce the rainbow phenomenon and improve the reflection appearance.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Jung Hee KI, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Sang Hun CHOI, Han Jun KIM, Heung Sik KIM
  • Publication number: 20200075194
    Abstract: A cable includes an insulating part and one or more conducting parts disposed inside the insulating part. The insulating part includes a polymer resin layer with a product of shrinkage ratios CMD*TD, which is expressed as a product of a longitudinal shrinkage ratio and a transverse shrinkage ratio, of less than 0.24.
    Type: Application
    Filed: May 2, 2019
    Publication date: March 5, 2020
    Applicant: SKC Co., Ltd.
    Inventors: Sechul LEE, Young Min HEO, Jung Hee KI, Sang Min CHOI